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Renesas 71V3576S133PFG

Part No.:
71V3576S133PFG
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3576S133PFG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
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Inventory:3,910

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Product details

Overview

71V3576S133PFG from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 133MHz (4.2ns clock access time), supports linear/interleaved burst modes via LBO input, and features global write (GW), byte write enables (BW1–BW4), and sleep mode (ZZ). Used in high-speed cache and buffer applications in networking and telecom line cards.

For engineers reviewing the 71V3576S133PFG datasheet, 71V3576S133PFG pinout, 71V3576S133PFG application, or 71V3576S133PFG equivalent, key selection criteria include burst-mode timing compliance, 100-pin TQFP footprint compatibility, industrial-grade temperature support (–40°C to +85°C), and 3.3V core/I/O supply requirements.

Technical Context

The 71V3576S133PFG implements a synchronous, clock-driven architecture with registered address, data, and control inputs. Its internal burst counter advances on ADV=LOW and selects sequence order via LBO (linear or interleaved), enabling four-word burst reads/writes per address cycle.

It uses self-timed write logic gated by GW, BWE, and BWx signals, with pipelined output registers delivering data one clock cycle after CLK rising edge. Power management includes asynchronous ZZ-controlled sleep mode (IZZ ≤ 35mA) and CMOS standby (ISB1 ≤ 35mA).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.608 Mbit); supports 36-bit wide data path for high-bandwidth buffering
Clock Frequency 133 MHz; enables 7.5 ns minimum clock cycle time for deterministic system timing
Access Time 4.2 ns clock-to-data (tCD); guarantees pipelined output validity within one clock period
Supply Voltages VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; dual-rail I/O/core separation reduces noise coupling
Operating Temperature –40°C to +85°C (Industrial grade); validated for embedded telecom and industrial control environments
Power Consumption IDD = 250–260 mA (133 MHz, Industrial); ISB1 = 30–35 mA (standby); IZZ = 30–35 mA (sleep)
Package JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with automated SMT assembly

Pinout & Package

71V3576S133PFG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch. Pin 1 identifier located at top-left corner (counterclockwise numbering).

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs Synchronous address latching on ADSP/ADSC low + CE low; A0–A16 used for 128K×36 mode
CLK Clock Input Primary timing reference; all synchronous operations triggered on rising edge
CE, CS0, CS1 Chip Enable / Selects Three-level chip selection (CE low + CS0 high + CS1 low) enables precise bank control
GW, BWE, BW1–BW4 Write Control Inputs GW writes all 36 bits; BWE enables byte write; BW1–BW4 select 9-bit bytes (I/O0–7/I/OP1, etc.)
ADV, ADSP, ADSC, LBO Burst & Address Control ADV advances burst counter; ADSP/ADSC load address register; LBO selects linear/interleaved burst order
OE Output Enable Asynchronous control of I/O drivers; enables high-impedance state when high
ZZ Sleep Mode Input Asynchronous entry to lowest-power state; gates internal clock and retains data
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional synchronous bus; registered input/output paths ensure timing predictability
VDD, VDDQ, VSS Power/Ground VDD = 3.3V core; VDDQ = 3.3V I/O; separate rails minimize switching noise on data lines

Key Features

Feature Design Value
Pipelined Burst Outputs Delivers first data word one clock cycle after address latch; subsequent words on next three rising edges - eliminates wait states in burst transfers
Single-Cycle Deselect Device enters high-impedance output state within one clock cycle upon chip disable - prevents bus contention during rapid reconfiguration
Configurable Burst Order LBO pin selects linear (LBO = LOW) or interleaved (LBO = HIGH) addressing - matches CPU/cache controller burst protocols without redesign
Byte-Write Flexibility Four independent 9-bit byte write enables (BW1–BW4) plus global write (GW) - supports partial-word updates without read-modify-write overhead
Low-Power Sleep Mode ZZ input reduces supply current to ≤35 mA while retaining full memory content - ideal for power-gated subsystems in telecom infrastructure

Applications

Network Line Card Buffering High-Speed Cache Memory

Use Scenario: Temporary storage of packet headers and metadata in 10Gbps+ Ethernet line cards requiring zero-latency burst access.

IC Role / Device Role / Timing Role: Primary synchronous buffer between MAC and switch fabric; provides pipelined 133MHz burst reads aligned to system clock domain.

Use Value: 4.2ns tCD and single-cycle deselect enable real-time packet steering without pipeline stalls or FIFO depth penalties.

Use Scenario: Level-2 instruction/data cache in DSP-based baseband processors for wireless infrastructure equipment.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency cache SRAM interfaced directly to processor bus; burst mode matches CPU prefetch patterns.

Use Value: Linear/interleaved burst selection (via LBO) ensures compatibility with ARM Cortex-A or TI C6000 cache controllers' address sequencing.

Industrial PLC Data Logging Avionics Sensor Interface Buffer

Use Scenario: Buffered acquisition of analog sensor streams in ruggedized programmable logic controllers operating across –40°C to +85°C.

IC Role / Device Role / Timing Role: Deterministic, temperature-stable memory buffer for time-critical I/O scanning cycles; powered by regulated 3.3V rails.

Use Value: Industrial-grade temp rating and 3.3V-only operation eliminate level-shifting complexity and ensure reliability under thermal cycling.

Use Scenario: Intermediate storage of high-resolution inertial measurement unit (IMU) data prior to ARINC-429 or MIL-STD-1553 framing.

IC Role / Device Role / Timing Role: Synchronous burst-capable SRAM synchronizing sensor sampling clock (e.g., 100kHz) to host processor's 133MHz bus.

Use Value: Self-timed write with GW/BWE control allows atomic 36-bit writes without external handshake logic - critical for fault-tolerant avionics.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
Cypress CY7C1371D-133AXC 128K × 32-bit organization; 32-bit data bus; no I/OP parity pins; identical 133MHz speed and TQFP-100 package Designed for 32-bit systems; lacks 4-bit parity support (I/OP1–I/OP4) required for ECC-enabled controllers Select only if 32-bit data width suffices and parity is unused; verify ADV/LBO timing compatibility with existing controller firmware
Renesas R1EX24064AS0C0I#U0 128K × 36-bit; 3.3V; but asynchronous interface (no CLK, no pipelining); 15ns access time; SOJ-100 package Not suitable for burst or pipelined systems; requires external address latches and wait-state generation Consider only for legacy board refresh where clock-domain synchronization is absent and timing margin permits 15ns latency

Compared with CY7C1371D-133AXC and R1EX24064AS0C0I#U0, the 71V3576S133PFG uniquely delivers 36-bit width with integrated parity I/O, pipelined burst timing, and synchronous power-down - making it irreplaceable in new designs requiring deterministic 133MHz cache or buffer performance with industrial temperature resilience.

Availability

71V3576S133PFG is available at Aetrix Electronics and suitable for network line card buffering, high-speed cache memory, industrial PLC data logging, and avionics sensor interface buffer applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V3576S133PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a fabless semiconductor company specializing in high-performance timing, memory, and interface solutions for communications, computing, and industrial markets.

The 71V3576S133PFG belongs to IDT's pipelined burst synchronous SRAM product line, engineered specifically for low-latency, high-throughput buffering in telecom infrastructure, military/aerospace systems, and real-time industrial controllers.

FAQ

What is the maximum operating frequency supported by the 71V3576S133PFG?

The 71V3576S133PFG is rated for 133 MHz operation, with a guaranteed minimum clock cycle time (tCYC) of 7.5 ns. This speed is validated across the full industrial temperature range (–40°C to +85°C) and 3.3V ±5% supply conditions. The device does not support 150 MHz operation - that speed grade corresponds to the 71V3576S150PFG variant.

Does the 71V3576S133PFG support both linear and interleaved burst modes?

Yes, the 71V3576S133PFG supports both burst modes via the LBO (Linear Burst Order) input pin. When LBO is driven LOW, the device executes linear burst addressing; when LBO is HIGH, it uses interleaved burst order. The LBO signal is static and must remain stable during active operation to prevent burst sequence corruption.

How many byte write enable signals does the 71V3576S133PFG provide, and what is their function?

The 71V3576S133PFG provides four individual byte write enable signals (BW1–BW4), each controlling a 9-bit segment of the 36-bit data bus (plus 4 parity bits on I/OP1–I/OP4). When enabled with BWE LOW, these allow selective writing of any combination of 9-bit bytes without affecting other bytes - essential for efficient partial-word updates in protocol processing.

What is the purpose of the ZZ pin on the 71V3576S133PFG, and how does it affect power consumption?

The ZZ pin on the 71V3576S133PFG controls asynchronous entry into full sleep mode. When ZZ is driven HIGH, the internal clock is gated and supply current drops to ≤35 mA (IZZ), while memory contents are retained. This mode eliminates dynamic power draw and is ideal for idle periods in power-constrained telecom or avionics subsystems.

Is the 71V3576S133PFG pin-compatible with the 71V3578S133PFG?

No, the 71V3576S133PFG (128K × 36) and 71V3578S133PFG (256K × 18) are not pin-compatible. Although both use 100-pin TQFP packages, their pinouts differ significantly - notably in address pin count (A0–A16 vs. A0–A17), byte write enable allocation (BW3/BW4 present only on 71V3576), and NC pin placement. PCB layout must be redesigned for interchange.

71V3576S133PFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3576S133PFG FAQ

1.How can I place an order for 71V3576S133PFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3576S133PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3576S133PFG reliable?

The price and inventory of 71V3576S133PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3576S133PFG is usually 5 days.

3.What payment methods are accepted for 71V3576S133PFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3576S133PFG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3576S133PFG?

71V3576S133PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3576S133PFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3576S133PFG?

For technical support, including 71V3576S133PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3576S133PFG requirements.

6.How does Aetrix verify that 71V3576S133PFG is sourced from the original manufacturer or authorized distributors?

All 71V3576S133PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3576S133PFG meets industry standards.

7.What is the process for return or replacement of 71V3576S133PFG?

All 71V3576S133PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3576S133PFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3576S133PFG part is unused and in its original packaging.

Return procedure for 71V3576S133PFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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