Renesas 71V3577S85PFG8
- Part No.:
- 71V3577S85PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3577S85PFG8.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3577S85PFG8 from Renesas Electronics is a 128K × 36-bit (4.608 Mb), 3.3V synchronous SRAM with flow-through outputs, burst counter, and single-cycle deselect. It supports 8.5 ns access time at up to 87 MHz clock frequency, operates across industrial temperature range (–40°C to +85°C), and uses JEDEC-standard 100-pin TQFP packaging. It serves as high-speed cache or buffer memory in network packet processors and telecom line cards.
For engineers reviewing the 71V3577S85PFG8 datasheet, 71V3577S85PFG8 pinout, 71V3577S85PFG8 application, or 71V3577S85PFG8 equivalent, key selection criteria include burst mode configuration (LBO), synchronous write control (GW/BWE/BWx), flow-through output timing (tCD = 8.5 ns), and industrial-grade power-down behavior (IZZ = 30–35 µA).
Technical Context
The 71V3577S85PFG8 implements a synchronous, clock-driven architecture with registered address, control, and data inputs, but unregistered (flow-through) data outputs - enabling minimal read latency. Its internal burst address counter advances on ADV=LOW and supports both linear and interleaved sequences selected by the static LBO pin.
Write operations are fully self-timed and configurable via global (GW) or byte-level (BW1–BW4) enables, with BWE gating all byte writes. Chip enable is hierarchical (CE/CS0/CS1), and asynchronous controls include OE (output enable) and ZZ (sleep mode), where ZZ HIGH disables CLK internally and reduces supply current to ≤35 µA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 128K × 36-bit (4.608 Mbit); supports 256K × 18-bit via pin multiplexing |
| Access Time / Max Frequency | 8.5 ns access time; supports up to 87 MHz clock frequency in industrial temp range |
| Supply Voltages | VDD = 3.3 V ±5% (core); VDDQ = 3.3 V ±5% (I/O); separate power domains |
| Power Consumption | IDD = 180–190 mA (active, 8.5 ns); IZZ = 30–35 µA (full sleep mode) |
| Burst Mode Control | LBO pin selects linear or interleaved 4-word burst sequence; static configuration, no runtime change |
| Output Architecture | Flow-through (no output register); tCD = 8.5 ns (clock-to-data), tOHZ = 3.5 ns (OE high to high-Z) |
| Operating Temperature | Industrial grade: –40°C to +85°C; validated for sustained operation across full range |
Pinout & Package
71V3577S85PFG8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch. Pin 1 marked via corner cutout; pin 14 accepts VIL-level input (not required to tie to VSS); pin 64 (ZZ) may be left unconnected for permanent active mode.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | Synchronous address latch triggered by ADSP/ADSC + CE; A0–A16 used for 128K×36, A0–A17 for 256K×18 |
| CLK | Clock Input | Primary timing reference; all synchronous inputs referenced to rising edge |
| CE, CS0, CS1 | Chip Enable / Selects | Three-input chip select hierarchy: CE LOW + CS0 HIGH + CS1 LOW enables device |
| GW, BWE, BW1–BW4 | Write Controls | GW enables full 36-bit write; BWE gates BWx; BW1–BW4 each control one 9-bit byte (I/O0–7/I/OP1, etc.) |
| ADV, ADSP, ADSC | Burst & Address Status | ADSP/ADSC load address register; ADV=LOW advances internal burst counter for next 3 words |
| LBO | Burst Order Select | Asynchronous static input: LBO=LOW → linear burst; LBO=HIGH → interleaved burst |
| OE | Output Enable | Asynchronous; OE=LOW enables flow-through outputs; OE=HIGH forces high-Z regardless of clock |
| ZZ | Sleep Mode | Asynchronous; ZZ=HIGH gates internal CLK and reduces ICC to ≤35 µA while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional bus; registered input path; unregistered (flow-through) output path |
| VDD, VDDQ, VSS | Power/Ground | VDD (core), VDDQ (I/O), and VSS (ground) require separate decoupling; no sequencing required |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay: tCD = 8.5 ns directly from CLK rising edge, critical for low-latency cache applications |
| Configurable 4-word burst mode | Internal counter delivers four sequential data words per address; LBO pin selects linear/interleaved addressing for cache line alignment |
| Single-cycle deselect capability | Device enters high-impedance state within one clock cycle after CE/CS deassertion, simplifying bus arbitration |
| Multi-level write control | Supports full-word (GW), byte-group (BWE + BWx), or individual-byte (BWx only) writes without external logic |
| Industrial-grade sleep mode | ZZ-controlled sleep draws ≤35 µA at VDD=3.465 V while guaranteeing data retention across –40°C to +85°C |
Applications
| Network Packet Processors | Telecom Line Cards |
|---|---|
Use Scenario: High-speed buffering of incoming/outgoing packet headers and metadata in multi-gigabit Ethernet switches. IC Role / Device Role / Timing Role: Synchronous SRAM providing zero-wait-state, burst-access scratchpad memory for header parsing engines. Use Value: 8.5 ns tCD and flow-through outputs reduce pipeline stalls; 4-word burst matches typical 128-bit bus widths. | Use Scenario: Storing real-time voice sample buffers and protocol stack variables in TDM-over-IP gateways. IC Role / Device Role / Timing Role: Low-latency, deterministic-access memory for jitter-sensitive audio frame assembly/disassembly. Use Value: Industrial temperature rating ensures reliability in uncooled chassis; ZZ sleep mode cuts standby power during idle periods. |
| Baseband Modems | Radar Signal Processors |
Use Scenario: Temporary storage of FFT intermediate results and channel estimation coefficients in LTE/5G baseband ASICs. IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly with DSP core's external memory bus. Use Value: Linear/interleaved burst modes align with DSP memory access patterns; single-cycle deselect prevents bus contention during context switches. | Use Scenario: Real-time buffering of digitized RF samples prior to digital beamforming in phased-array radar systems. IC Role / Device Role / Timing Role: High-reliability, low-jitter memory supporting deterministic read/write timing under EMI stress. Use Value: Separate VDD/VDDQ rails suppress noise coupling; industrial temp range accommodates conduction-cooled enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71V3577S85PF | Same die, identical pinout and timing, but non-lead-free (SnPb) finish; RoHS exemption applies | No functional difference; unsuitable for lead-free manufacturing lines requiring Pb-free solder reflow | Select 71V3577S85PFG8 for RoHS-compliant production; use 71V3577S85PF only if legacy SnPb process is mandated |
| CY7C1371DV33-85BGXI | 128K × 36-bit, 85 MHz, 119-ball BGA; lacks LBO-configurable burst order; tCD = 8.5 ns same | Requires PCB redesign (BGA vs TQFP); no linear/interleaved burst selection - fixed interleaved only | Choose CY7C1371DV33-85BGXI only when board space constraints necessitate BGA and burst order flexibility is not required |
Compared with 71V3577S85PFG8, the 71V3577S85PF offers identical electrical and timing behavior but violates modern RoHS requirements, while CY7C1371DV33-85BGXI trades package compatibility and burst configurability for higher-density interconnect - neither is pin-compatible nor drop-in.
Availability
71V3577S85PFG8 is available at Aetrix Electronics and suitable for network packet processors, telecom line cards, and radar signal processors requiring stable component supply, long-term industrial temperature support, and RoHS-compliant manufacturing.
Supply support for 71V3577S85PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The 71V3577S family targets high-performance embedded systems needing deterministic, low-latency memory with flexible burst control and industrial reliability - especially in communications and signal processing equipment.
FAQ
What is the maximum operating frequency supported by the 71V3577S85PFG8?
The 71V3577S85PFG8 supports up to 87 MHz clock frequency at 8.5 ns access time, validated across the industrial temperature range (–40°C to +85°C). This speed grade is available in both TQFP and BGA packages, unlike the faster 6.5 ns variant which is TQFP-only and commercial-temp only.
Does the 71V3577S85PFG8 support both 128K × 36 and 256K × 18 configurations on the same device?
Yes, the 71V3577S85PFG8 is factory-configured as 128K × 36, but its pinout and internal architecture natively support 256K × 18 operation via A17 address usage and appropriate BWx mapping. The 71V3579S variant is the dedicated 256K × 18 version; both share identical timing and control logic.
How does the LBO pin affect burst behavior in the 71V3577S85PFG8?
The LBO pin statically selects burst order: LBO = LOW enables linear burst (00→01→10→11), while LBO = HIGH enables interleaved burst (00→01→11→10). It must remain stable during operation; changing LBO mid-burst causes undefined address sequencing. Internal pull-up ensures default interleaved mode if left unconnected.
What is the power consumption of the 71V3577S85PFG8 in sleep mode?
In full sleep mode (ZZ = HIGH), the 71V3577S85PFG8 draws ≤35 µA at VDD = 3.465 V and TA = +85°C, with guaranteed data retention. This is measured under worst-case conditions; typical IZZ is ~30 µA at nominal VDD = 3.3 V and 25°C.
Can the 71V3577S85PFG8 be used with asynchronous controllers?
No - the 71V3577S85PFG8 is strictly synchronous: all address, control, and data inputs are sampled on the rising edge of CLK. Asynchronous signals like OE and ZZ operate independently of CLK, but core memory access (read/write) requires clock synchronization. External handshaking logic is required for true asynchronous interfacing.
71V3577S85PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 128K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 87 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3577S85PFG8 FAQ
1.How can I place an order for 71V3577S85PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3577S85PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3577S85PFG8 reliable?
The price and inventory of 71V3577S85PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3577S85PFG8 is usually 5 days.
3.What payment methods are accepted for 71V3577S85PFG8?
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4.How is shipping managed for 71V3577S85PFG8?
71V3577S85PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3577S85PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3577S85PFG8?
For technical support, including 71V3577S85PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3577S85PFG8 requirements.
6.How does Aetrix verify that 71V3577S85PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V3577S85PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3577S85PFG8 meets industry standards.
7.What is the process for return or replacement of 71V3577S85PFG8?
All 71V3577S85PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3577S85PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3577S85PFG8 part is unused and in its original packaging.
Return procedure for 71V3577S85PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3577S85PFG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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