Renesas 71V3577S85BQG
- Part No.:
- 71V3577S85BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V3577S85BQG.pdf
- Description:
- IC SRAM 4.5MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,936
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Product details
Overview
71V3577S85BQG from Renesas Electronics is a 128K × 36-bit (4.608 Mb), 3.3V synchronous SRAM with flow-through output architecture, 8.5 ns access time at 87 MHz, TQFP-100 package, and industrial temperature support (–40°C to +85°C). It delivers burst-mode data streaming for high-bandwidth cache and buffer applications in networking and telecom line cards.
For engineers reviewing the 71V3577S85BQG datasheet, 71V3577S85BQG pinout, 71V3577S85BQG application, or 71V3577S85BQG equivalent, key selection criteria include its 8.5 ns tCD timing, linear/interleaved burst control via LBO, single-cycle deselect capability, and compatibility with 3.3V I/O systems requiring low-latency memory buffering.
Technical Context
This SRAM implements a synchronous, clock-driven interface with registered address and data inputs, unregistered (flow-through) outputs, and a 4-word burst counter driven by ADV and configured by LBO. It supports both global write (GW) and byte-selectable writes (BW1–BW4) under BWE control.
Its dual configuration-128K × 36 or 256K × 18-is determined by address mapping and pin strapping (e.g., A17 usage), with internal logic enabling self-timed write cycles and asynchronous sleep mode activation via ZZ input.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.608 Mbit); selectable 256K × 18-bit mode via address decoding |
| Access Time (tCD) | 8.5 ns - defines maximum clock-to-data delay for first burst word in flow-through read |
| Max Clock Frequency | 87 MHz - sustained operation limit for 8.5 ns speed grade under industrial conditions |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - requires separate low-noise 3.3V rails |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade embedded systems without derating |
| Power Consumption | ISB2 = 80 mA (clock running, deselected); IZZ = 30 µA (full sleep) - enables dynamic power gating |
| Burst Mode Control | LBO pin selects linear or interleaved 4-word burst sequence - determines address increment pattern for cache-line fills |
Pinout & Package
71V3577S85BQG is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout conforms to PKG100 footprint with dedicated VDD/VDDQ/VSS banks, 18 address inputs (A0–A17), 36 data I/Os plus 4 parity bits (I/O0–I/O31, I/OP1–I/OP4), and 12 control signals including ADV, ADSP, ADSC, GW, BWE, BW1–BW4, OE, CE, CS0, CS1, LBO, and ZZ.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous inputs latched on rising CLK edge with ADSP/ADSC assertion; define 128K×36 or 256K×18 addressing |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional data path with flow-through (unregistered) output; no output register latency |
| CLK | System Clock Input | Primary timing reference; all synchronous operations referenced to rising edge |
| ADV | Burst Address Advance | Active-low signal that increments internal burst counter; HIGH suspends burst sequence |
| LBO | Linear/Interleaved Burst Order | Static DC input selecting burst address pattern (LOW = linear, HIGH = interleaved) |
| ZZ | Sleep Mode Enable | Asynchronous HIGH entry into ultra-low-power sleep mode with data retention |
| OE | Output Enable | Asynchronous control of I/O drivers; LOW enables outputs, HIGH forces high-Z state |
| GW / BWE / BW1–BW4 | Write Control | GW enables full 36-bit write; BWE gates byte enables; BW1–BW4 select 9-bit bytes independently |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay - enables immediate data availability on first clock cycle after address load |
| Single-cycle deselect | Chip deactivation completes within one CLK cycle - critical for deterministic bus arbitration in real-time systems |
| Configurable burst order (LBO) | Hardware-selectable linear or interleaved 4-word burst - matches CPU/cache controller addressing expectations |
| Self-timed write cycle | Internal timing logic resolves write completion without external strobe - simplifies system timing closure |
| Independent core/I/O supplies (VDD/VDDQ) | Allows separate noise isolation and voltage optimization for logic and I/O domains - improves signal integrity |
Applications
| High-Speed Cache Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing instruction/data cache lines between processor and main memory in RISC-based baseband processors. IC Role / Device Role / Timing Role: Synchronous SRAM acting as zero-wait-state L2 cache buffer with burst-fill capability. Use Value: 8.5 ns tCD and 4-word burst reduce average memory access latency by >40% vs. non-burst DRAM interfaces. | Use Scenario: Frame buffering in OC-192/STM-64 packet switching ASICs handling 10 Gbps line rates. IC Role / Device Role / Timing Role: Flow-through SRAM providing deterministic latency for ingress/egress packet header storage. Use Value: Single-cycle deselect and 87 MHz clock enable precise packet boundary alignment without pipeline stalls. |
| Industrial PLC Data Logging | Avionics Sensor Interface Buffer |
Use Scenario: Capturing timestamped analog sensor readings in ruggedized programmable logic controllers. IC Role / Device Role / Timing Role: Industrial-temp SRAM storing sequential measurement bursts before DMA transfer to flash. Use Value: –40°C to +85°C rating and ZZ sleep mode ensure reliable operation during thermal cycling and power-save intervals. | Use Scenario: Interfacing multi-channel ADCs to flight control processors in DO-254-compliant avionics modules. IC Role / Device Role / Timing Role: Low-jitter, deterministic memory buffer synchronizing sampled sensor data to system clock domain. Use Value: 3.3V I/O compatibility and <7 pF I/O capacitance minimize signal distortion on high-speed parallel sensor buses. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1371DV33-85BAXI | 128K × 36, 85 MHz max, 8.5 ns tCD, but uses 165-ball fBGA only - no TQFP option | Requires PCB redesign for BGA layout; lacks LBO pin for burst-order selection | Choose when board space is constrained and BGA assembly is available; avoid if TQFP or configurable burst order is required. |
| AS7C3256A-85JCN | 128K × 36, 85 MHz, 8.5 ns tCD, TQFP-100, but asynchronous OE and no burst counter or ADV/LBO | Supports basic read/write only - no burst-mode acceleration or suspend capability | Choose for cost-sensitive legacy designs where burst functionality is unused; not suitable for cache-line fill applications. |
Compared with CY7C1371DV33-85BAXI and AS7C3256A-85JCN, the 71V3577S85BQG uniquely combines TQFP-100 packaging, industrial temperature range, flow-through outputs, and hardware-configurable burst ordering - making it optimal for new designs requiring deterministic low-latency buffering with minimal layout change.
Availability
71V3577S85BQG is available at Aetrix Electronics and suitable for high-reliability industrial control, telecom infrastructure, and avionics applications requiring stable component supply, long-term lifecycle management, and guaranteed industrial temperature performance.
Supply support for 71V3577S85BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V3577S family was designed specifically for high-bandwidth, low-latency buffering in cache-coherent subsystems and packet-processing pipelines where deterministic timing and burst efficiency are critical.
FAQ
What memory organization does the 71V3577S85BQG support?
The 71V3577S85BQG supports 128K × 36-bit (4.608 Mbit) organization by default, with pin-strapped compatibility for 256K × 18-bit mode using A17. This dual-mode flexibility allows system designers to optimize data bus width and address depth without changing the 71V3577S85BQG footprint or timing model.
Does the 71V3577S85BQG support burst mode, and how is it controlled?
Yes, the 71V3577S85BQG supports 4-word synchronous burst mode controlled by ADV (active-low) and LBO (linear/interleaved selector). ADV advances the internal burst counter on each clock edge; LBO sets the address increment pattern. Both signals are fully documented in the 71V3577S85BQG datasheet timing tables and functional description.
What is the significance of the "85" in 71V3577S85BQG?
The "85" in 71V3577S85BQG denotes the 8.5 ns access time (tCD) speed grade, validated across the industrial temperature range (–40°C to +85°C). This grade guarantees ≤8.5 ns clock-to-data delay for the first burst word under specified VDD/VDDQ and loading conditions, directly impacting system-level throughput in burst-intensive applications.
Can the 71V3577S85BQG operate with separate core and I/O supplies?
Yes, the 71V3577S85BQG requires two independent 3.3 V supplies: VDD (core logic) and VDDQ (I/O drivers). This separation allows independent filtering and noise management, improving signal integrity on high-speed data buses. The 71V3577S85BQG datasheet specifies strict decoupling requirements for both rails to maintain timing compliance.
How does the ZZ pin function in the 71V3577S85BQG?
The ZZ pin on the 71V3577S85BQG provides asynchronous entry into full sleep mode when driven HIGH, reducing supply current to 30 µA while retaining memory contents. It features an internal pull-down, so floating ZZ defaults to active mode. Recovery requires tZZR ≥100 ns after ZZ returns LOW, as defined in the 71V3577S85BQG AC characteristics table.
71V3577S85BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 87 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V3577S85BQG FAQ
1.How can I place an order for 71V3577S85BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3577S85BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V3577S85BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3577S85BQG is usually 5 days.
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6.How does Aetrix verify that 71V3577S85BQG is sourced from the original manufacturer or authorized distributors?
All 71V3577S85BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3577S85BQG meets industry standards.
7.What is the process for return or replacement of 71V3577S85BQG?
All 71V3577S85BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3577S85BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3577S85BQG part is unused and in its original packaging.
Return procedure for 71V3577S85BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3577S85BQG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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