Renesas 71V35761SA166BQGI8
- Part No.:
- 71V35761SA166BQGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V35761SA166BQGI8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V35761SA166BQGI8 from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 166MHz (3.5ns clock access time), supports linear/interleaved burst modes via LBO input, and features JTAG boundary scan (IEEE 1149.1) for testability in high-reliability embedded systems.
For engineers reviewing the 71V35761SA166BQGI8 datasheet, 71V35761SA166BQGI8 pinout, 71V35761SA166BQGI8 application, or 71V35761SA166BQGI8 equivalent, this device delivers deterministic low-latency memory access for cache-coherent subsystems, network packet buffers, and real-time DSP data paths requiring burst-aligned, pipelined read/write cycles and industrial-temperature operation.
Technical Context
This SRAM implements a synchronous, clock-driven architecture with registered address, data, and control inputs-triggered on the rising edge of CLK. Its internal burst counter generates four sequential addresses per initial address, with order determined by LBO state and ADV timing.
The device integrates self-timed write logic gated by GW, BWE, and BW1–BW4, enabling byte-selectable or global writes. Pipelined output registers deliver first-data-on-next-clock-edge timing, while ZZ enables asynchronous sleep mode with guaranteed data retention and <35mA IZZ current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36 bits = 4.608 Mbit; supports 36-bit parallel data bus with 4 × 9-bit byte lanes (I/O0–I/O31 + I/OP1–I/OP4) |
| Clock Frequency / Access Time | 166 MHz max (tCYC = 6 ns); tCD = 3.5 ns - defines minimum clock-to-valid-data delay for pipelined reads |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains enable I/O voltage stability during core switching |
| Burst Mode Control | LBO pin selects linear or interleaved 4-word burst sequence; ADV advances counter synchronously; burst wraps on completion |
| Power Management | ZZ input enables full sleep mode (IZZ ≤ 35 mA); ISB1 standby current ≤ 35 mA; supports industrial temp range (–40°C to +85°C) |
| JTAG Interface | IEEE 1149.1-compliant boundary scan (TMS/TDI/TCK/TRST/TDO); TRST optional; available only in BGA packages (including BQG165) |
| Package & Pin Count | 165-ball fine-pitch BGA (BQG165); JEDEC-standard footprint; includes dedicated VDDQ/VSS pairs for signal integrity |
Pinout & Package
71V35761SA166BQGI8 is packaged in a 165-ball fine-pitch ball grid array (BQG165), compliant with JEDEC MO-245. The package provides 36 I/O pins (I/O0–I/O31, I/OP1–I/OP4), dual power domains (VDD core, VDDQ I/O), and dedicated JTAG signals (TMS, TDI, TCK, TDO, TRST).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; A0–A1 used by internal burst counter for 4-word sequence generation |
| CLK | Clock Input | Rising-edge-triggered master clock; all register transfers (address/data/control) synchronized to this edge |
| ADV | Burst Address Advance | Active-Low synchronous signal that increments internal burst counter; HIGH suspends burst progression |
| LBO | Linear/Interleaved Burst Order | Asynchronous static select: LOW = linear burst (00→01→10→11), HIGH = interleaved burst (00→01→11→10) |
| GW / BWE / BW1–BW4 | Write Control Inputs | GW enables global 36-bit write; BWE gates byte enables; BW1–BW4 select 9-bit bytes (BW1: I/O0–7+I/OP1, etc.) |
| ZZ | Sleep Mode Enable | Asynchronous HIGH activates full sleep; gates internal clock, reduces supply current to ≤35 mA, retains data |
| TMS–TDO | JTAG Boundary Scan | IEEE 1149.1 TAP controller interface; enables structural testing and debug without intrusive probing |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Output Architecture | First output data appears one clock cycle after address latch; enables deterministic timing for high-speed bus interfacing |
| Single-Cycle Deselect | Chip deactivation completes within one CLK cycle-eliminates bus contention windows during rapid chip-select switching |
| Self-Timed Write Cycle | Internal write timing resolves independently of external setup/hold margins; simplifies PCB layout and timing closure |
| Byte-Selectable Write Capability | Four independent 9-bit byte lanes allow partial writes without read-modify-write overhead-critical for protocol header updates |
| Industrial Temperature Support | Rated for –40°C to +85°C operation with validated AC/DC parameters-suitable for base station, avionics, and transportation systems |
| JTAG Boundary Scan (IEEE 1149.1) | Full scan chain support for interconnect test and in-system validation-reduces test development time and field failure diagnostics |
Applications
| Network Packet Buffering | Real-Time DSP Data Exchange |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency shared memory buffer between MAC and switch fabric; burst reads align with 64-byte cache lines. Use Value: 166MHz pipelined reads deliver 5.95 Gbps sustained throughput; single-cycle deselect prevents pipeline stalls during context switching. |
Use Scenario: Interfacing multi-core DSPs with shared coefficient and sample buffers in radar beamforming systems. IC Role / Device Role / Timing Role: Synchronous SRAM acting as dual-port-accessible scratchpad; LBO-configurable burst order matches FFT twiddle factor access patterns. Use Value: Linear burst mode (LBO=LOW) provides sequential 36-bit word access matching radix-4 FFT addressing; 3.5ns tCD ensures deterministic sample latency. |
| Cache-Coherent Subsystem Memory | Industrial Motion Controller Buffer |
|
Use Scenario: Serving as L2 cache tag RAM or directory memory in multi-processor SoCs with cache coherency protocols. IC Role / Device Role / Timing Role: Deterministic-access memory for snoop response arbitration; ADSP/ADSC inputs interface directly with cache controller status signals. Use Value: ADSP/ADSC dual-address-status inputs eliminate glue logic; burst counter handles cache line fills with zero software overhead. |
Use Scenario: Holding real-time position setpoints and encoder feedback in servo drives operating in harsh factory environments. IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing nonvolatile-retained buffering between FPGA motion sequencer and analog output stage. Use Value: ZZ sleep mode reduces power during idle periods without losing setpoint data; –40°C to +85°C rating ensures reliability near motors and power electronics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-166BZXI | 128K × 36, 166MHz, 3.3V; no JTAG; TQFP-only; higher ISB1 (45 mA) | Lacks IEEE 1149.1 test interface; limited to commercial temp (0°C to +70°C) | Choose when JTAG is unnecessary and cost-sensitive TQFP packaging suffices. |
| AS7C33128P-166BIN | 128K × 36, 166MHz, 3.3V; no burst counter; asynchronous OE; no ZZ sleep | No pipelined outputs or burst addressing-requires external logic for cache-line fills | Choose only for legacy designs where burst functionality is unused and lowest BOM cost is critical. |
Compared with CY7C1362BV33-166BZXI and AS7C33128P-166BIN, the 71V35761SA166BQGI8 uniquely combines JTAG testability, industrial temperature support, pipelined burst reads, and hardware-managed sleep mode-enabling higher system integration and reduced test infrastructure cost in mission-critical embedded platforms.
Availability
71V35761SA166BQGI8 is available at Aetrix Electronics and suitable for network infrastructure, real-time DSP subsystems, and industrial motion control applications requiring stable component supply, long-term lifecycle assurance, and guaranteed industrial-temperature performance.
Supply support for 71V35761SA166BQGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications, computing, and industrial markets.
The 71V35761SA166BQGI8 belongs to IDT's high-speed synchronous SRAM product line, engineered for deterministic, low-latency memory access in cache-coherent subsystems and packet-processing pipelines.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V35761SA166BQGI8?
The 71V35761SA166BQGI8 is rated for 166 MHz operation with a clock cycle time (tCYC) of 6 ns and a clock-to-data valid delay (tCD) of 3.5 ns. This specification applies across the industrial temperature range (–40°C to +85°C) and is guaranteed under VDD = 3.3 V ±5% and VDDQ = 3.3 V ±5% conditions.
Does the 71V35761SA166BQGI8 support both linear and interleaved burst modes, and how is selection implemented?
Yes, the 71V35761SA166BQGI8 supports both linear and interleaved 4-word burst sequences. Selection is controlled by the LBO (Linear Burst Order) input: LBO = LOW configures linear order (00→01→10→11), while LBO = HIGH selects interleaved order (00→01→11→10). LBO is asynchronous and must remain static during burst operation.
What power-saving features does the 71V35761SA166BQGI8 provide, and how is sleep mode activated?
The 71V35761SA166BQGI8 implements asynchronous sleep mode via the ZZ input. Driving ZZ HIGH disables the internal clock and reduces supply current to ≤35 mA (IZZ) while guaranteeing data retention. Recovery requires tZZR ≥ 100 ns after ZZ returns LOW before valid operations resume.
Is JTAG boundary scan supported on the 71V35761SA166BQGI8, and which package types include it?
Yes, the 71V35761SA166BQGI8 includes IEEE 1149.1-compliant JTAG boundary scan. It is available only in BGA packages-including the 165-ball fine-pitch BGA (BQG165) used by the 71V35761SA166BQGI8-and not offered in TQFP variants. TRST is optional and internally pulled up.
How many byte-write enable signals does the 71V35761SA166BQGI8 support, and what data width does each control?
The 71V35761SA166BQGI8 supports four independent byte-write enable signals: BW1, BW2, BW3, and BW4. Each controls a 9-bit segment: BW1 → I/O0–I/O7 + I/OP1; BW2 → I/O8–I/O15 + I/OP2; BW3 → I/O16–I/O23 + I/OP3; BW4 → I/O24–I/O31 + I/OP4. BWE must be LOW to activate them.
71V35761SA166BQGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 166 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V35761SA166BQGI8 FAQ
1.How can I place an order for 71V35761SA166BQGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V35761SA166BQGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V35761SA166BQGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V35761SA166BQGI8 is usually 5 days.
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For technical support, including 71V35761SA166BQGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V35761SA166BQGI8 requirements.
6.How does Aetrix verify that 71V35761SA166BQGI8 is sourced from the original manufacturer or authorized distributors?
All 71V35761SA166BQGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V35761SA166BQGI8 meets industry standards.
7.What is the process for return or replacement of 71V35761SA166BQGI8?
All 71V35761SA166BQGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V35761SA166BQGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V35761SA166BQGI8 part is unused and in its original packaging.
Return procedure for 71V35761SA166BQGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V35761SA166BQGI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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Microchip Technology

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93LC46BT-I/OT
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AT24C08C-STUM-T
Microchip Technology
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