Renesas 71V3576S133PFG8
- Part No.:
- 71V3576S133PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3576S133PFG8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3576S133PFG8 from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 133MHz (4.2ns clock access time), supports linear/interleaved burst modes via LBO input, and features global/byte write control (GW/BWE/BW1–BW4) for precise memory management in high-speed cache or buffer applications.
For engineers reviewing the 71V3576S133PFG8 datasheet, 71V3576S133PFG8 pinout, 71V3576S133PFG8 application, or 71V3576S133PFG8 equivalent, this device delivers deterministic timing for pipelined read/write bursts, low-latency deselect, and industrial-grade reliability in TQFP-100 packaging - critical for networking packet buffers, FPGA co-processor caches, and real-time DSP subsystems.
Technical Context
The 71V3576S133PFG8 implements a synchronous architecture with registered address, data, and control inputs triggered on the rising edge of CLK. Its internal burst counter advances on ADV=LOW and selects sequence order (linear or interleaved) based on static LBO state - no runtime reconfiguration.
Burst operation delivers four consecutive 36-bit words per address cycle, with first-word output pipelined by one clock cycle. Write cycles are self-timed and support global (GW), byte-select (BW1–BW4), or combined (BWE + BWx) modes - all synchronized to CLK and gated by CE/CS0/CS1.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.608 Mbit); fixed configuration for this part number |
| Clock Frequency | 133 MHz - enables 7.5 ns minimum clock cycle time for deterministic system timing |
| Access Time | 4.2 ns clock-to-data (tCD) - guarantees pipelined output validity within one clock after rising edge |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - separate rails allow I/O voltage stability during core switching |
| Operating Temperature | 0°C to +70°C (Commercial grade) - validated for stable operation across full range without derating |
| Power Consumption | 250 mA IDD (133 MHz, commercial) - enables thermal budgeting in dense PCB layouts |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm) - surface-mount compatible with standard reflow profiles |
Pinout & Package
Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm lead pitch. Pin 1 marked by corner cut; top-side marking includes "71V3576" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous address register inputs; A0–A16 used for 128K×36 mode (17-bit addressing) |
| CLK | Clock Input | Rising-edge-triggered master timing reference for all synchronous operations |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level decode (CE LOW + CS0 HIGH + CS1 LOW) enables device; allows bank selection in multi-SRAM systems |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW writes all 36 bits; BWE enables byte-write logic; BW1–BW4 select 9-bit bytes (I/O0–7+I/OP1, etc.) |
| ADV, ADSP, ADSC | Burst & Address Status | ADV advances burst counter; ADSP/ADSC load address register - dual-source support for processor/cache controller |
| LBO | Burst Order Select | Static input: LBO=LOW → linear burst; LBO=HIGH → interleaved burst - sets sequence before operation begins |
| ZZ | Sleep Mode Input | Asynchronous HIGH entry to full sleep mode; reduces supply current to ≤35 mA (IZZ) while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus; registered inputs/outputs synchronized to CLK; I/OP pins are parity bits |
| VDD, VDDQ, VSS | Power/Ground | VDD (core), VDDQ (I/O), and VSS (common ground) - require separate decoupling per JEDEC guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Pipelined Burst Outputs | First data word appears on next rising CLK edge; subsequent words follow on successive edges - eliminates wait states in burst transfers |
| Single-Cycle Deselect | Device enters high-impedance state within one clock cycle after chip disable - prevents bus contention during rapid bank switching |
| Self-Timed Write Cycle | Internal timing logic completes write without external strobes; supports GW, BWE, or BWx activation - simplifies controller interface |
| Linear/Interleaved Burst Modes | LBO pin statically configures burst address sequence (A0/A1 progression) - matches cache line mapping requirements of x86 or PowerPC processors |
| 3.3V Core + I/O Separation | Dual 3.3V supplies (VDD/VDDQ) enable independent noise filtering and reduce crosstalk between core logic and data bus drivers |
| Industrial-Grade Option Available | Same pinout and timing as commercial version but qualified from –40°C to +85°C - supports extended-temperature embedded deployments |
Applications
| Networking Packet Buffer | FPGA Co-Processor Cache |
|---|---|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer providing 133 MHz burst reads/writes to match MAC controller throughput. Use Value: Pipelined outputs deliver four 36-bit words per address cycle, reducing frame assembly overhead by 75% vs. non-burst SRAM. |
Use Scenario: Offloading compute-intensive tasks (e.g., FFT, filtering) from FPGA fabric using tightly coupled memory. IC Role / Device Role / Timing Role: Synchronous cache holding intermediate results with deterministic 4.2 ns tCD for pipeline synchronization. Use Value: Single-cycle deselect enables rapid context switching between multiple algorithm blocks without bus arbitration delays. |
| DSP Real-Time Audio Buffer | Industrial Motion Controller Buffer |
Use Scenario: Holding audio sample streams (e.g., 24-bit/192 kHz stereo) in professional audio interfaces requiring zero-dropout playback. IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting simultaneous read (DAC path) and write (ADC path) with burst alignment. Use Value: Linear burst mode (LBO=LOW) provides sequential address progression matching PCM sample ordering - eliminating address calculation overhead. |
Use Scenario: Temporarily storing position/velocity feedback data from servo drives in CNC or robotics controllers. IC Role / Device Role / Timing Role: Deterministic-access memory interfaced to ARM Cortex-R or TriCore microcontrollers for hard real-time loop execution. Use Value: ZZ sleep mode reduces idle power to ≤35 mA while preserving data - extends uptime in fanless, thermally constrained enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71V3576S133PFGI8 | Identical electrical specs and pinout; rated for –40°C to +85°C industrial temperature range | Required for deployment in outdoor telecom cabinets or factory-floor automation where ambient exceeds 70°C | Select when extended temperature qualification is mandatory; same layout and firmware compatibility |
| 71V3578S133PFG8 | 256K × 18-bit organization (same density, different width); shares 100-pin TQFP package and timing | Better suited for 16/18-bit bus architectures (e.g., older DSPs) where 36-bit width creates unnecessary routing complexity | Choose for narrower data paths; requires address decoding adjustment due to 18-bit word addressing |
Compared with 71V3576S133PFG8, the industrial-grade 71V3576S133PFGI8 offers identical performance with extended thermal resilience, while the 71V3578S133PFG8 provides equivalent density in an 18-bit-wide format - enabling optimized bus utilization in legacy 16-bit systems without sacrificing speed or burst capability.
Availability
71V3576S133PFG8 is available at Aetrix Electronics and suitable for networking packet buffers, FPGA co-processor caches, and DSP real-time audio buffers requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for 71V3576S133PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
IDT (Integrated Device Technology), now part of Renesas Electronics, designs high-performance memory and timing solutions for communications, computing, and industrial markets.
The 71V3576S133PFG8 belongs to IDT's pipelined burst synchronous SRAM product line, engineered specifically for low-latency, high-throughput buffering in network infrastructure and real-time embedded systems.
FAQ
What is the memory organization of the 71V3576S133PFG8?
The 71V3576S133PFG8 is organized as 128K × 36 bits (4.608 Mbit), meaning it provides 131,072 words of 36-bit data. This configuration is fixed for the 71V3576 family and differs from the 256K × 18-bit layout of the pin-compatible 71V3578 series. Address lines A0–A16 are active in this mode.
Does the 71V3576S133PFG8 support both linear and interleaved burst modes?
Yes, the 71V3576S133PFG8 supports both burst modes via the LBO (Linear Burst Order) input pin. When LBO is driven LOW, the device uses linear burst addressing; when HIGH, it uses interleaved burst. LBO is a static input and must remain stable during operation - it is not sampled dynamically.
What is the function of the ADV pin on the 71V3576S133PFG8?
The ADV (Burst Address Advance) pin controls burst counter progression on the 71V3576S133PFG8. When ADV is LOW, the internal burst counter increments after each cycle, delivering the next sequential or interleaved address. When ADV is HIGH, burst advancement halts - enabling burst suspension or single-word access within a burst sequence.
How does the 71V3576S133PFG8 handle power-down and sleep modes?
The 71V3576S133PFG8 supports two low-power states: standby (via CE/CS deactivation) and full sleep mode (via ZZ HIGH). In sleep mode, internal clocks are gated and supply current drops to ≤35 mA (IZZ), while data retention is guaranteed. Recovery time (tZZR) is 100 ns, and ZZ pulse width (tZZPW) must exceed that minimum.
Is the 71V3576S133PFG8 pin-compatible with other devices in the same family?
Yes, the 71V3576S133PFG8 is pin-compatible with other speed grades (e.g., 150 MHz) and temperature variants (e.g., 71V3576S133PFGI8) in the same 100-pin TQFP package. It is also mechanically and electrically compatible with the 71V3578 series, though memory organization (128K×36 vs. 256K×18) requires firmware and address decoding adjustments.
71V3576S133PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3576S133PFG8 FAQ
1.How can I place an order for 71V3576S133PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3576S133PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3576S133PFG8 reliable?
The price and inventory of 71V3576S133PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3576S133PFG8 is usually 5 days.
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Once your 71V3576S133PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3576S133PFG8?
For technical support, including 71V3576S133PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3576S133PFG8 requirements.
6.How does Aetrix verify that 71V3576S133PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V3576S133PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3576S133PFG8 meets industry standards.
7.What is the process for return or replacement of 71V3576S133PFG8?
All 71V3576S133PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3576S133PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3576S133PFG8 part is unused and in its original packaging.
Return procedure for 71V3576S133PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3576S133PFG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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