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Renesas 71V3577S75PFGI

Part No.:
71V3577S75PFGI
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3577S75PFGI.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,506

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Product details

Overview

71V3577S75PFGI from Renesas Electronics is a 128K × 36-bit (4.608 Mb), 3.3V synchronous SRAM with flow-through output architecture, 7.5 ns access time at up to 117 MHz clock frequency, and industrial temperature support (–40°C to +85°C). It features burst counter logic, linear/interleaved burst mode selection via LBO pin, and single-cycle deselect for high-speed cache and buffer applications in networking and telecom systems.

For engineers reviewing the 71V3577S75PFGI datasheet, 71V3577S75PFGI pinout, 71V3577S75PFGI application, or 71V3577S75PFGI equivalent, key selection criteria include its TQFP-100 package, synchronous 36-bit data bus, 3.3V core/I/O supply, flow-through read path, and support for self-timed write with byte-level granularity via BW1–BW4 and BWE.

Technical Context

The 71V3577S75PFGI implements a synchronous, clock-driven interface with registered address, control, and data inputs, but no output register - enabling true flow-through read timing. Its internal burst address counter advances on ADV=LOW and supports four-word bursts with sequence order determined by the static LBO input (linear or interleaved).

Write operations are controlled synchronously via GW (global), BWE (byte write enable), and BW1–BW4 (individual 9-bit byte enables), allowing selective writes without disabling outputs. Power management includes asynchronous ZZ sleep mode (≤35 µA standby current) and CMOS-compatible I/O with 3.3V VDDQ and VDD supplies.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36-bit (4.608 Mbit); supports 256K × 18-bit mode via address mapping
Access Time / Max Frequency 7.5 ns / 117 MHz (commercial & industrial temp); 6.5 ns / 133 MHz only in TQFP commercial grade
Supply Voltages VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O); separate power domains
Burst Mode Four-word burst with programmable linear or interleaved sequence via LBO pin
Power Management Asynchronous ZZ sleep mode; ISB1 ≤35 mA (standby), IZZ ≤35 µA (full sleep)
Output Architecture Flow-through (no output register); tCD = 7.5 ns max; tOE = 3.5 ns max
Package JEDEC-standard 100-pin TQFP (14 mm × 20 mm); PFGI suffix denotes industrial temp, lead-free

Pinout & Package

71V3577S75PFGI is packaged in a 100-pin thin quad flatpack (TQFP), JEDEC standard PKG100, with 0.5 mm pitch and exposed thermal pad. Pin 1 is marked by dot or beveled corner; top-side marking includes "71V3577S75PFGI" and date code.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs Synchronous address latching on rising CLK edge when ADSP/ADSC active; A0–A16 used for 128K×36, A0–A17 for 256K×18
CLK Clock Input Primary timing reference; all synchronous inputs sampled on rising edge
CE, CS0, CS1 Chip Enable / Selects Three-level chip select hierarchy: CE (active LOW), CS0 (active HIGH), CS1 (active LOW)
GW, BWE, BW1–BW4 Write Controls GW enables full 36-bit write; BWE gates BWx; BW1–BW4 each control one 9-bit byte (I/O0–7/I/OP1, etc.)
ADV, ADSP, ADSC Burst & Address Status ADV advances burst counter; ADSP (processor) and ADSC (cache) load address register synchronously
LBO Burst Order Select Asynchronous static input: LBO=LOW → linear burst; LBO=HIGH → interleaved burst
ZZ Sleep Mode Asynchronous HIGH activates full sleep mode; internal CLK gating; data retention guaranteed
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional bus; input path registered, output path flow-through; VDDQ-referenced
VDD, VDDQ, VSS Power/Ground VDD (core), VDDQ (I/O), and VSS (ground) require separate decoupling; multiple pins per domain

Key Features

Feature Design Value
Flow-through output architecture Eliminates output register delay; enables minimum tCD = 7.5 ns read-to-data timing critical for cache subsystems
Programmable burst sequence LBO pin selects linear or interleaved 4-word burst order - matches CPU/cache controller addressing patterns
Single-cycle deselect Chip deactivation completes within one clock cycle, reducing bus turnaround latency in multi-device systems
Byte-selectable write capability Four independent 9-bit byte enables (BW1–BW4) allow partial writes without masking or extra cycles
Industrial temperature operation Rated –40°C to +85°C with validated DC/AC specs; suitable for base station, industrial control, and avionics

Applications

Networking Packet Buffer Telecom Line Card Cache

Use Scenario: High-speed packet buffering in 10G Ethernet switch ASIC interfaces requiring low-latency, burst-capable memory.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as first-level packet descriptor cache with flow-through reads and burst-aligned writes.

Use Value: 7.5 ns tCD and 117 MHz clock support enable sub-10 ns effective read latency; burst mode delivers four descriptors per address cycle.

Use Scenario: Real-time signal processing buffer in DOCSIS 3.1 cable modem line cards handling upstream/downstream channel aggregation.

IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via burst reads/writes synchronized to DSP clock domain.

Use Value: Byte-write enables (BW1–BW4) allow precise payload updates without disturbing adjacent channel metadata in shared memory space.

Industrial PLC Data Log Radar Signal Preprocessing Buffer

Use Scenario: Cyclic data logging in ruggedized programmable logic controllers operating across –40°C to +85°C ambient.

IC Role / Device Role / Timing Role: Nonvolatile-backed SRAM buffer storing sensor timestamps and values before flash transfer.

Use Value: ZZ sleep mode reduces idle power to ≤35 µA while retaining data - extends battery backup runtime during brownouts.

Use Scenario: Intermediate storage for digitized RF samples in phased-array radar front-end modules with deterministic timing constraints.

IC Role / Device Role / Timing Role: Synchronous FIFO replacement with burst-aligned read/write for ADC-DSP handoff.

Use Value: Linear burst mode (LBO=LOW) matches sequential ADC sample ordering; tCLZ = 0 ns ensures immediate output activation after OE assertion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
71V3579S75PFGI Same family, 256K × 18 organization; uses A0–A17 address space; no BW3/BW4 pins Better suited for 18-bit bus systems (e.g., legacy DSP interfaces); lower pin count utilization in TQFP Select when system bus width is 18-bit and higher density (4.608 Mb same, but different word width) is required
CY7C1371DV33-75BGXI Cypress (Infineon) 128K × 32-bit QDR SRAM; 75 MHz max; differential clock; no burst counter Designed for dual-data-rate read/write; lacks LBO/ADV burst control; requires separate read/write clocks Choose for QDR protocol compatibility; avoid if burst-addressing or flow-through timing is mandatory

Compared with 71V3577S75PFGI, the 71V3579S75PFGI offers identical speed and packaging but reorganizes memory as 256K × 18 - simplifying 18-bit designs but removing two byte enables. The CY7C1371DV33-75BGXI provides QDR functionality at lower frequency but lacks synchronous burst logic and flow-through output timing.

Availability

71V3577S75PFGI is available at Aetrix Electronics and suitable for networking packet buffers, telecom line card caches, industrial PLC data logs, and radar signal preprocessing buffers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for 71V3577S75PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V3577S series belongs to Renesas' high-speed synchronous SRAM product line, engineered for low-latency, burst-capable memory subsystems in telecom infrastructure, network switches, and real-time embedded systems.

FAQ

What is the maximum clock frequency supported by the 71V3577S75PFGI?

The 71V3577S75PFGI supports up to 117 MHz clock frequency with 7.5 ns access time across both commercial and industrial temperature ranges. A faster 6.5 ns / 133 MHz variant exists but is restricted to TQFP packaging and commercial temperature only - not applicable to the 71V3577S75PFGI industrial-grade part.

Does the 71V3577S75PFGI support both linear and interleaved burst modes?

Yes, the 71V3577S75PFGI supports both burst modes via the LBO (Linear Burst Order) pin. When LBO is driven LOW, the device executes linear burst sequencing; when HIGH, it uses interleaved burst order. This selection is static and must remain stable during operation.

How does the flow-through output architecture of the 71V3577S75PFGI improve system timing?

The 71V3577S75PFGI's flow-through output architecture eliminates the output register delay found in pipelined SRAMs, delivering valid data within 7.5 ns after the rising CLK edge (tCD). This enables tighter read-to-use timing margins in cache and buffer applications where latency directly impacts throughput.

Can the 71V3577S75PFGI operate with different supply voltages for core and I/O?

No - the 71V3577S75PFGI requires matched 3.3 V ±5% supplies for both VDD (core) and VDDQ (I/O). While the pins are physically separate to support independent decoupling, the specification mandates identical nominal voltage and tolerance; using mismatched supplies violates absolute maximum ratings.

What is the function of the ADV pin on the 71V3577S75PFGI?

The ADV (Burst Address Advance) pin on the 71V3577S75PFGI is a synchronous input that controls burst counter progression. When ADV is LOW on the rising CLK edge, the internal burst counter advances to the next address in the sequence. When ADV is HIGH, burst advancement is suspended, holding the current address for repeated access.

71V3577S75PFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
117 MHz
Write Cycle Time - Word, Page:
-
Access Time:
7.5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3577S75PFGI FAQ

1.How can I place an order for 71V3577S75PFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3577S75PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3577S75PFGI reliable?

The price and inventory of 71V3577S75PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3577S75PFGI is usually 5 days.

3.What payment methods are accepted for 71V3577S75PFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3577S75PFGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V3577S75PFGI?

71V3577S75PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3577S75PFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3577S75PFGI?

For technical support, including 71V3577S75PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3577S75PFGI requirements.

6.How does Aetrix verify that 71V3577S75PFGI is sourced from the original manufacturer or authorized distributors?

All 71V3577S75PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3577S75PFGI meets industry standards.

7.What is the process for return or replacement of 71V3577S75PFGI?

All 71V3577S75PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V3577S75PFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3577S75PFGI part is unused and in its original packaging.

Return procedure for 71V3577S75PFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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