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Renesas 71V3577S80BQI8

Part No.:
71V3577S80BQI8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V3577S80BQI8.pdf
Description:
IC SRAM 4.5MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,327

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Product details

Overview

71V3577S80BQI8 from Renesas Electronics is a 128K × 36-bit (4.608 Mb) synchronous SRAM with 3.3V core and I/O supply, flow-through output architecture, and burst counter logic. It supports 8.0 ns access time at up to 100 MHz clock frequency in industrial temperature range (–40°C to +85°C), and is packaged in a 100-pin TQFP. It serves as high-speed buffer memory in network packet processors and cache-coherent subsystems.

For engineers reviewing the 71V3577S80BQI8 datasheet, 71V3577S80BQI8 pinout, 71V3577S80BQI8 application, or 71V3577S80BQI8 equivalent, key selection criteria include burst mode support (linear/interleaved via LBO), single-cycle deselect capability, self-timed write with byte- or global-write control, and industrial-grade power-down (ZZ) and standby current specs.

Technical Context

This device implements a synchronous, clock-driven interface with registered address and data inputs, but unregistered (flow-through) outputs - enabling minimal read latency. Its internal burst counter advances on ADV=LOW and generates four consecutive addresses based on A0/A1 and LBO state, supporting both linear and interleaved sequences.

Write operations are fully synchronous and configurable: global write (GW) enables full 36-bit writes, while BWE + BW1–BW4 allow independent 9-bit byte writes. Chip enable (CE), dual chip selects (CS0/CS1), and asynchronous OE and ZZ provide flexible system-level control and low-power sleep entry without clock gating dependency.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization128K × 36-bit (4.608 Mbit); also configurable as 256K × 18-bit in same package
Access Time / Max Frequency8.0 ns access time; supports up to 100 MHz clock in industrial temperature range
Supply VoltagesVDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O); separate power domains reduce noise coupling
Operating TemperatureIndustrial grade: –40°C to +85°C; validated for extended thermal cycling in embedded infrastructure
Power Consumption180 mA typical active current (8.0 ns); 30 mA CMOS standby (ISB1); 30 µA full sleep (IZZ)
Burst Mode ControlLBO pin selects linear or interleaved 4-word burst sequence; static configuration, no runtime switching
Output ArchitectureFlow-through (no output register): data appears tCD after CLK rise - critical for deterministic timing in pipelined systems

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per Renesas 71V3577S_79S datasheet Rev. 6.42 (Sep 2023), Figure 02a (128K×36 configuration).

Pin/Terminal Circuit Role Design Meaning
A0–A17Address InputsSynchronous address latching on rising CLK edge gated by ADSP/ADSC; A0–A16 used for 128K×36 addressing
CLKClock InputPrimary timing reference; all synchronous inputs sampled on rising edge; no internal PLL or divider
GW, BWE, BW1–BW4Write Control InputsGW enables full 36-bit write; BWE enables byte write; BW1–BW4 select individual 9-bit bytes (I/O0–7/I/OP1, etc.)
ADV, ADSP, ADSCBurst & Address StatusADV advances internal burst counter; ADSP (processor) and ADSC (cache controller) load address register synchronously
LBOBurst Order SelectAsynchronous static input: LOW = linear burst, HIGH = interleaved burst; must remain stable during operation
ZZSleep Mode EnableAsynchronous high-active input; gates internal clock and reduces ICC to 30 µA; retains data in sleep mode
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus; input path registered, output path flow-through; VDDQ-referenced I/O voltage domain
OEOutput EnableAsynchronous low-active control; enables/disables output drivers independently of clock or chip select state

Key Features

Feature Design Value
Flow-through output architectureEliminates output register delay: tCD = 8.0 ns max ensures predictable read-to-data timing in real-time pipelines
Single-cycle deselectChip deactivation completes within one CLK cycle - essential for dynamic bus arbitration in multi-master systems
Configurable burst order (LBO)Hardware-selectable linear or interleaved 4-word burst sequence matches CPU/cache controller addressing patterns
Self-timed write cycleInternal timing logic resolves write completion without external wait-state generation - simplifies controller design
Dual supply domains (VDD/VDDQ)Separate core and I/O supplies suppress switching noise coupling and improve signal integrity on data bus
Industrial temperature supportFull functionality and timing compliance verified from –40°C to +85°C - suitable for telecom and industrial control

Applications

Network Packet Buffering Cache-Coherent Subsystem

Use Scenario: High-throughput line cards in enterprise switches buffering ingress/egress packet headers and metadata.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as low-latency, burst-capable first-level packet buffer between MAC and traffic manager.

Use Value: 8.0 ns tCD and flow-through outputs enable sub-10 ns read turnaround - critical for maintaining wire-speed forwarding at 10 Gbps+.

Use Scenario: Shared memory pool between multiple RISC-V or ARM cores with hardware cache coherency protocols.

IC Role / Device Role / Timing Role: Coherent shared SRAM providing atomic read-modify-write and burst-accessible scratchpad space.

Use Value: Single-cycle deselect and burst counter support tightly coupled cache snoop responses with deterministic latency under contention.

Industrial PLC Data Logging Medical Imaging Frame Buffer

Use Scenario: Real-time data acquisition and timestamped logging in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Industrial-grade SRAM storing sensor snapshots and event logs with guaranteed data retention during brownouts.

Use Value: ZZ sleep mode draws only 30 µA while retaining full contents - extends backup battery life beyond 72 hours in fail-safe logging.

Use Scenario: Ultrasound or MRI front-end systems requiring rapid frame capture and parallel processing of pixel blocks.

IC Role / Device Role / Timing Role: Burst-accessible frame buffer interfacing directly to ADC/DAC and image processor via 36-bit wide bus.

Use Value: 128K×36 organization maps cleanly to 512×512×32-bit pixel buffers; LBO-configurable burst aligns with raster-scan or tile-based access.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
71V3579S80BQI8Same family, 256K×18 organization (same density); lacks BW3/BW4 pins; different pinout for byte-enable mappingBetter suited for 18-bit bus architectures (e.g., legacy DSP interfaces); not drop-in compatible due to pin reassignmentSelect when system uses 18-bit data path and requires identical timing/power specs with simplified byte-write control.
CY7C1372D-100BAXICypress (Infineon) 128K×32 sync SRAM; 100 MHz, 3.3V; no LBO or ADV; uses standard CE/OE/GW onlyLacks burst counter and ADV/LBO logic - requires external address sequencing; simpler control but higher controller overheadChoose when burst mode is unnecessary and board layout favors pin-compatible footprint with Cypress's 100-pin TQFP variant.

Compared with 71V3577S80BQI8, the 71V3579S80BQI8 offers identical speed and power but targets 18-bit buses, while CY7C1372D-100BAXI trades burst intelligence for broader second-source availability and reduced control pin count - impacting system-level timing predictability and firmware complexity.

Availability

71V3577S80BQI8 is available at Aetrix Electronics and suitable for network infrastructure, industrial automation, and medical imaging applications requiring stable component supply, long-term lifecycle assurance, and industrial-temperature performance.

Supply support for 71V3577S80BQI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V3577S/79S product line delivers high-speed synchronous SRAMs optimized for cache-coherent subsystems and real-time packet processing - emphasizing deterministic timing, low-power sleep modes, and robust industrial operation.

FAQ

What memory organization does the 71V3577S80BQI8 support?

The 71V3577S80BQI8 is organized as 128K × 36 bits (4.608 Mbit). It shares pin compatibility and timing with the 256K × 18-bit 71V3579S variant, but its internal array and pin mapping (e.g., BW3/BW4 presence) are fixed for the 128K×36 configuration. This organization supports 36-bit-wide data paths common in network processors and DSPs.

Does the 71V3577S80BQI8 support both linear and interleaved burst modes?

Yes, the 71V3577S80BQI8 supports both burst modes via the LBO (Linear Burst Order) pin. When LBO = LOW, it executes linear burst sequencing; when LBO = HIGH, it uses interleaved sequencing. The burst counter advances on ADV = LOW and always delivers four consecutive words per burst - a hardware feature confirmed in the functional block diagram and timing tables of the official datasheet.

What is the role of the ZZ pin on the 71V3577S80BQI8?

The ZZ pin on the 71V3577S80BQI8 is an asynchronous high-active sleep mode input. When asserted (HIGH), it internally gates the CLK signal and reduces supply current to 30 µA (IZZ) while guaranteeing full data retention. Unlike standby modes, ZZ requires no prior deselection and resumes operation within tZZR (100 ns) after deassertion - making it ideal for rapid power-gating in burst-oriented systems.

How does the flow-through output architecture benefit timing-critical designs using the 71V3577S80BQI8?

The flow-through output architecture of the 71V3577S80BQI8 eliminates output register delay, delivering valid data tCD (8.0 ns max) after the rising CLK edge. This deterministic, zero-cycle-output-register latency enables tight integration with pipelined controllers - especially valuable in network packet processors where read-to-use timing must be sub-10 ns to sustain 10 Gbps line rates without wait states.

Is the 71V3577S80BQI8 qualified for industrial temperature operation?

Yes, the 71V3577S80BQI8 is explicitly rated for industrial temperature operation from –40°C to +85°C. All AC/DC specifications - including 8.0 ns access time, 100 MHz max frequency, ISB1 standby current (30 mA), and IZZ sleep current (30 µA) - are guaranteed across this range per Renesas datasheet Rev. 6.42. It is not qualified for extended or automotive grades beyond this specification.

71V3577S80BQI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V3577S80BQI8 FAQ

1.How can I place an order for 71V3577S80BQI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3577S80BQI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3577S80BQI8 reliable?

The price and inventory of 71V3577S80BQI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3577S80BQI8 is usually 5 days.

3.What payment methods are accepted for 71V3577S80BQI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3577S80BQI8 transactions.

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4.How is shipping managed for 71V3577S80BQI8?

71V3577S80BQI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3577S80BQI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3577S80BQI8?

For technical support, including 71V3577S80BQI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3577S80BQI8 requirements.

6.How does Aetrix verify that 71V3577S80BQI8 is sourced from the original manufacturer or authorized distributors?

All 71V3577S80BQI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3577S80BQI8 meets industry standards.

7.What is the process for return or replacement of 71V3577S80BQI8?

All 71V3577S80BQI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3577S80BQI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3577S80BQI8 part is unused and in its original packaging.

Return procedure for 71V3577S80BQI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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