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Renesas 71V3576S150PFG

Part No.:
71V3576S150PFG
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3576S150PFG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,400

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Product details

Overview

71V3576S150PFG from IDT is a 128K × 36-bit, 3.3V synchronous SRAM with pipelined outputs, burst counter, and single-cycle deselect. It operates at 150 MHz (3.8 ns clock access time), supports linear/interleaved burst modes via LBO input, and features global write (GW), byte write enables (BW1–BW4), and sleep mode (ZZ). Used in high-speed cache and networking buffers requiring deterministic latency.

For engineers reviewing the 71V3576S150PFG datasheet, 71V3576S150PFG pinout, 71V3576S150PFG application, or 71V3576S150PFG equivalent, key selection criteria include burst-mode timing compliance, 100-pin TQFP footprint compatibility, industrial-grade thermal margin (–40°C to +85°C option), and pipelined read/write cycle coordination with ADSP/ADSC address status signals.

Technical Context

The 71V3576S150PFG implements a synchronous, clock-driven architecture with registered address, data, and control paths. Its internal burst counter advances on ADV=LOW and selects sequence order (linear or interleaved) based on static LBO state-no runtime reconfiguration. All inputs except OE and ZZ are synchronous to CLK rising edge, with setup/hold times defined down to 1.5 ns.

Write operations support four distinct modes: global (GW), byte-select (BWE + BWx), self-timed execution, and pipelined output enable. Power management includes three states: active (IDD = 295 mA @ 150 MHz), standby (ISB1 = 30 mA), and full sleep (IZZ = 30 mA), all controlled without external sequencing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36-bit (4.608 Mbit); fixed configuration for this part number
Clock Frequency150 MHz max - enables 6.7 ns clock cycle for high-throughput burst transfers
Access Time3.8 ns clock-to-data (tCD) - guarantees pipelined output validity within one clock cycle
Supply VoltagesVDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O) - dual-rail operation prevents I/O contention
Operating TemperatureCommercial grade: 0°C to +70°C - validated across full range per JEDEC JESD22-A108
Package100-pin TQFP (14 mm × 20 mm, JEDEC MO-147) - surface-mount compatible with standard reflow profiles
Power ConsumptionIDD = 295 mA (active), ISB1 = 30 mA (standby), IZZ = 30 mA (sleep) - enables dynamic power scaling in burst-idle cycles

Pinout & Package

71V3576S150PFG is housed in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm lead pitch. Pin 1 identifier is marked by dot or beveled corner; pin 1 is located at top-left when notch faces up.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous address latch triggered by ADSP/ADSC low + CE low; A0–A16 used for 128K×36 addressing
CLKSystem Clock InputRising-edge-triggered master timing reference; all synchronous registers align to this edge
GW, BWE, BW1–BW4Write Control InputsGW enables full 36-bit write; BWE gates BWx; BW1 controls I/O0–7 + I/OP1 (9-bit byte)
ADSP / ADSCAddress Status InputsADSP (processor) and ADSC (cache controller) both load address register; functionally interchangeable for read
LBOBurst Order SelectAsynchronous static input: LBO = LOW → linear burst; LBO = HIGH → interleaved burst
ZZSleep Mode EnableAsynchronous high-active input; internally pulled down; gates CLK and reduces current to 30 mA
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus (32 data + 4 parity); registered input/output paths synchronized to CLK
VDD / VDDQ / VSSPower SuppliesVDD (core), VDDQ (I/O), VSS (ground) - separate pins minimize noise coupling between logic and I/O domains

Key Features

FeatureDesign Value
Pipelined Burst ReadDelivers four consecutive 36-bit words per address with 1-cycle pipeline delay - eliminates wait states in CPU/cache interfaces
Single-Cycle DeselectChip deactivation completes within one CLK cycle - enables rapid context switching between memory banks
Self-Timed Write CycleInternal timing logic finalizes write completion without external strobes - simplifies system-level timing closure
Byte-Write GranularityFour independent 9-bit byte lanes (BW1–BW4) allow partial writes without read-modify-write overhead
Low-Power Sleep ModeIZZ = 30 mA with ZZ = HIGH - retains data while cutting active power by >90% during idle bursts

Applications

Network Packet BufferCPU Cache Tag RAM

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches with line-rate forwarding.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer supporting 150 MHz burst reads/writes synchronized to switch fabric clock.

Use Value: Pipelined outputs deliver four header words per cycle; single-cycle deselect enables rapid bank switching between port queues.

Use Scenario: Holding tag and status bits for L1/L2 cache directories in RISC/VLIW processors.

IC Role / Device Role / Timing Role: Synchronous SRAM serving as associative tag RAM with deterministic 3.8 ns access for hit/miss resolution.

Use Value: 128K×36 organization matches typical 64-byte cache line × 32-way associativity; burst mode accelerates tag prefetch.

Baseband Signal Processor MemoryIndustrial PLC Data Log Buffer

Use Scenario: Temporary storage of FFT coefficients and channel estimation vectors in 4G/5G baseband ASICs.

IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly to DSP DMA engine with ADSP/ADSC handshake protocol.

Use Value: Linear burst mode (LBO = LOW) provides sequential coefficient access; 150 MHz throughput sustains 2.16 GB/s peak bandwidth.

Use Scenario: Cyclic buffering of sensor timestamps and analog measurements in programmable logic controllers operating at –40°C to +85°C.

IC Role / Device Role / Timing Role: Industrial-grade SRAM providing deterministic write latency and data retention during brownouts.

Use Value: ZZ sleep mode maintains data at 30 mA while awaiting trigger event; TQFP package ensures mechanical reliability under vibration.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1371DV18-167BZC256K × 18-bit organization; 167 MHz max; 3.3V core/I/O; 100-pin TQFPHigher density but narrower bus width - requires data bus multiplexing or wider FPGA interfaceSelect when 256K depth is required and 18-bit interface aligns with system architecture
AS7C31026B-15JCIN128K × 32-bit; 15 ns async access; no burst mode or pipelining; 54-pin SOJAsynchronous interface only; no CLK, ADSP, ADV, or burst logic - incompatible timing modelSelect only for legacy async systems where synchronous features are unused and pin count allows SOJ mounting

Compared with CY7C1371DV18-167BZC and AS7C31026B-15JCIN, the 71V3576S150PFG uniquely delivers 128K×36 burst-pipelined operation in a drop-in-compatible 100-pin TQFP, enabling direct integration into cache-coherent bus architectures without bus-width translation or timing redesign.

Availability

71V3576S150PFG is available at Aetrix Electronics and suitable for network packet buffering, CPU cache subsystems, baseband signal processing, and industrial data logging requiring stable component supply and commercial-temperature performance.

Supply support for 71V3576S150PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) is a fabless semiconductor company specializing in high-performance memory, timing, and RF solutions, now part of Renesas Electronics since 2019.

The 71V3576S150PFG belongs to IDT's pipelined burst synchronous SRAM product line, engineered for deterministic low-latency memory access in cache, networking, and digital signal processing systems where burst efficiency and timing predictability are critical.

FAQ

What is the maximum supported clock frequency for the 71V3576S150PFG?

The 71V3576S150PFG is rated for a maximum clock frequency of 150 MHz, corresponding to a minimum clock cycle time (tCYC) of 6.7 ns. This speed grade is validated across the commercial temperature range (0°C to +70°C) and is guaranteed by production AC testing per datasheet table 16. Operation above 150 MHz is not characterized and may result in timing violations or data corruption.

Does the 71V3576S150PFG support both linear and interleaved burst modes?

Yes, the 71V3576S150PFG supports both linear and interleaved burst sequences via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the device executes linear burst addressing (00→01→10→11); when LBO is HIGH, it uses interleaved order (00→01→11→10). LBO is asynchronous and must remain static during burst operation to prevent undefined address sequencing.

How does the 71V3576S150PFG handle power-down and sleep modes?

The 71V3576S150PFG implements two low-power states: standby (ISB1 = 30 mA) when deselected, and full sleep (IZZ = 30 mA) when ZZ is driven HIGH. In sleep mode, the internal clock is gated and core logic is powered down while retaining data. Recovery time (tZZR) is 100 ns, and the device must be deselected before entering sleep mode per datasheet requirement.

What is the function of the ADSP and ADSC pins on the 71V3576S150PFG?

ADSP (Address Status from Processor) and ADSC (Address Status from Cache Controller) are synchronous inputs that load the internal address register on their falling edge when CE is LOW. Both serve identical functions for read cycles and are interchangeable; ADSP is typically used in CPU-connected configurations, while ADSC supports cache-coherent systems. Neither pin affects write timing - GW/BWE/BWx control write initiation.

Can the 71V3576S150PFG be used in industrial temperature applications?

The 71V3576S150PFG itself is specified for commercial temperature (0°C to +70°C). However, the same die is offered in industrial grade as 71V3576S150PFGI (–40°C to +85°C), which shares identical electrical specifications, pinout, and timing. For industrial deployment, specify the PFGI variant - the PFG suffix alone denotes commercial grade and is not qualified for extended temperature operation.

71V3576S150PFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3576S150PFG FAQ

1.How can I place an order for 71V3576S150PFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3576S150PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3576S150PFG reliable?

The price and inventory of 71V3576S150PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3576S150PFG is usually 5 days.

3.What payment methods are accepted for 71V3576S150PFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3576S150PFG transactions.

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4.How is shipping managed for 71V3576S150PFG?

71V3576S150PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3576S150PFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3576S150PFG?

For technical support, including 71V3576S150PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3576S150PFG requirements.

6.How does Aetrix verify that 71V3576S150PFG is sourced from the original manufacturer or authorized distributors?

All 71V3576S150PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3576S150PFG meets industry standards.

7.What is the process for return or replacement of 71V3576S150PFG?

All 71V3576S150PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3576S150PFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3576S150PFG part is unused and in its original packaging.

Return procedure for 71V3576S150PFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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