Renesas 71V3577S80PFGI8
- Part No.:
- 71V3577S80PFGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3577S80PFGI8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:1,271
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Product details
Overview
71V3577S80PFGI8 from Renesas Electronics is a 128K × 36-bit (4.608 Mb), 3.3V synchronous SRAM with flow-through output architecture, 8.0 ns access time at 100 MHz, industrial temperature range (–40°C to +85°C), and JEDEC-standard 100-pin TQFP package. It supports linear/interleaved burst modes via LBO input and features single-cycle deselect for high-speed cache and buffer applications in networking and telecom systems.
For engineers reviewing the 71V3577S80PFGI8 datasheet, 71V3577S80PFGI8 pinout, 71V3577S80PFGI8 application, or 71V3577S80PFGI8 equivalent, key selection criteria include burst-mode timing compliance, ZZ-controlled sleep current (≤35 mA), flow-through read latency, byte-write granularity (BW1–BW4), and TQFP-100 thermal/mechanical compatibility with legacy PCB layouts.
Technical Context
The 71V3577S80PFGI8 implements a synchronous, clock-driven interface with registered address/data inputs and unregistered (flow-through) outputs - eliminating output register delay to achieve deterministic tCD = 8.0 ns. Its internal burst counter advances on ADV = LOW and selects sequence order via static LBO pin, supporting both linear and interleaved addressing for CPU/cache coherency.
Write control uses hierarchical enable logic: GW enables full 36-bit writes, while BWE gates individual BW1–BW4 signals controlling four 9-bit byte lanes. Power management includes asynchronous ZZ sleep mode (IZZ ≤ 35 mA) and synchronous standby (ISB1 ≤ 35 mA), with VDD/VDDQ decoupling required per JEDEC TQFP layout guidelines.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.608 Mbit); supports 256K × 18-bit via pin multiplexing |
| Access Time / Max Frequency | 8.0 ns @ 100 MHz (industrial temp); validated for sustained burst reads without wait states |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate rails reduce noise coupling |
| Burst Mode Control | LBO pin selects linear or interleaved 4-word burst sequence; static configuration, no runtime change |
| Power-Down Current | IZZ ≤ 35 mA in full sleep (ZZ = HIGH); enables low-power idle in packet buffering systems |
| Output Architecture | Flow-through (no output register); tCD = 8.0 ns guaranteed, enabling tight setup to next-stage latch |
| Temperature Range | Industrial: –40°C to +85°C; qualified for base station and industrial controller environments |
Pinout & Package
71V3577S80PFGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout conforms to PKG100 configuration for 128K × 36 organization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous 18-bit address bus; A0–A16 used for 128K × 36 (17 bits), A17 unused |
| CLK | Clock Input | Single-ended system clock reference; all synchronous inputs timed to rising edge |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data bus (32 data + 4 parity); flow-through output path |
| GW, BWE, BW1–BW4 | Write Controls | Global write (GW), byte-write enable (BWE), and four 9-bit byte masks (BW1–BW4) |
| ADV, ADSP, ADSC, OE, CE, CS0, CS1 | Control Inputs | ADV advances burst counter; ADSP/ADSC load address register; OE enables outputs asynchronously |
| LBO, ZZ | Configuration/Power | LBO selects burst order (linear/interleaved); ZZ enables hardware sleep mode (asynchronous) |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay; guarantees tCD = 8.0 ns for predictable timing closure in high-speed interfaces |
| Single-cycle deselect | Chip deactivation completes within one clock cycle, enabling rapid context switching in multi-bank memory systems |
| Configurable burst order (LBO) | Hardware-selectable linear or interleaved 4-word burst sequences to match CPU/cache line alignment requirements |
| Byte-granular write control | Four independent 9-bit byte enables (BW1–BW4) allow partial writes without read-modify-write overhead |
| Asynchronous sleep mode (ZZ) | Reduces supply current to ≤35 mA while retaining data; no clock or command sequencing required to enter/exit |
Applications
| High-Speed Packet Buffering | Cache Memory for RISC Processors |
|---|---|
Use Scenario: Storing ingress/egress packet headers and payloads in Layer 2/3 switches with line-rate throughput. IC Role / Device Role / Timing Role: Synchronous SRAM providing zero-wait-state burst reads/writes to match 100 MHz bus clocks. Use Value: 8.0 ns tCD and flow-through outputs enable direct connection to FPGA fabric or ASIC datapaths without additional pipeline stages. | Use Scenario: Serving as L2 cache for MIPS or ARM-based network processors requiring deterministic access latency. IC Role / Device Role / Timing Role: High-bandwidth, low-latency cache tag/data storage with burst-mode support for 32-byte cache lines. Use Value: Linear burst mode (LBO = LOW) delivers sequential 36-bit words matching processor cache-line fetch patterns. |
| Telecom Line Card Buffers | Industrial PLC Data Logging |
Use Scenario: Temporary storage of TDM frame buffers and jitter buffers in E1/T1 line interface units. IC Role / Device Role / Timing Role: Dual-port-capable SRAM interfaced via ADV/ADSP for seamless burst transfers between serial framers and host controllers. Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure reliable operation in uncontrolled cabinet environments. | Use Scenario: Cyclic data acquisition buffer in programmable logic controllers capturing sensor readings over extended intervals. IC Role / Device Role / Timing Role: Non-volatile-retentive memory buffer holding timestamped analog/digital I/O snapshots before SD card transfer. Use Value: Single-cycle deselect and 36-bit width reduce firmware overhead during high-frequency sampling bursts (≥10 kHz). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV102432BLL-10TLI | 1M × 32-bit (32 Mb), 10 ns access, 3.3V, 100-pin TQFP; no LBO or ADV pins; simpler control set | Lacks burst counter and configurable burst order; suited for non-cache, streaming FIFO use cases | Select when burst mode and linear/interleaved addressing are unnecessary and higher density is preferred |
| Cypress CY7C1356BV33-100AXI | 128K × 36-bit, 10 ns access, 3.3V, 100-pin TQFP; supports flow-through but no ZZ sleep mode | No hardware sleep control; higher ISB1 (50 mA) vs. 71V3577S80PFGI8's 35 mA standby | Select when lowest active power is not critical and legacy Cypress toolchain compatibility is required |
Compared with IS61WV102432BLL-10TLI and CY7C1356BV33-100AXI, the 71V3577S80PFGI8 uniquely combines industrial-temp 8.0 ns access, hardware-configurable burst order, and sub-35 mA sleep current - making it optimal for thermally constrained, burst-intensive telecom and embedded control designs.
Availability
71V3577S80PFGI8 is available at Aetrix Electronics and suitable for high-speed packet buffering, cache memory for RISC processors, and telecom line card buffers requiring stable component supply across industrial temperature grades and long production lifecycles.
Supply support for 71V3577S80PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V3577S product line delivers high-speed synchronous SRAMs optimized for burst-intensive, low-latency applications in networking equipment, base stations, and real-time control systems.
FAQ
What is the maximum operating frequency supported by the 71V3577S80PFGI8?
The 71V3577S80PFGI8 supports up to 100 MHz clock frequency with an 8.0 ns access time, validated across the industrial temperature range (–40°C to +85°C). This speed grade is specified for the 100-pin TQFP package and applies to both 128K × 36 and 256K × 18 configurations. The 71V3577S80PFGI8 achieves this performance using a flow-through output architecture that eliminates output register delay.
Does the 71V3577S80PFGI8 support both linear and interleaved burst modes?
Yes, the 71V3577S80PFGI8 supports both linear and interleaved burst modes via the LBO (Linear Burst Order) pin. When LBO = LOW, the device executes linear burst addressing; when LBO = HIGH, it uses interleaved addressing. This selection is static and must remain stable during operation. The burst counter advances on ADV = LOW and delivers four consecutive 36-bit words per initiated address.
What is the function of the ZZ pin on the 71V3577S80PFGI8?
The ZZ pin on the 71V3577S80PFGI8 is an asynchronous sleep mode input. When driven HIGH, it gates the internal clock and reduces supply current to ≤35 mA (IZZ) while maintaining full data retention. No command sequence or timing constraints are required to enter or exit sleep mode. The pin has an internal pull-down, so it defaults to active mode if left unconnected.
How many byte-write enable signals does the 71V3577S80PFGI8 provide?
The 71V3577S80PFGI8 provides four individual byte-write enable signals - BW1, BW2, BW3, and BW4 - each controlling a 9-bit segment of the 36-bit data bus. BW1 manages I/O0–I/O7 and I/OP1; BW2 controls I/O8–I/O15 and I/OP2; and so on. These operate under control of the synchronous BWE signal, allowing precise partial writes without read-modify-write cycles.
Is the 71V3577S80PFGI8 compatible with commercial-grade PCB footprints?
Yes, the 71V3577S80PFGI8 uses a JEDEC-standard 100-pin TQFP package (PKG100) with 0.5 mm pitch and 14 mm × 20 mm body dimensions, fully compatible with industry-standard commercial and industrial PCB footprints. Its pinout matches Renesas' documented PKG100 layout for 128K × 36 configuration, including dedicated VDD, VDDQ, and VSS rails distributed across the perimeter for optimal decoupling.
71V3577S80PFGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3577S80PFGI8 FAQ
1.How can I place an order for 71V3577S80PFGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3577S80PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3577S80PFGI8 reliable?
The price and inventory of 71V3577S80PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3577S80PFGI8 is usually 5 days.
3.What payment methods are accepted for 71V3577S80PFGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3577S80PFGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3577S80PFGI8?
71V3577S80PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3577S80PFGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3577S80PFGI8?
For technical support, including 71V3577S80PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3577S80PFGI8 requirements.
6.How does Aetrix verify that 71V3577S80PFGI8 is sourced from the original manufacturer or authorized distributors?
All 71V3577S80PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3577S80PFGI8 meets industry standards.
7.What is the process for return or replacement of 71V3577S80PFGI8?
All 71V3577S80PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3577S80PFGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3577S80PFGI8 part is unused and in its original packaging.
Return procedure for 71V3577S80PFGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3577S80PFGI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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