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Renesas 71V3577S75PFG

Part No.:
71V3577S75PFG
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3577S75PFG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,087

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Product details

Overview

71V3577S75PFG from Renesas Electronics is a 128K × 36-bit (4.608 Mb), 3.3V synchronous SRAM with flow-through output architecture, 7.5 ns access time at up to 117 MHz, and burst counter support for high-bandwidth cache and buffer applications in networking and telecom systems.

For engineers reviewing the 71V3577S75PFG datasheet, 71V3577S75PFG pinout, 71V3577S75PFG application, or 71V3577S75PFG equivalent, this device delivers deterministic timing, single-cycle deselect, linear/interleaved burst mode selection via LBO, and industrial-grade reliability across –40°C to +85°C.

Technical Context

The 71V3577S75PFG implements a synchronous, clock-driven interface with registered address and data inputs, flow-through (unregistered) outputs, and internal burst address generation triggered by ADV. Its dual-bank chip select (CS0/CS1) and CE enable hierarchical memory mapping in multi-processor systems.

Burst operation is controlled by ADV (active-low), LBO (linear/interleaved mode), and synchronized write logic using GW, BWE, and BW1–BW4 byte enables. Power management includes asynchronous ZZ sleep mode with guaranteed data retention and sub-35 µA ISB1 standby current.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.608 Mbit); supports 256K × 18-bit configuration via pin strapping
Access Time / Max Frequency 7.5 ns / 117 MHz - guarantees deterministic read latency for real-time packet buffering
Supply Voltages VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - compatible with 3.3V system rails without level shifting
Burst Mode Four-word burst with programmable order (LBO pin) - reduces bus cycles by 75% per address fetch
Operating Temperature –40°C to +85°C (industrial grade) - qualified for base station, industrial control, and edge compute environments
Power Down Current IZZ ≤ 35 µA - enables low-power idle states in always-on network infrastructure
Package 100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated PCB assembly

Pinout & Package

71V3577S75PFG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs Synchronous address latching on rising CLK edge with ADSP/ADSC; A0–A16 used for 128K×36 mode
CLK Clock Input Primary timing reference; all synchronous operations aligned to rising edge
CE, CS0, CS1 Chip Enable / Selects Three-level decode (CE active-low, CS0 active-high, CS1 active-low) enables bank isolation in multi-SRAM systems
ADV Burst Address Advance Active-low signal that increments internal burst counter; HIGH suspends burst sequence
LBO Linear/Interleaved Burst Order Asynchronous static input: LOW = linear (00→01→10→11), HIGH = interleaved (00→01→11→10)
GW, BWE, BW1–BW4 Write Control Inputs GW enables full 36-bit writes; BWE gates byte enables; BW1–BW4 each control one 9-bit byte (I/O0–7+I/OP1, etc.)
OE Output Enable Asynchronous control of I/O drivers; LOW enables flow-through output, HIGH forces high-Z
ZZ Sleep Mode Asynchronous HIGH entry into full sleep mode; internal clock gating and <35 µA IZZ current
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional synchronous data path; no output register (true flow-through)
VDD, VDDQ, VSS Power/Ground Dual-supply design: VDD powers core logic, VDDQ powers I/O buffers - minimizes switching noise coupling

Key Features

Feature Design Value
Flow-through output architecture Zero-cycle output registration eliminates pipeline delay - critical for cache tag lookups and real-time buffering
Single-cycle deselect Chip deactivation completes within one clock cycle - prevents bus contention during rapid context switches
Self-timed write cycle Internal timing decision deferred until end of cycle - simplifies system timing margining and supports variable-latency buses
Programmable burst order (LBO) Hardware-selectable linear or interleaved addressing - matches CPU cache line layouts (e.g., ARM vs. x86)
Industrial temperature range –40°C to +85°C operation with full AC/DC specs - validated for uncontrolled ambient deployments
Low-power sleep mode (ZZ) Full clock gating and <35 µA supply current - enables energy-proportional memory in always-on edge nodes

Applications

Network Packet Buffering Telecom Line Card Cache

Use Scenario: Storing ingress/egress packet headers and metadata in 10G/25G Ethernet switch ASICs.

IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet descriptor buffer with deterministic 7.5 ns read access.

Use Value: Enables wire-speed forwarding by delivering four consecutive descriptors per burst, reducing PCIe/AXI bus occupancy by 75%.

Use Scenario: Serving as instruction/data cache for DSPs and RISC processors in 4G/5G radio units.

IC Role / Device Role / Timing Role: Synchronous SRAM providing burst-aligned code fetch and scratchpad storage with single-cycle deselect.

Use Value: Eliminates cache refill stalls via linear burst mode matching processor prefetch patterns, improving MIPS/Watt efficiency.

Industrial PLC Data Logging Test Equipment Pattern Memory

Use Scenario: Capturing sensor timestamps and analog channel samples in deterministic real-time control loops.

IC Role / Device Role / Timing Role: Buffered memory interfacing directly to FPGA logic with precise clock-aligned writes and flow-through reads.

Use Value: Guarantees jitter-free sampling at 117 MHz with industrial temp stability - no external timing compensation required.

Use Scenario: Storing high-speed digital test vectors in ATE systems requiring repeatable, glitch-free stimulus playback.

IC Role / Device Role / Timing Role: Deterministic SRAM with self-timed writes and burst read capability for pattern sequencer engines.

Use Value: Supports 100+ MHz vector rates with zero setup/hold violations due to registered inputs and flow-through outputs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-7BBXC 128K × 36, 7 ns, 144-ball FBGA only; no TQFP option; requires external termination resistors Targeted at space-constrained ATE and high-density modules where BGA is acceptable Choose when board area is constrained and BGA assembly is available; avoid if TQFP rework or thermal cycling reliability is critical.
AS7C33128PFSIG 128K × 36, 8 ns, commercial-only (0°C to +70°C); 100-pin TQFP; no LBO or ADV pins Suitable for cost-sensitive, non-industrial embedded controllers with fixed burst behavior Choose for lower-cost consumer or lab equipment where industrial temp and programmable burst order are unnecessary.

Compared with CY7C1371DV33-7BBXC and AS7C33128PFSIG, the 71V3577S75PFG uniquely combines industrial temperature rating, TQFP packaging, hardware-configurable burst order (LBO), and single-cycle deselect - making it optimal for field-deployable telecom and industrial systems requiring long-term reliability and timing flexibility.

Availability

71V3577S75PFG is available at Aetrix Electronics and suitable for network packet buffering, telecom line card caching, industrial PLC data logging, and ATE pattern memory applications requiring stable component supply, long-lifecycle support, and industrial-grade qualification.

Supply support for 71V3577S75PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V3577S75PFG belongs to Renesas' high-performance synchronous SRAM product line, engineered for deterministic timing, low-power operation, and robustness in mission-critical communications and control systems.

FAQ

What memory organization does the 71V3577S75PFG support?

The 71V3577S75PFG supports two configurations: 128K × 36-bit (4.608 Mbit) and 256K × 18-bit (4.608 Mbit), selected via pin strapping. In 128K × 36 mode, address lines A0–A16 are used; in 256K × 18 mode, A0–A17 are active. Both deliver identical total capacity with different data bus widths to match system interface requirements.

Does the 71V3577S75PFG support both linear and interleaved burst modes?

Yes, the 71V3577S75PFG supports both burst orders via the LBO (Linear Burst Order) pin. When LBO is LOW, the device uses linear addressing (00→01→10→11); when HIGH, it uses interleaved order (00→01→11→10). This hardware-selectable feature ensures compatibility with diverse CPU cache architectures without firmware changes.

What is the significance of the flow-through output architecture in the 71V3577S75PFG?

The flow-through output architecture means the 71V3577S75PFG has no output register - data appears at the I/O pins after tCD (e.g., 7.5 ns) from the rising CLK edge, with no additional clock-cycle delay. This eliminates pipeline latency, enabling true zero-cycle-read performance essential for cache tag arrays and real-time packet inspection engines.

How does the 71V3577S75PFG handle power management in low-activity periods?

The 71V3577S75PFG implements three power states: active (IDD ≤ 255 mA), standby (ISB1 ≤ 35 mA), and full sleep (IZZ ≤ 35 µA). Sleep mode is entered asynchronously via the ZZ pin, which gates the internal clock and retains data without refresh. This allows dynamic power scaling in burst-oriented traffic patterns common in networking gear.

Is the 71V3577S75PFG pin-compatible with other devices in the 71V3577/79 family?

Yes, the 71V3577S75PFG shares identical pinout and package (100-pin TQFP) with other speed grades (e.g., 71V3577S85PFG) and the 71V3579S variants. However, 71V3579S omits BW3/BW4 pins and supports only 256K × 18 mode - so direct substitution requires verification of byte-enable usage and memory configuration in the target design.

71V3577S75PFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
117 MHz
Write Cycle Time - Word, Page:
-
Access Time:
7.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3577S75PFG FAQ

1.How can I place an order for 71V3577S75PFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3577S75PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3577S75PFG reliable?

The price and inventory of 71V3577S75PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3577S75PFG is usually 5 days.

3.What payment methods are accepted for 71V3577S75PFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3577S75PFG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3577S75PFG?

71V3577S75PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3577S75PFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3577S75PFG?

For technical support, including 71V3577S75PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3577S75PFG requirements.

6.How does Aetrix verify that 71V3577S75PFG is sourced from the original manufacturer or authorized distributors?

All 71V3577S75PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3577S75PFG meets industry standards.

7.What is the process for return or replacement of 71V3577S75PFG?

All 71V3577S75PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3577S75PFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3577S75PFG part is unused and in its original packaging.

Return procedure for 71V3577S75PFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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