Renesas 71V3577S75BQ8
- Part No.:
- 71V3577S75BQ8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3577S75BQ8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,558
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V3577S75BQ8 from Renesas Electronics is a 128K × 36-bit (4.608 Mbit), 3.3V synchronous SRAM with flow-through output architecture, 7.5 ns access time at up to 117 MHz clock frequency, and burst counter support for cache-coherent systems. It features synchronous address latching via ADSP/ADSC, global and byte-level write control (GW/BW1–BW4), and linear/interleaved burst ordering via LBO pin.
For engineers reviewing the 71V3577S75BQ8 datasheet, 71V3577S75BQ8 pinout, 71V3577S75BQ8 application, or 71V3577S75BQ8 equivalent, this device is selected for high-bandwidth memory buffering in network processors, FPGA-based accelerators, and real-time DSP subsystems where single-cycle deselect, low-latency read-through, and deterministic burst timing are critical.
Technical Context
The 71V3577S75BQ8 implements a synchronous, register-controlled interface with no output registers-data flows directly from the memory array after tCD delay. Its internal burst counter advances on ADV=LOW and supports four-word bursts with address sequencing determined by LBO state (linear or interleaved) and A0/A1 bits.
All control inputs (CE, CS0, CS1, ADSP, ADSC, ADV, GW, BWE, BW1–BW4) are synchronous to CLK, while OE and ZZ are asynchronous. The device uses separate VDD (3.3 V core) and VDDQ (3.3 V I/O) supplies, enabling independent I/O voltage management and supporting JEDEC-compliant 3.3V signaling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.608 Mbit); supports 256K × 18-bit mode via pin configuration |
| Access Time / Max Clock | 7.5 ns / 117 MHz - guaranteed across commercial and industrial temperature ranges (−40°C to +85°C) |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); enables clean separation of logic and I/O power domains |
| Burst Mode Control | LBO input selects linear or interleaved 4-word burst sequence; ADV enables/disables burst advance per cycle |
| Power Management | ZZ input places device in full sleep mode (IZZ ≤ 35 µA); ISB1 standby current ≤ 35 mA when deselected |
| Output Architecture | Flow-through (no output register); tCD = 7.5 ns max ensures minimal read latency for pipelined systems |
| Write Flexibility | Global write (GW), byte write enable (BWE), and four independent byte writes (BW1–BW4) allow granular 9-bit data updates |
Pinout & Package
Packaged in a JEDEC-standard 100-pin TQFP (14 mm × 20 mm), the 71V3577S75BQ8 supports 128K × 36-bit configuration with dedicated address (A0–A17), control (CE, CS0, CS1, ADV, ADSP, ADSC, GW, BWE, BW1–BW4, OE, ZZ, LBO), clock (CLK), and bidirectional data (I/O0–I/O31, I/OP1–I/OP4) pins. VDD, VDDQ, and VSS pins are distributed for low-noise power delivery.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous address latch triggered by rising CLK edge combined with ADSP/ADSC assertion; defines 128K-word space |
| CLK | System Clock Input | Primary timing reference; all synchronous inputs sampled on rising edge; determines maximum operational frequency |
| ADSP / ADSC | Address Status Inputs | ADSP (processor) and ADSC (cache controller) load address register; both active-low and gated by CE |
| ADV | Burst Address Advance | Active-low signal that increments internal burst counter; HIGH suspends burst, enabling single-address operation |
| GW / BWE / BW1–BW4 | Write Control Inputs | GW enables full 36-bit write; BWE gates BWx signals; BW1–BW4 each control one 9-bit byte (I/O0–7/I/OP1, etc.) |
| OE | Asynchronous Output Enable | Directly controls I/O driver state; LOW enables outputs regardless of clock phase - critical for bus sharing |
| ZZ | Asynchronous Sleep Mode | Internally pulls down; HIGH disables internal clock and reduces supply current to ≤35 µA while retaining data |
| LBO | Burst Order Selection | Static input: LOW = linear burst (00→01→10→11), HIGH = interleaved burst (00→01→11→10); must not toggle during operation |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Pins | 36-bit bidirectional interface; input path registered on CLK rise; output path flow-through (no register delay) |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay - tCD = 7.5 ns enables direct integration into tight-timing CPU/FPGA read pipelines |
| Single-cycle deselect capability | Device exits active state within one clock cycle upon CE/CS deassertion - essential for multi-SRAM bus arbitration |
| Configurable burst addressing | LBO pin selects linear or interleaved 4-word burst order, matching processor/cache controller expectations without firmware change |
| Dual-supply I/O interface | Separate VDDQ allows independent 3.3V I/O rail optimization - improves signal integrity and noise immunity on dense PCBs |
| Low-power sleep mode | ZZ-driven full sleep draws ≤35 µA (industrial temp), preserving data while cutting dynamic power >95% vs. standby |
Applications
| Network Packet Buffering | FPGA Co-Processor Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/3 switches with line-rate forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency buffer between MAC and switching fabric; provides deterministic 7.5 ns read response under burst traffic. Use Value: Enables zero-drop packet processing at 10 Gbps+ by eliminating output register pipeline stalls and supporting burst-aligned DMA transfers. |
Use Scenario: Offloading compute-intensive tasks (e.g., encryption, filtering) from host CPU using FPGA-accelerated datapath. IC Role / Device Role / Timing Role: Shared memory interface between FPGA logic and external processor; synchronized via ADSP/ADSC handshake protocol. Use Value: Sustains 117 MHz sustained bandwidth with single-cycle deselect, allowing FPGA to rapidly switch contexts between multiple processing threads. |
| DSP Algorithm Acceleration | Real-Time Video Frame Buffer |
|
Use Scenario: Holding coefficient tables and intermediate results in radar signal processing or audio beamforming engines. IC Role / Device Role / Timing Role: Low-jitter memory resource for pipelined FFT and FIR operations; burst mode matches sequential coefficient fetch patterns. Use Value: Linear burst mode (LBO=LOW) delivers four consecutive 36-bit words in 4×CLK cycles - matching native DSP instruction width and reducing bus overhead. |
Use Scenario: Dual-port frame storage for HD video capture/playback in broadcast equipment or medical imaging systems. IC Role / Device Role / Timing Role: Synchronous SRAM acting as line buffer or field memory; interfaced to image sensor and display controller via shared CLK domain. Use Value: Flow-through outputs ensure pixel data appears on bus within 7.5 ns of clock edge - critical for sub-microsecond timing budgets in 60 fps+ video pipelines. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1375DV33-133AXC | 128K × 36-bit, 133 MHz max, 6.5 ns access; only available in commercial temp range (0°C to +70°C) | Lacks industrial temperature rating and ZZ sleep mode; requires tighter timing margin on ADV/LBO setup | Select when system operates exclusively in commercial environment and demands highest possible clock rate |
| AS7C33128PFSIG | 128K × 36-bit, 10 ns access, 100 MHz max; supports industrial temp but no burst counter or LBO control | No linear/interleaved burst selection; relies on external logic for burst sequencing; higher tCD increases pipeline latency | Choose for cost-sensitive industrial designs where burst flexibility is unnecessary and 10 ns latency is acceptable |
Compared with CY7C1375DV33-133AXC and AS7C33128PFSIG, the 71V3577S75BQ8 uniquely combines industrial temperature support, hardware-configurable burst order, and full-sleep mode - making it optimal for ruggedized telecom and defense systems requiring both reliability and timing precision.
Availability
71V3577S75BQ8 is available at Aetrix Electronics and suitable for network infrastructure, FPGA acceleration, and real-time DSP applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing from authorized channels.
Supply support for 71V3577S75BQ8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V3577S75BQ8 belongs to Renesas' high-performance synchronous SRAM product line, engineered for low-latency, burst-capable memory interfacing in demanding real-time systems such as routers, baseband units, and radar processors.
FAQ
What is the maximum operating frequency of the 71V3577S75BQ8?
The 71V3577S75BQ8 supports up to 117 MHz clock frequency with guaranteed 7.5 ns access time across both commercial and industrial temperature ranges. This speed is validated for the 128K × 36-bit configuration in the 100-pin TQFP package, and timing compliance is ensured under worst-case VDD = 3.135 V and TA = +85°C conditions.
Does the 71V3577S75BQ8 support both linear and interleaved burst modes?
Yes, the 71V3577S75BQ8 supports both burst modes via the LBO (Linear Burst Order) pin: LBO = LOW selects linear burst (00→01→10→11), and LBO = HIGH selects interleaved burst (00→01→11→10). The burst sequence is fully hardware-defined and requires no software configuration - the 71V3577S75BQ8 executes it autonomously using its internal counter.
How does the flow-through output architecture benefit system timing in the 71V3577S75BQ8?
The flow-through output architecture of the 71V3577S75BQ8 eliminates output register delay, delivering valid data within 7.5 ns of the rising CLK edge (tCD). This enables direct connection to FPGA or ASIC input registers without added pipeline stages, reducing total read latency by up to one clock cycle compared to registered-output SRAMs - a critical advantage in high-frequency datapaths.
Can the 71V3577S75BQ8 operate in industrial temperature environments?
Yes, the 71V3577S75BQ8 is qualified for industrial temperature operation from −40°C to +85°C. This rating applies to all speed grades (7.5 ns, 8.0 ns, 8.5 ns) and is verified across DC and AC parameters including IDD, ISB1, tCD, tSA, and tHA. The 71V3577S75BQ8 maintains full functionality and timing compliance across this full range.
What is the function of the ZZ pin on the 71V3577S75BQ8?
The ZZ pin on the 71V3577S75BQ8 is an asynchronous sleep mode input: when driven HIGH, it internally gates the CLK signal and reduces supply current to ≤35 µA (industrial grade) while guaranteeing data retention. The 71V3577S75BQ8 exits sleep mode synchronously on the next rising CLK edge after ZZ returns LOW, with tZZR = 100 ns recovery time required before valid accesses resume.
71V3577S75BQ8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 117 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 7.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3577S75BQ8 FAQ
1.How can I place an order for 71V3577S75BQ8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3577S75BQ8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3577S75BQ8 reliable?
The price and inventory of 71V3577S75BQ8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3577S75BQ8 is usually 5 days.
3.What payment methods are accepted for 71V3577S75BQ8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3577S75BQ8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3577S75BQ8?
71V3577S75BQ8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3577S75BQ8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3577S75BQ8?
For technical support, including 71V3577S75BQ8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3577S75BQ8 requirements.
6.How does Aetrix verify that 71V3577S75BQ8 is sourced from the original manufacturer or authorized distributors?
All 71V3577S75BQ8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3577S75BQ8 meets industry standards.
7.What is the process for return or replacement of 71V3577S75BQ8?
All 71V3577S75BQ8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3577S75BQ8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3577S75BQ8 part is unused and in its original packaging.
Return procedure for 71V3577S75BQ8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3577S75BQ8 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

