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Renesas 71V35761SA183BQG8

Part No.:
71V35761SA183BQG8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V35761SA183BQG8.pdf
Description:
IC SRAM 4.5MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,692

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Product details

Overview

71V35761SA183BQG8 from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 183MHz (3.3ns clock access time), supports linear/interleaved burst modes via LBO input, and features JTAG boundary scan (IEEE 1149.1) in SA version. Used in high-speed cache and memory subsystems for network processors and telecom line cards.

For engineers reviewing the 71V35761SA183BQG8 datasheet, 71V35761SA183BQG8 pinout, 71V35761SA183BQG8 application, or 71V35761SA183BQG8 equivalent, key selection criteria include burst mode timing compliance, ZZ sleep-mode current (30mA), TQFP-100 package compatibility, and JTAG-enabled testability for production validation.

Technical Context

The 71V35761SA183BQG8 implements a synchronous, clock-driven architecture with registered address, data, and control paths. Its internal burst address counter generates four sequential 36-bit words per address, with pipelined output staging enabling one-cycle latency on first word and subsequent words aligned to rising CLK edges.

Burst order is determined by static LBO pin state (LOW = linear, HIGH = interleaved), while ADV controls burst advance. Write operations support global (GW) or byte-selectable (BW1–BW4 + BWE) modes, with self-timed write completion governed by CE, ADSP/ADSC, and CLK synchronization.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit (4.608 Mbit), supporting 36-bit parallel data bus width
Clock Frequency183 MHz - enables 5.5 ns clock cycle time for industrial-grade timing margin
Access Time3.3 ns - defines maximum delay from CLK high to valid output data under specified load
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - requires dual 3.3V rails with independent decoupling
Sleep Current (IZZ)30 mA - power-down current when ZZ = HIGH, ensuring low standby consumption in idle states
Burst ModeLinear or interleaved via LBO pin - determines address sequence for four-word burst reads/writes
JTAG SupportIEEE 1149.1 compliant - enables boundary-scan testing without physical probe access

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 marked by dot; pins A0–A17, I/O0–I/O31, I/OP1–I/OP4, and dedicated control signals occupy perimeter with VDD/VDDQ/VSS distributed across multiple pins for noise reduction.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; latched on rising CLK edge with ADSP/ADSC assertion
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional data path; registered inputs/outputs synchronized to CLK rising edge
CLKSystem ClockPrimary timing reference; all synchronous operations referenced to rising edge
CE, CS0, CS1Chip EnablesThree-level chip select hierarchy (CE active LOW, CS0 HIGH, CS1 LOW) for multi-chip decoding
GW, BWE, BW1–BW4Write ControlsGlobal write (GW) or byte-write (BWE + BWx) selection; BW1 controls I/O0–7 + I/OP1, etc.
ADV, ADSP, ADSCBurst Address ControlADV advances internal counter; ADSP (processor) and ADSC (cache) load initial address synchronously
LBOBurst Order SelectAsynchronous static input: LOW = linear burst (00→01→10→11), HIGH = interleaved (00→01→11→10)
ZZSleep ModeAsynchronous HIGH-active input; gates internal CLK and reduces current to 30 mA while retaining data
TMS, TDI, TCK, TDO, TRSTJTAG InterfaceIEEE 1149.1 boundary-scan chain; TRST optional asynchronous reset (pull-up internal)

Key Features

FeatureDesign Value
Pipelined Burst OutputsFirst data word available after one CLK cycle; subsequent words aligned to next three rising edges - eliminates wait states in burst transfers
Single-Cycle DeselectChip deactivation completes within one clock cycle - enables rapid switching between memory banks or peripherals
Self-Timed Write CycleInternal timing logic finalizes write completion without external strobe - simplifies controller design and improves reliability
Byte-Write Enable ArchitectureFour independent 9-bit byte lanes (BW1–BW4) with shared BWE - allows partial writes without read-modify-write overhead
Industrial Temperature Range–40°C to +85°C operation - qualified for base station, router, and industrial control environments

Applications

Network Processor CacheTelecom Line Card Buffer

Use Scenario: High-bandwidth packet buffering and header processing in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: Primary burst-access SRAM for instruction/data cache, interfacing directly to MIPS or ARM-based NPU cores via 36-bit synchronous bus.

Use Value: 183MHz operation and pipelined outputs sustain 6.5 Gbps sustained throughput; single-cycle deselect enables dynamic bank arbitration with minimal latency penalty.

Use Scenario: Real-time framing and deframing of SONET/SDH OC-48 streams in optical transport equipment.

IC Role / Device Role / Timing Role: Dual-port buffer memory managing ingress/egress data flow between framer ASIC and backplane interface.

Use Value: Linear burst mode aligns with contiguous cell payloads; ZZ sleep mode reduces idle power by >90% during low-traffic intervals.

Radar Signal Processing MemoryAvionics Data Acquisition Buffer

Use Scenario: Storing intermediate FFT results and coefficient tables in airborne pulse-Doppler radar systems.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory accessed by FPGA-based DSP engines with deterministic burst timing.

Use Value: Interleaved burst mode matches FFT memory access patterns; industrial temp rating ensures operation across flight envelope (-40°C to +85°C).

Use Scenario: Capturing high-resolution sensor telemetry (inertial, pressure, temperature) in fly-by-wire flight control units.

IC Role / Device Role / Timing Role: Fault-tolerant buffer storing time-stamped samples prior to ARINC-429 or AFDX transmission.

Use Value: JTAG boundary scan enables in-system verification of memory integrity pre-flight; 3.3V I/O compatible with avionics logic families.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-167AXC128K × 32-bit organization; no JTAG; 167MHz max speed; 100-pin TQFPLacks burst counter and pipelined outputs; supports only standard asynchronous read/write cyclesSelect when JTAG testability and burst efficiency are not required; verify 32-bit vs. 36-bit data width compatibility
AS7C312836B-167BIN128K × 36-bit; 167MHz; no JTAG; 100-pin TQFP; commercial temp only (0°C to +70°C)Missing ZZ sleep mode and IEEE 1149.1 support; lower max frequency than 183MHz variantChoose for cost-sensitive commercial designs where industrial temp and debug capability are unnecessary

Compared with CY7C1362BV33-167AXC and AS7C312836B-167BIN, the 71V35761SA183BQG8 delivers higher bandwidth via pipelined burst reads, deterministic sleep-mode entry/exit, and production-ready JTAG validation - critical for telecom and defense applications requiring traceable test coverage.

Availability

71V35761SA183BQG8 is available at Aetrix Electronics and suitable for network processor cache, telecom line card buffer, radar signal processing memory, and avionics data acquisition buffer applications requiring stable component supply and long-term industrial-grade availability.

Supply support for 71V35761SA183BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) is a fabless semiconductor company specializing in high-performance timing, memory interface, and RF solutions, now part of Renesas Electronics.

The 71V35761SA183BQG8 belongs to IDT's high-speed synchronous SRAM product line, designed specifically for low-latency, burst-capable memory subsystems in networking, communications, and real-time embedded systems.

FAQ

What is the maximum operating frequency of the 71V35761SA183BQG8?

The 71V35761SA183BQG8 is rated for 183 MHz operation, corresponding to a 5.5 ns clock cycle time and 3.3 ns clock-to-data access time. This speed grade is validated across the industrial temperature range (–40°C to +85°C) with VDD and VDDQ at 3.3 V ±5%. The device also supports 166 MHz and 200 MHz variants, but the 71V35761SA183BQG8 part number specifically denotes the 183 MHz industrial-grade version.

Does the 71V35761SA183BQG8 support both linear and interleaved burst modes?

Yes, the 71V35761SA183BQG8 supports both burst modes via the LBO (Linear/Interleaved Burst Order) pin. When LBO is driven LOW, the device executes linear burst addressing (00→01→10→11); when HIGH, it uses interleaved order (00→01→11→10). This selection is static and must remain stable during operation. The burst counter automatically increments on each ADV assertion, delivering four 36-bit words per initiated burst sequence.

What is the function of the ZZ pin on the 71V35761SA183BQG8?

The ZZ pin on the 71V35761SA183BQG8 is an asynchronous, HIGH-active sleep mode enable. When ZZ is driven HIGH, the internal clock is gated and the device enters full sleep mode with IZZ current limited to 30 mA (industrial grade), while retaining full data integrity. Recovery requires tZZR ≥ 100 ns after ZZ returns LOW before normal operation resumes. ZZ has an internal pull-down resistor.

Is JTAG boundary scan available on the 71V35761SA183BQG8?

Yes, the "SA" suffix in 71V35761SA183BQG8 explicitly denotes inclusion of IEEE 1149.1-compliant JTAG boundary scan. Pins TMS, TDI, TCK, TDO, and optional TRST are assigned on the 100-pin TQFP package. JTAG functionality is fully integrated and usable for production ICT, board-level validation, and in-system programming verification without requiring external test fixtures.

How does the 71V35761SA183BQG8 handle byte-write operations?

The 71V35761SA183BQG8 supports granular byte writes using BWE (byte write enable) and four BWx signals (BW1–BW4). BWE must be LOW to activate byte write mode; then individual BWx lines select 9-bit byte lanes: BW1 → I/O0–7 + I/OP1, BW2 → I/O8–15 + I/OP2, etc. Any active BWx disables all outputs during the write cycle, ensuring clean bus isolation. Global write (GW) overrides byte-write selection when asserted.

71V35761SA183BQG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
183 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V35761SA183BQG8 FAQ

1.How can I place an order for 71V35761SA183BQG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V35761SA183BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 71V35761SA183BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V35761SA183BQG8 is usually 5 days.

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71V35761SA183BQG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V35761SA183BQG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V35761SA183BQG8?

For technical support, including 71V35761SA183BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V35761SA183BQG8 requirements.

6.How does Aetrix verify that 71V35761SA183BQG8 is sourced from the original manufacturer or authorized distributors?

All 71V35761SA183BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V35761SA183BQG8 meets industry standards.

7.What is the process for return or replacement of 71V35761SA183BQG8?

All 71V35761SA183BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V35761SA183BQG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V35761SA183BQG8 part is unused and in its original packaging.

Return procedure for 71V35761SA183BQG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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