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Renesas 71V35761SA183BGGI

Part No.:
71V35761SA183BGGI
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V35761SA183BGGI.pdf
Description:
IC SRAM 4.5MBIT PAR 119PBGA
Quantity:
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Payment
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Shipping

Inventory:3,687

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Product details

Overview

71V35761SA183BGGI from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 183MHz (3.3ns clock access time), supports linear/interleaved burst modes via LBO input, and features JTAG boundary scan (IEEE 1149.1) for testability in high-reliability embedded systems.

For engineers reviewing the 71V35761SA183BGGI datasheet, 71V35761SA183BGGI pinout, 71V35761SA183BGGI application, or 71V35761SA183BGGI equivalent, this device delivers deterministic low-latency memory access for cache-coherent subsystems, network packet buffers, and real-time DSP data paths requiring burst-aligned, pipelined read/write cycles with industrial temperature support.

Technical Context

The 71V35761SA183BGGI implements a synchronous dual-register architecture: address, data, and control signals are registered on the rising edge of CLK, enabling precise timing control. Its internal burst counter generates four sequential addresses per initial address, with order determined by LBO state (linear or interleaved).

Burst operation is initiated by ADV=LOW and sustained across four clock edges; pipelined output delivers first data one cycle after address latch, with subsequent outputs aligned to successive CLK edges. Sleep mode is entered asynchronously via ZZ=HIGH, reducing supply current to ≤35mA while retaining data.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit = 4.608 Mbit; supports byte-selectable writes across four 9-bit data groups (BW1–BW4)
Clock Frequency / Access Time183 MHz / 3.3 ns; enables 183 million burst-aligned read/write operations per second in industrial temperature range
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate power domains allow I/O voltage stability during core switching
Burst Mode ControlLBO pin selects linear or interleaved 4-word burst sequence; static configuration required before operation
Power ManagementZZ input enables full sleep mode (IZZ ≤35 mA); ISB2 = 110–130 mA with clock running but deselected
JTAG SupportIEEE 1149.1-compliant boundary scan (TMS/TDI/TCK/TRST/TDO); TRST optional, internal pull-up on all JTAG pins
Operating Temperature–40°C to +85°C (industrial grade); validated across full voltage and frequency range

Pinout & Package

71V35761SA183BGGI is packaged in a 119-ball fine-pitch BGA (BGG119), JEDEC-standard footprint measuring 12 mm × 12 mm with 0.8 mm ball pitch. Pinout conforms to BG119 layout with dedicated VDDQ/VSS pairs for I/O noise suppression and NC/JTAG pins assigned per SA variant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; latched on rising CLK edge when ADSP=LOW/CE=LOW or ADSC=LOW
CLKSystem Clock InputSingle-ended master clock; all synchronous timing referenced to rising edge; no internal PLL
ADSP / ADSCAddress Status InputsProcessor- or cache-controller-initiated address latch enable; both active LOW, gated by CE
ADVBurst Address AdvanceActive LOW signal that increments internal burst counter; held HIGH to suspend burst sequence
GW / BWE / BW1–BW4Write Control InputsGlobal write (GW) overrides byte enables; BWE gates BWx; each BWx controls one 9-bit byte (I/O0–7+I/OP1, etc.)
OEOutput EnableAsynchronous control; drives I/O pins to high-Z when HIGH, regardless of clock or selection state
ZZSleep Mode InputAsynchronous HIGH activates full sleep; internal pull-down ensures active mode at power-up if left floating
TMS/TDI/TCK/TRST/TDOJTAG Test InterfaceIEEE 1149.1 TAP controller interface; TRST optional; all inputs have internal pull-ups
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus; registered input/output paths; each byte group has dedicated VDDQ/VSS pair
VDD / VDDQ / VSSPower SuppliesVDD (core), VDDQ (I/O), and multiple VSS pins distributed for EMI reduction and impedance control

Key Features

FeatureDesign Value
Pipelined Burst ReadsDelivers first output data one clock cycle after address latch, with three additional words on successive CLK edges - eliminates pipeline stalls in high-throughput data streams
Single-Cycle DeselectChip deactivation completes within one clock cycle, enabling rapid context switching between memory banks without timing penalty
Byte-Selectable WritesFour independent 9-bit write enables (BW1–BW4) allow partial-word updates without read-modify-write, preserving data integrity in multi-threaded environments
Industrial Temp + JTAGFull functionality guaranteed from –40°C to +85°C with production-tested IEEE 1149.1 boundary scan - critical for aerospace, telecom, and industrial control validation
Low-Power Sleep ModeZZ-driven sleep reduces ICC to ≤35 mA while maintaining full data retention - extends uptime in battery-backed or thermally constrained systems

Applications

Network Packet BufferingDSP Data Co-Processing

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches with line-rate throughput requirements.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer interfacing directly to MAC controllers and traffic managers via synchronous burst protocol.

Use Value: 183 MHz burst reads/writes sustain 6.588 Gbps (36-bit × 183 MHz) data transfer, eliminating FIFO bottlenecks in 10G+ switch fabric designs.

Use Scenario: Real-time coefficient storage and sample buffering in radar signal processing pipelines.

IC Role / Device Role / Timing Role: Dual-ported memory surrogate supporting simultaneous fetch (burst read) and update (byte write) under deterministic timing constraints.

Use Value: Single-cycle deselect and pipelined outputs ensure jitter-free alignment between ADC sampling clocks and DSP core execution cycles.

Cache-Coherent SubsystemIndustrial PLC Memory Expansion

Use Scenario: Extending L2 cache tag/data arrays in RISC-V or ARM-based SoC reference designs.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as cache way extension with ADSP/ADSC handshake compatibility for cache controller integration.

Use Value: Linear/interleaved burst modes match CPU prefetch patterns; JTAG enables in-system verification of cache coherency logic.

Use Scenario: Adding deterministic-access program/data memory to programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Industrial-grade memory module supporting deterministic scan-cycle execution with guaranteed –40°C to +85°C operation.

Use Value: ZZ sleep mode reduces thermal load during idle cycles; robust VDDQ tolerance (±5%) maintains reliability amid industrial power rail fluctuations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-183BZXI128K × 32-bit organization; no JTAG; 165-ball fBGA only; tCD = 3.3 ns same speed gradeLacks burst order selection (LBO) and IEEE 1149.1 test interface; requires redesign for 36-bit data pathSelect when 32-bit bus width suffices and JTAG is unnecessary; verify pinout compatibility with BQG165 package
AS7C3256A-183BIN128K × 32-bit; no pipelined outputs; asynchronous OE; 100-pin TQFP only; tAA = 3.5 ns at 166 MHzNo burst counter or ADV control; slower access; no sleep mode (ZZ) or JTAG; limited to commercial temp (0°C to +70°C)Consider only for cost-sensitive, non-industrial designs where burst performance and testability are secondary

Compared with CY7C1362BV33-183BZXI and AS7C3256A-183BIN, the 71V35761SA183BGGI uniquely combines 36-bit width, industrial temperature, JTAG, and configurable burst sequencing - making it irreplaceable in high-assurance networking and real-time control applications demanding full traceability and deterministic latency.

Availability

71V35761SA183BGGI is available at Aetrix Electronics and suitable for network packet buffering, DSP co-processing, cache-coherent subsystems, and industrial PLC memory expansion requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V35761SA183BGGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF products for communications, computing, and industrial markets.

The 71V35761SA183BGGI belongs to IDT's high-speed synchronous SRAM product line, engineered for deterministic low-latency memory access in cache, packet buffer, and real-time signal processing subsystems where burst efficiency and industrial reliability are mandatory.

FAQ

What is the maximum operating frequency and corresponding access time for the 71V35761SA183BGGI?

The 71V35761SA183BGGI is rated for 183 MHz operation with a guaranteed clock access time of 3.3 ns across the full industrial temperature range (–40°C to +85°C). This specification is validated under VDD = VDDQ = 3.3 V ±5%, and includes setup/hold timing margins for reliable system integration.

Does the 71V35761SA183BGGI support both linear and interleaved burst modes, and how is the selection made?

Yes, the 71V35761SA183BGGI supports both linear and interleaved burst sequences via the LBO (Linear Burst Order) input. When LBO = LOW, linear addressing is used; when LBO = HIGH, interleaved addressing is selected. LBO is a static configuration pin and must remain stable during operation to prevent burst sequence corruption.

What package type and pin count does the 71V35761SA183BGGI use, and is JTAG available in this variant?

The 71V35761SA183BGGI uses a 119-ball fine-pitch BGA (BGG119) package. As indicated by the "SA" suffix, it includes full IEEE 1149.1-compliant JTAG boundary scan capability with dedicated TMS, TDI, TCK, TRST, and TDO pins assigned per the BG119 pinout - confirmed in datasheet Figure 5 and Table 2.

How does the ZZ pin function in the 71V35761SA183BGGI, and what power savings does it provide?

The ZZ pin on the 71V35761SA183BGGI enables full sleep mode when driven HIGH. In this state, internal clock gating reduces supply current to ≤35 mA (ISB1/IZZ), while guaranteeing full data retention. Recovery time (tZZR) is 100 ns, and ZZ has an internal pull-down to ensure active mode at power-up if left unconnected.

Can the 71V35761SA183BGGI perform byte-selectable writes, and how are the byte lanes mapped?

Yes, the 71V35761SA183BGGI supports true byte-selectable writes using BW1–BW4 inputs. BW1 controls I/O0–I/O7 and I/OP1 (9 bits), BW2 controls I/O8–I/O15 and I/OP2, BW3 controls I/O16–I/O23 and I/OP3, and BW4 controls I/O24–I/O31 and I/OP4 - enabling partial-word updates without read-modify-write overhead.

71V35761SA183BGGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
183 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V35761SA183BGGI FAQ

1.How can I place an order for 71V35761SA183BGGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V35761SA183BGGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V35761SA183BGGI reliable?

The price and inventory of 71V35761SA183BGGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V35761SA183BGGI is usually 5 days.

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71V35761SA183BGGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V35761SA183BGGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V35761SA183BGGI?

For technical support, including 71V35761SA183BGGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V35761SA183BGGI requirements.

6.How does Aetrix verify that 71V35761SA183BGGI is sourced from the original manufacturer or authorized distributors?

All 71V35761SA183BGGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V35761SA183BGGI meets industry standards.

7.What is the process for return or replacement of 71V35761SA183BGGI?

All 71V35761SA183BGGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V35761SA183BGGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V35761SA183BGGI part is unused and in its original packaging.

Return procedure for 71V35761SA183BGGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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