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Renesas 71V3579S80PFG
- Part No.:
- 71V3579S80PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V3579S80PFG.pdf
- Description:
- IC SRAM 4.5MBIT PARALLEL 100TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,425
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Product details
Overview
71V3579S80PFG from Renesas Electronics is a 256K × 18-bit, 3.3V synchronous SRAM with flow-through output architecture, 8.0 ns access time at 100 MHz, industrial temperature range (–40°C to +85°C), and JEDEC-standard 100-pin TQFP package. It supports linear/interleaved burst modes via LBO input and enables high-bandwidth data buffering in cache-coherent systems.
For engineers reviewing the 71V3579S80PFG datasheet, 71V3579S80PFG pinout, 71V3579S80PFG application, or 71V3579S80PFG equivalent, key selection criteria include burst-mode timing compliance, byte-write granularity (BW1–BW2 only), ZZ-controlled sleep mode current (30–35 µA), and TQFP-100 pin compatibility with legacy 71V3577/79 designs.
Technical Context
This SRAM implements a synchronous, clock-driven interface with registered address/data inputs and unregistered (flow-through) outputs - eliminating output register latency for deterministic read-to-data timing. Its internal burst counter advances on ADV=LOW and selects sequence order (linear vs. interleaved) via static LBO configuration.
Write control combines global (GW) and byte-level (BW1–BW2) enables with BWE gating; CE/CS0/CS1 decoding enables multi-chip select hierarchies. Power management includes three states: active (IDD ≤ 180 mA), standby (ISB1 ≤ 30 mA), and full sleep (IZZ ≤ 35 µA) triggered by ZZ HIGH.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 18-bit (4.6 Mbit); supports 18-bit parallel bus interfaces without width conversion logic. |
| Access Time / Max Frequency | 8.0 ns / 100 MHz - guarantees sub-10 ns read cycle timing for real-time DSP and packet buffering. |
| Supply Voltages | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - dual-rail I/O/core separation enables noise isolation in mixed-signal PCBs. |
| Burst Mode Control | LBO input selects linear or interleaved 4-word burst sequence - critical for cache line alignment in x86/ARM coherency protocols. |
| Power-Down Current | IZZ ≤ 35 µA (industrial temp) - enables low-quiescent-power operation during system idle states. |
| Operating Temperature | –40°C to +85°C - qualified for industrial automation, telecom infrastructure, and transportation control units. |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm) - compatible with standard SMT reflow profiles and automated optical inspection. |
Pinout & Package
71V3579S80PFG is packaged in a 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant. Pinout conforms to Renesas PKG100 mechanical drawing for 256K × 18 configuration (BW3/BW4 not connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; A0–A1 drive burst counter; A2–A17 select row/column within 256K × 18 array. |
| CE, CS0, CS1 | Chip Enable / Selects | Three-level decode: CE LOW + CS0 HIGH + CS1 LOW enables device; supports up to 4 chips per bank. |
| GW, BWE, BW1–BW2 | Write Controls | GW writes all 18 bits; BWE gates BW1/BW2; BW1 controls I/O0–I/O8/I/OP1, BW2 controls I/O9–I/O17/I/OP2. |
| CLK, ADV, ADSP, ADSC | Timing & Address Status | CLK synchronizes all registers; ADV advances burst counter; ADSP/ADSC load address on falling edge (processor/cache). |
| I/O0–I/O17, I/OP1–I/OP2 | Data I/O | 18-bit bidirectional data bus with parity pins I/OP1/I/OP2; flow-through outputs eliminate output register delay. |
| LBO, ZZ, OE | Mode & Output Control | LBO sets burst order (LOW = linear); ZZ HIGH enters ultra-low-power sleep; OE LOW enables outputs asynchronously. |
Key Features
| Feature | Design Value |
|---|---|
| Flow-through output architecture | Eliminates output register delay - tCD = 8.0 ns guaranteed, enabling tight timing closure in high-speed memory interfaces. |
| Single-cycle deselect | Device transitions to high-Z output state within one CLK cycle after chip disable - prevents bus contention in multi-SRAM systems. |
| Configurable burst order (LBO) | Hardware-selectable linear or interleaved 4-word burst - matches Intel Pentium or ARM AMBA AXI cache line ordering requirements. |
| Byte-write enable (BW1/BW2 only) | Independent 9-bit write masking - allows partial word updates without read-modify-write cycles in protocol engines. |
| ZZ-controlled sleep mode | Reduces supply current to ≤35 µA while retaining data - extends uptime in battery-backed industrial controllers. |
Applications
| Network Packet Buffering | Industrial PLC Data Logging |
|---|---|
Use Scenario: Storing incoming Ethernet frames in a line-rate switch ASIC before classification and forwarding. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer with deterministic 8.0 ns read access and burst-aligned 18-bit transfers. Use Value: Enables full 100 Mbps throughput without FIFO underflow; flow-through output avoids pipeline stalls in packet header parsing logic. |
Use Scenario: Capturing sensor readings at 10 kHz in a programmable logic controller with nonvolatile backup. IC Role / Device Role / Timing Role: Volatile scratchpad memory for cyclic data acquisition, interfaced to an ARM Cortex-M7 MCU via parallel bus. Use Value: Single-cycle deselect and ZZ sleep mode reduce power during idle scan cycles; industrial temp rating ensures reliability in cabinet-mounted enclosures. |
| Medical Imaging Frame Store | Avionics Display Controller Cache |
Use Scenario: Holding uncompressed 1024×768 pixel frames from a CCD sensor prior to JPEG compression. IC Role / Device Role / Timing Role: Dual-port-capable buffer supporting simultaneous read (compression engine) and write (sensor interface) operations. Use Value: 256K × 18 organization maps directly to 16-bit pixel depth; 8.0 ns access sustains >120 MB/s bandwidth required for real-time video streaming. |
Use Scenario: Caching GUI bitmaps and font glyphs in a DO-254-certified cockpit display unit. IC Role / Device Role / Timing Role: Deterministic-access memory for graphics rendering pipeline, synchronized to display controller clock domain. Use Value: Linear burst mode (LBO=LOW) delivers sequential glyph data with zero wait states; TQFP-100 package meets aerospace vibration and thermal cycling requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 71V3577S80PFG | 128K × 36 organization; supports BW1–BW4; same 8.0 ns speed grade and TQFP-100 package. | Targets 36-bit bus systems (e.g., legacy PCI-X); requires wider data path routing and different burst addressing logic. | Select when 36-bit interface or full 4-byte write granularity is required; not drop-in for 18-bit designs. |
| CY7C1362BV18-100BZXI | Cypress (Infineon) 256K × 18, 100 MHz, 100-pin TQFP; 3.3V core/I/O; supports interleaved burst only. | Lacks LBO pin - fixed interleaved mode; higher ISB1 (45 µA) and no ZZ sleep mode; identical AC timing. | Use where burst order is fixed and ultra-low sleep current is unnecessary; verify ADSP/ADSC timing compatibility. |
Compared with 71V3579S80PFG, the 71V3577S80PFG offers double data width but half depth and extra byte enables, while CY7C1362BV18-100BZXI trades configurability (LBO, ZZ) for vendor-specific timing margins and qualification scope.
Availability
71V3579S80PFG is available at Aetrix Electronics and suitable for industrial PLCs, network packet buffers, medical imaging subsystems, and avionics display controllers requiring stable component supply across extended product lifecycles.
Supply support for 71V3579S80PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V3577/79 family was designed specifically for high-performance, low-latency synchronous memory applications in cache-coherent systems, real-time control, and communications infrastructure where deterministic timing and industrial reliability are mandatory.
FAQ
What memory organization does the 71V3579S80PFG support?
The 71V3579S80PFG is organized as 256K × 18 bits (4.6 Mbit), meaning it provides 256,000 words of 18-bit data. This configuration matches common 16-bit-plus-parity or dual-9-bit bus architectures used in industrial controllers and networking ASICs. The 71V3579S80PFG does not support the 128K × 36 mode - that is exclusive to the 71V3577S variant.
Does the 71V3579S80PFG support both linear and interleaved burst modes?
Yes, the 71V3579S80PFG supports both burst modes via the LBO (Linear Burst Order) pin: LBO = LOW selects linear addressing (00→01→10→11), while LBO = HIGH selects interleaved (00→01→11→10). This hardware-selectable feature allows the 71V3579S80PFG to align with either x86 or ARM cache line ordering conventions without firmware changes.
What is the function of the ZZ pin on the 71V3579S80PFG?
The ZZ pin on the 71V3579S80PFG is an asynchronous sleep mode input. When driven HIGH, it gates the internal clock and reduces supply current to ≤35 µA (industrial grade) while retaining memory contents. The 71V3579S80PFG exits sleep mode synchronously upon ZZ returning LOW and requires tZZR ≥ 100 ns before valid accesses resume.
Which byte write enables are active on the 71V3579S80PFG?
The 71V3579S80PFG implements BW1 and BW2 only - controlling I/O0–I/O8/I/OP1 and I/O9–I/O17/I/OP2 respectively. BW3 and BW4 are not connected (NC) per Renesas documentation. This reflects its 18-bit data width, unlike the 36-bit 71V3577S which uses all four byte enables.
What package type and pin count does the 71V3579S80PFG use?
The 71V3579S80PFG uses a JEDEC-standard 100-pin thin quad flatpack (TQFP) package, 14 mm × 20 mm body size, 0.5 mm lead pitch. It is distinct from the 119-ball BGA and 165-fBGA variants of the same family - those part numbers omit the "PFG" suffix and require different PCB layout and thermal management.
71V3579S80PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR
- Memory Size:
- 4.5Mbit
- Memory Organization:
- 256K x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x14)
71V3579S80PFG FAQ
1.How can I place an order for 71V3579S80PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V3579S80PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V3579S80PFG reliable?
The price and inventory of 71V3579S80PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3579S80PFG is usually 5 days.
3.What payment methods are accepted for 71V3579S80PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V3579S80PFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V3579S80PFG?
71V3579S80PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V3579S80PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V3579S80PFG?
For technical support, including 71V3579S80PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3579S80PFG requirements.
6.How does Aetrix verify that 71V3579S80PFG is sourced from the original manufacturer or authorized distributors?
All 71V3579S80PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3579S80PFG meets industry standards.
7.What is the process for return or replacement of 71V3579S80PFG?
All 71V3579S80PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V3579S80PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V3579S80PFG part is unused and in its original packaging.
Return procedure for 71V3579S80PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V3579S80PFG Tags
-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology
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AT21CS01-STUM10-T
Microchip Technology
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AT24C02C-SSHM-T
Microchip Technology
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics
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AT24CS02-SSHM-T
Microchip Technology
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93LC46BT-I/OT
Microchip Technology
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AT24C04C-SSHM-T
Microchip Technology
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24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
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