Renesas 71V3577S65PFG8
- Part No.:
- 71V3577S65PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3577S65PFG8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3577S65PFG8 from Renesas Electronics is a 128K × 36-bit (4.608 Mb), 3.3V synchronous SRAM with flow-through output architecture, 6.5 ns access time at 133 MHz, TQFP-100 package, and industrial-grade temperature support (–40°C to +85°C). It delivers burst-mode memory performance for high-speed cache and buffer applications in networking and telecom infrastructure.
For engineers reviewing the 71V3577S65PFG8 datasheet, 71V3577S65PFG8 pinout, 71V3577S65PFG8 application, or 71V3577S65PFG8 equivalent, key selection criteria include its 6.5 ns commercial-speed timing, linear/interleaved burst control via LBO, self-timed write with GW/BWE/BWx, single-cycle deselect, and JEDEC-standard 100-pin TQFP footprint with VDD/VDDQ separation.
Technical Context
This SRAM implements a synchronous, clock-driven interface with registered address and data inputs, flow-through (unregistered) outputs, and an internal 2-bit binary burst counter. Its dual-bank chip select (CS0/CS1) and CE gating enable flexible memory mapping in multi-chip configurations.
The device supports three write modes-global write (GW), byte write enable (BWE), and individual byte writes (BW1–BW4)-with asynchronous OE and ZZ controls. Burst sequencing is determined by ADV, ADSP/ADSC status signals, and static LBO configuration, enabling deterministic linear or interleaved address progression across four consecutive words.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.608 Mbit); supports 256K × 18-bit mode via address remapping |
| Access Time / Max Frequency | 6.5 ns / 133 MHz - only in TQFP package, commercial temperature range |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); independent rails reduce noise coupling |
| Burst Mode | Linear or interleaved 4-word burst controlled by LBO pin; ADV enables/disables burst advance |
| Power Management | ZZ input enables full sleep mode (IZZ ≤ 35 µA); ISB1 standby current ≤ 35 mA |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for sustained operation under thermal stress |
| Output Architecture | Flow-through (no output register); tCD = 6.5 ns max ensures minimal clock-to-data latency |
Pinout & Package
71V3577S65PFG8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead-free and RoHS-compliant. Pin 1 marked via corner cut; pin 14 may float if input voltage remains < VIL; pin 64 (ZZ) may be left unconnected to maintain active mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous address latching on rising CLK edge gated by ADSP/ADSC; A0–A16 used for 128K×36 mode |
| CLK | Clock Input | Primary timing reference; all synchronous operations referenced to rising edge |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level decode: CE active low + CS0 high + CS1 low enables device; supports multi-SRAM bank selection |
| GW, BWE, BW1–BW4 | Write Control Inputs | GW writes all 36 bits; BWE gates BWx; BW1–BW4 each control one 9-bit byte (I/O0–7/I/OP1 through I/O24–31/I/OP4) |
| ADV, ADSP, ADSC | Burst Address Control | ADSP/ADSC load initial address; ADV advances internal burst counter; LBO selects linear vs. interleaved sequence |
| OE | Output Enable | Asynchronous; drives I/O pins to high-Z when HIGH, enabling bus sharing without clock dependency |
| ZZ | Sleep Mode Input | Asynchronous HIGH disables internal clock and reduces supply current to ≤35 µA; retains data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous interface; flow-through outputs eliminate output register delay |
| VDD, VDDQ, VSS | Power/Ground | Dual 3.3 V supplies: VDD for core logic, VDDQ for I/O drivers; separate VSS planes minimize switching noise |
Key Features
| Feature | Design Value |
|---|---|
| 6.5 ns Flow-Through Read Access | Enables 133 MHz system clock synchronization without output register latency penalty |
| Single-Cycle Deselect | Device exits active state within one clock cycle after CE/CS deassertion - critical for burst termination in pipelined systems |
| Configurable Burst Order (LBO) | LBO pin statically selects linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word address sequences - matches CPU/cache controller expectations |
| Self-Timed Write Cycle | Internal timing logic resolves write completion without external wait-state generation - simplifies controller design |
| Independent Core & I/O Supplies | VDD/VDDQ separation allows independent power domain management and noise isolation between logic and bus drivers |
| Industrial Temperature Range | Validated operation from –40°C to +85°C ensures reliability in base station, router, and industrial control environments |
Applications
| Networking Packet Buffer | Telecom Line Card Cache |
|---|---|
|
Use Scenario: High-throughput packet buffering in 10G Ethernet line cards where burst reads must sustain >10 Gbps aggregate bandwidth. IC Role / Device Role / Timing Role: Primary burst-access SRAM providing zero-wait-state read/write cycles synchronized to 133 MHz system clock. Use Value: 6.5 ns tCD and flow-through outputs deliver deterministic sub-7 ns data availability - eliminating pipeline stalls during back-to-back packet bursts. |
Use Scenario: Real-time frame caching in SONET/SDH add-drop multiplexers requiring low-jitter, jitter-immune memory access. IC Role / Device Role / Timing Role: Synchronous SRAM acting as timing-critical first-level cache between framer ASIC and SERDES interface. Use Value: Single-cycle deselect and ADV-gated burst control ensure precise alignment with frame boundary clocks - reducing bit error accumulation. |
| Industrial PLC Data Log | Radar Signal Processing Buffer |
|
Use Scenario: Non-volatile event logging in programmable logic controllers operating continuously in harsh factory environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM storing timestamped I/O snapshots with guaranteed data retention during brownouts. Use Value: ZZ-controlled sleep mode draws ≤35 µA while preserving contents - extending backup battery life beyond 72 hours. |
Use Scenario: Intermediate storage for digitized RF samples in phased-array radar front-ends requiring deterministic latency. IC Role / Device Role / Timing Role: Low-latency buffer staging ADC output before FFT processing; linear burst mode matches sequential sample ordering. Use Value: LBO-configurable linear burst provides contiguous 4-word reads aligned to 128-bit SIMD processing lanes - avoiding scatter/gather overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-65BAXI | 128K × 32-bit (4 Mbit); 65-pin BGA; no BW3/BW4; supports only linear burst | Lacks 4-byte granularity and interleaved burst - unsuitable for cache coherency protocols requiring interleaved addressing | Select when board space is constrained and 32-bit bus width suffices; verify ADV/LBO compatibility with controller |
| AS7C31026B-65PCN | 128K × 32-bit (4 Mbit); 100-pin TQFP; 3.3V; no ADV/ADSC/ADSP interface - simplified control | No burst address status inputs; requires external address sequencing logic - increases FPGA resource usage | Prefer for cost-sensitive designs where burst control is handled externally and industrial temp not required |
Compared with CY7C1371DV33-65BAXI and AS7C31026B-65PCN, the 71V3577S65PFG8 uniquely combines 36-bit width, TQFP-100 pinout, 6.5 ns speed, and full burst control (ADV/ADSP/ADSC/LBO) - making it the only drop-in option for legacy Renesas-based telecom platforms requiring pin- and function-level compatibility.
Availability
71V3577S65PFG8 is available at Aetrix Electronics and suitable for networking packet buffers, telecom line card caches, industrial PLC data logs, and radar signal processing buffers requiring stable component supply across extended product lifecycles.
Supply support for 71V3577S65PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V3577S family was designed specifically for high-reliability, high-bandwidth synchronous memory applications in telecom infrastructure and industrial control - emphasizing burst efficiency, low-latency flow-through outputs, and robust industrial temperature operation.
FAQ
What is the maximum clock frequency supported by the 71V3577S65PFG8?
The 71V3577S65PFG8 supports up to 133 MHz maximum clock frequency, achievable only in the TQFP-100 package under commercial temperature conditions (0°C to +70°C) with 6.5 ns access time. At industrial temperatures (–40°C to +85°C), the maximum rated frequency is 117 MHz (7.5 ns).
Does the 71V3577S65PFG8 support both linear and interleaved burst modes?
Yes, the 71V3577S65PFG8 supports both burst modes via the LBO (Linear Burst Order) pin: LBO = LOW selects linear sequence; LBO = HIGH selects interleaved sequence. This configuration is static and must remain stable during operation to prevent burst corruption.
How does the 71V3577S65PFG8 handle power-down and data retention?
The 71V3577S65PFG8 enters full sleep mode when ZZ is driven HIGH, reducing supply current to ≤35 µA while guaranteeing data retention. VDD and VDDQ must remain within specification (3.135 V–3.465 V); data is retained as long as power is applied and temperature stays within rated range.
What is the function of the ADV, ADSP, and ADSC pins on the 71V3577S65PFG8?
ADSP (Address Status from Processor) and ADSC (Address Status from Cache Controller) are synchronous inputs that trigger loading of the address register on the rising CLK edge. ADV (Burst Address Advance) controls whether the internal burst counter increments - LOW enables burst progression; HIGH suspends it for single-word access.
Can the 71V3577S65PFG8 operate in 256K × 18-bit configuration?
Yes, the 71V3577S65PFG8 supports 256K × 18-bit organization by remapping address lines: A17 becomes active, and BW3/BW4 are unused (NC). Pin configurations differ between 128K×36 and 256K×18 modes - refer to Renesas' PKG100 pinout diagrams for correct layout implementation.
71V3577S65PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3577S65PFG8 FAQ
1.How can I place an order for 71V3577S65PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3577S65PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3577S65PFG8 reliable?
The price and inventory of 71V3577S65PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3577S65PFG8 is usually 5 days.
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Once your 71V3577S65PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3577S65PFG8?
For technical support, including 71V3577S65PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3577S65PFG8 requirements.
6.How does Aetrix verify that 71V3577S65PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V3577S65PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3577S65PFG8 meets industry standards.
7.What is the process for return or replacement of 71V3577S65PFG8?
All 71V3577S65PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3577S65PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3577S65PFG8 part is unused and in its original packaging.
Return procedure for 71V3577S65PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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