Renesas 71V3579S65PFG8
- Part No.:
- 71V3579S65PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3579S65PFG8.pdf
- Description:
- IC SRAM 4.5MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V3579S65PFG8 from Renesas Electronics is a 256K × 18-bit (4.6 Mbit), 3.3V synchronous SRAM with flow-through outputs, burst counter, and single-cycle deselect. It supports 6.5 ns access time at 133 MHz in commercial-grade TQFP packaging, operates with 3.3V core and I/O supplies, and features LBO-controlled linear/interleaved burst mode for high-bandwidth cache or buffer applications.
For engineers reviewing the 71V3579S65PFG8 datasheet, 71V3579S65PFG8 pinout, 71V3579S65PFG8 application, or 71V3579S65PFG8 equivalent, key selection criteria include its 100-pin TQFP package, 256K × 18 organization, 6.5 ns tCD timing, ZZ-controlled sleep mode, and compatibility with burst-addressed processor/cache interfaces requiring deterministic latency and low-power standby.
Technical Context
The 71V3579S65PFG8 implements a synchronous, clock-driven architecture with registered address, control, and data inputs, and a flow-through (unregistered) output path-enabling zero-cycle-output-delay read cycles. Its internal burst counter advances on ADV=LOW, generating four consecutive addresses per initial request, with sequence order determined by the static LBO input.
Burst writes are supported via synchronous GW (global write) or byte-selectable BW1–BW2 (BW3/BW4 not applicable), while self-timed write cycles eliminate external timing constraints. Power management includes asynchronous ZZ-triggered deep-sleep mode with guaranteed data retention and sub-35 µA ISB1 current.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18-bit (4.608 Mbit); enables compact 36-bit-wide data paths using two devices or direct 18-bit bus alignment. |
| Access Time (tCD) | 6.5 ns max; guarantees valid data within 6.5 ns after rising CLK edge-critical for 133 MHz system timing closure. |
| Operating Voltage | 3.3 V ±5% core (VDD) and I/O (VDDQ); eliminates level-shifting in 3.3V logic domains and simplifies power delivery. |
| Burst Mode | Linear or interleaved via LBO pin; provides predictable address sequencing for cache line fills without external address generation logic. |
| Sleep Current (IZZ) | 30 µA max at VDD = 3.465 V; enables ultra-low-power idle states in portable or energy-constrained embedded systems. |
| Package | 100-pin TQFP (14 mm × 20 mm, JEDEC standard); supports automated assembly and thermal performance up to +70°C ambient. |
| Temperature Range | Commercial (0°C to +70°C); validated for stable operation in office, telecom infrastructure, and non-industrial computing environments. |
Pinout & Package
71V3579S65PFG8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch. Pin 1 is marked by a dot or notch; pins are arranged in counter-clockwise order starting from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; A0–A16 used for 256K × 18 addressing (A17 selects upper/lower half of 512K total space). |
| CLK | Clock Input | Primary timing reference; all synchronous inputs sampled on rising edge; defines tCYC = 7.5 ns minimum for 133 MHz operation. |
| GW, BWE, BW1–BW2 | Write Control Inputs | GW enables full 18-bit writes; BWE gates BW1/BW2; BW1 controls I/O0–I/O8/I/OP1, BW2 controls I/O9–I/O17/I/OP2 (BW3/BW4 not connected). |
| ADV, ADSP, ADSC | Burst & Address Status | ADV advances burst counter; ADSP (processor) and ADSC (cache) load address register synchronously-supports dual-source burst initiation. |
| LBO | Burst Order Select | Asynchronous static input: LOW = linear burst (00→01→10→11), HIGH = interleaved burst (00→01→11→10); must remain stable during operation. |
| ZZ | Sleep Mode Enable | Asynchronous HIGH input gates internal clock and reduces supply current to 30 µA; retains memory contents without external refresh. |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | 18 data bits + 2 parity bits; synchronous input registration, flow-through output path ensures minimal read latency. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay-data appears on I/O pins within tCD (6.5 ns) of CLK rise, enabling tight timing budgets in high-speed processors. |
| Single-cycle deselect | Chip deactivation completes in one clock cycle, preventing bus contention and enabling rapid context switching between memory banks. |
| Self-timed write cycle | Internal timing logic resolves write completion without external strobes-simplifies interface design and improves reliability across voltage/temperature corners. |
| Configurable burst order (LBO) | Hardware-selectable linear or interleaved address sequences match specific cache controller requirements without firmware overhead. |
| Low-power sleep mode (ZZ) | Reduces active current from 300 mA to 30 µA-enables >10,000× power reduction during idle periods in battery-backed or thermally constrained systems. |
Applications
| Cache Memory Subsystem | Network Packet Buffer |
|---|---|
Use Scenario: High-speed L2/L3 cache for RISC-V or ARM-based SoCs operating at ≥100 MHz. IC Role / Device Role / Timing Role: Synchronous burst-access SRAM providing 4-word cache line fills per address request with deterministic 6.5 ns read latency. Use Value: Enables full-cache-line throughput matching processor bandwidth, eliminating wait states and improving IPC in compute-intensive workloads. | Use Scenario: Temporary storage for ingress/egress packet headers and metadata in 10/25 GbE switch ASICs. IC Role / Device Role / Timing Role: Low-latency buffer supporting burst-mode DMA transfers from MAC layers with single-cycle deselect for rapid bank switching. Use Value: Reduces packet processing jitter by guaranteeing sub-7 ns read access and <35 µA sleep current during idle link intervals. |
| Industrial PLC Data Log | Medical Imaging Frame Buffer |
Use Scenario: Non-volatile event logging in programmable logic controllers with periodic timestamped sensor snapshots. IC Role / Device Role / Timing Role: Battery-backed SRAM holding timestamped 18-bit analog channel data; accessed via burst reads during diagnostics. Use Value: Delivers reliable 256K × 18 storage with ZZ sleep mode extending backup battery life beyond 5 years at room temperature. | Use Scenario: Real-time frame buffering in ultrasound or digital X-ray systems requiring pixel-rate streaming at 60+ fps. IC Role / Device Role / Timing Role: Dual-port-capable SRAM (via time-multiplexed reads/writes) feeding FPGA-based image pipeline with flow-through output timing. Use Value: Supports 133 MHz pixel clock rates with zero-output-register delay-preserving precise timing alignment for real-time beamforming or reconstruction. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71V3577S65PFG8 | 128K × 36 organization; same 6.5 ns speed grade, TQFP package, and feature set-but wider 36-bit data bus and half the depth. | Preferred where 36-bit parallel interfaces dominate (e.g., legacy DSP buses); requires different address decoding and may increase PCB routing complexity for 18-bit systems. | Select 71V3577S65PFG8 only when 36-bit data width is mandatory and memory density ≤2.3 Mbit suffices. |
| CY7C1372DV33-65BAXI | Cypress (Infineon) 256K × 18 device; identical 65 ns access (6.5 ns tCD), 100-pin TQFP, but uses different burst control (MODE pin instead of LBO) and lacks ADSC input. | Suitable for new designs targeting Cypress ecosystem tooling; not drop-in due to differing burst configuration and missing cache-controller ADSC support. | Choose CY7C1372DV33-65BAXI if ADSC functionality is unused and MODE-based burst selection aligns with system architecture. |
Compared with 71V3579S65PFG8, the 71V3577S65PFG8 offers higher data width but lower density, while the CY7C1372DV33-65BAXI matches density and speed but omits ADSC and uses MODE instead of LBO-requiring layout and firmware adaptation.
Availability
71V3579S65PFG8 is available at Aetrix Electronics and suitable for cache subsystems, network packet buffers, industrial data loggers, medical imaging frame stores, and high-reliability embedded controllers requiring stable component supply across production lifecycles.
Supply support for 71V3579S65PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and enterprise applications.
The 71V3579S series belongs to Renesas' high-speed synchronous SRAM product line, engineered for low-latency, burst-oriented memory subsystems in cache, networking, and real-time signal processing systems.
FAQ
What memory organization does the 71V3579S65PFG8 implement?
The 71V3579S65PFG8 implements a 256K × 18-bit organization, delivering 4.608 Mbit of total memory capacity. This configuration supports 18-bit data buses directly and is optimized for systems requiring balanced depth and width-such as cache line buffers or dual-channel ADC data capture. The 71V3579S65PFG8 does not support 128K × 36 mode; that variant is implemented in the pin-compatible 71V3577S65PFG8.
Does the 71V3579S65PFG8 support both linear and interleaved burst modes?
Yes, the 71V3579S65PFG8 supports both linear and interleaved burst modes via the LBO (Linear Burst Order) input pin. When LBO is driven LOW, the device executes linear burst addressing (00→01→10→11); when HIGH, it performs interleaved burst (00→01→11→10). This selection is static and must remain stable during operation-the 71V3579S65PFG8 does not permit dynamic LBO toggling mid-burst.
What is the maximum clock frequency supported by the 71V3579S65PFG8?
The 71V3579S65PFG8 supports a maximum clock frequency of 133 MHz, achievable only with the 6.5 ns speed grade in the commercial temperature range (0°C to +70°C) and TQFP package. At this frequency, tCYC = 7.5 ns minimum and tCD = 6.5 ns maximum are guaranteed. Slower speeds (7.5 ns, 8 ns, 8.5 ns) extend operation into industrial temperature ranges but reduce maximum frequency to 117 MHz, 100 MHz, and 87 MHz respectively.
How does the ZZ pin function in the 71V3579S65PFG8?
The ZZ pin on the 71V3579S65PFG8 is an asynchronous input that places the device into full sleep mode when driven HIGH. In this state, internal clock gating reduces supply current to ≤30 µA while preserving all stored data. The 71V3579S65PFG8 exits sleep mode synchronously upon ZZ returning LOW and requires tZZR = 100 ns recovery before accepting new commands-no external refresh or initialization is needed.
Are BW3 and BW4 functional on the 71V3579S65PFG8?
No, BW3 and BW4 are not functional on the 71V3579S65PFG8. As explicitly noted in the Renesas datasheet, these pins are reserved and not applicable for the 71V3579 family. Only BW1 and BW2 are active-BW1 controls I/O0–I/O8 and I/OP1 (9 bits), BW2 controls I/O9–I/O17 and I/OP2 (9 bits). Using BW3/BW4 on the 71V3579S65PFG8 will have no effect on write operations.
71V3579S65PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
71V3579S65PFG8 FAQ
1.How can I place an order for 71V3579S65PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3579S65PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3579S65PFG8 reliable?
The price and inventory of 71V3579S65PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3579S65PFG8 is usually 5 days.
3.What payment methods are accepted for 71V3579S65PFG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3579S65PFG8 transactions.
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4.How is shipping managed for 71V3579S65PFG8?
71V3579S65PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3579S65PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3579S65PFG8?
For technical support, including 71V3579S65PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3579S65PFG8 requirements.
6.How does Aetrix verify that 71V3579S65PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V3579S65PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3579S65PFG8 meets industry standards.
7.What is the process for return or replacement of 71V3579S65PFG8?
All 71V3579S65PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3579S65PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3579S65PFG8 part is unused and in its original packaging.
Return procedure for 71V3579S65PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3579S65PFG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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24LC01BT-I/OT
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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