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Renesas 71V3579S80PFGI8

Part No.:
71V3579S80PFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V3579S80PFGI8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,346

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Product details

Overview

71V3579S80PFGI8 from Renesas Electronics is a 256K × 18-bit, 3.3V synchronous SRAM with flow-through output architecture, 8.0 ns access time at 100 MHz clock frequency, industrial temperature range (–40°C to +85°C), and JEDEC-standard 100-pin TQFP package. It supports burst counter mode, single-cycle deselect, and linear/interleaved burst ordering via LBO pin - deployed in high-speed cache buffers and network packet memory subsystems.

For engineers reviewing the 71V3579S80PFGI8 datasheet, 71V3579S80PFGI8 pinout, 71V3579S80PFGI8 application, or 71V3579S80PFGI8 equivalent, key selection criteria include its 256K × 18 organization, 8.0 ns tCD timing, TQFP-100 industrial-grade packaging, asynchronous ZZ sleep control, and absence of BW3/BW4 pins per datasheet note.

Technical Context

The 71V3579S80PFGI8 implements a synchronous, clock-driven interface with registered address and data inputs, but unregistered (flow-through) outputs - enabling deterministic read latency directly tied to tCD. Its burst logic uses an internal binary counter synchronized to ADV and gated by ADSP/ADSC, with burst order determined statically by LBO level before operation.

Write control combines global (GW) and byte-level (BW1–BW2) enables, where BWE gates BWx signals; GW supersedes all byte writes. Power management includes three states: active (IDD = 180 mA max), standby (ISB1 = 30 mA), and full sleep (IZZ = 30 mA), all controlled asynchronously via ZZ.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization256K × 18 bits - delivers 4.6 Mbit density with 18-bit data bus width for wide parallel interfaces.
Access Time (tCD)8.0 ns maximum - guarantees valid output data within 8.0 ns after rising CLK edge at 100 MHz operation.
Supply VoltagesVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - dual 3.3V rails enable I/O voltage margining and core power isolation.
Operating Temperature–40°C to +85°C - qualified for industrial environments without derating or thermal throttling.
Package100-pin TQFP (14 mm × 20 mm, JEDEC standard) - surface-mount compatible with automated assembly and thermal vias.
Burst ModeLinear or interleaved 4-word burst - selectable via static LBO pin; no external counter required.
Power-Down ControlAsynchronous ZZ input - reduces supply current to 30 µA typical in full sleep mode with data retention guaranteed.

Pinout & Package

71V3579S80PFGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant. Pinout reflects the 256K × 18 configuration: BW3 and BW4 are not connected (NC), and A17 is active while A16 is NC in this variant.

Pin/Terminal Circuit Role Design Meaning
A0–A17Address InputsSynchronous address latching on rising CLK edge when ADSP or ADSC is asserted; A17 used, A16 NC in 256K×18 mode.
CE, CS0, CS1Chip Enable / SelectsThree-level decode: CE LOW + CS0 HIGH + CS1 LOW enables device; allows multi-chip addressing.
GW, BWE, BW1–BW2Write ControlsGW writes all 18-bit words; BWE enables BW1/BW2; BW1 drives I/O0–I/O8/I/OP1, BW2 drives I/O9–I/O17/I/OP2.
ADV, ADSP, ADSCBurst Address ControlADSP/ADSC load initial address; ADV advances internal burst counter on each rising CLK during burst reads/writes.
LBOBurst Order SelectorStatic input: LBO = LOW → linear burst (00→01→10→11); LBO = HIGH → interleaved burst (00→01→11→10).
ZZAsynchronous SleepHigh-Z output state and 30 µA sleep current activated immediately on ZZ HIGH; no clock dependency.
I/O0–I/O17, I/OP1–I/OP2Data I/O18-bit bidirectional data bus with parity pins I/OP1/I/OP2; flow-through outputs eliminate output register delay.

Key Features

Feature Design Value
Flow-through output architectureEliminates output register delay - tCD = 8.0 ns is pure array + path delay, critical for tight-timing cache interfaces.
Single-cycle deselectDevice enters high-impedance state within one clock cycle after chip disable - prevents bus contention in multi-SRAM systems.
Configurable burst order (LBO)Hardware-selectable linear or interleaved 4-word burst sequence - matches CPU/cache controller addressing patterns without firmware overhead.
Asynchronous ZZ sleep entryInstant transition to 30 µA sleep current on ZZ assertion - enables dynamic power gating independent of clock or bus activity.
No BW3/BW4 pins in 256K×18 modeReduces pin count and simplifies PCB layout versus 128K×36 variant; eliminates unused byte-write routing.

Applications

Network Packet Buffering Industrial PLC Data Cache

Use Scenario: Storing and forwarding variable-length Ethernet frames in Layer 2 switches with line-rate throughput.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer between MAC and switching fabric; provides deterministic 8.0 ns read access for frame header inspection.

Use Value: Flow-through outputs and single-cycle deselect prevent pipeline stalls during burst transfers across multiple ports.

Use Scenario: Real-time logging of sensor inputs and control outputs in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM for program execution and I/O state storage; operates continuously across –40°C to +85°C.

Use Value: Industrial temp rating and ZZ sleep mode enable reliable operation during brownouts or scheduled maintenance cycles.

Telecom Line Card Memory Avionics Data Acquisition Buffer

Use Scenario: Temporary storage of TDM voice samples and signaling data in carrier-grade DSLAM line cards.

IC Role / Device Role / Timing Role: Synchronous SRAM interfacing directly with TI C6000 DSPs; supports 100 MHz burst reads aligned to frame boundaries.

Use Value: 256K×18 organization matches DSP external memory bus width; eliminates glue logic for data width conversion.

Use Scenario: Capturing high-speed analog-to-digital converter streams in flight test instrumentation systems requiring EMI resilience.

IC Role / Device Role / Timing Role: Buffered acquisition memory with deterministic latency for timestamp-critical sampling triggers.

Use Value: Asynchronous ZZ control allows immediate power-down between acquisition bursts - reducing average system power and thermal load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
71V3577S80PFGI8128K × 36 organization; includes BW3/BW4 pins; same 8.0 ns speed grade and TQFP-100 package.Supports wider 36-bit data paths and four independent byte writes - suited for x36 memory subsystems.Select 71V3577S80PFGI8 only if 36-bit bus width or full byte-enable granularity is required.
AS7C3256B-8TIN256K × 16 organization; 3.3V core/I/O; 8 ns access; 44-pin SOJ package - no burst counter or ADV/ADSP interface.Basic asynchronous SRAM interface; lacks burst, flow-through, and synchronous control features.Choose AS7C3256B-8TIN only for cost-sensitive, non-burst, non-synchronous designs where timing predictability is secondary.

Compared with 71V3577S80PFGI8, the 71V3579S80PFGI8 trades 36-bit width and extra byte enables for optimized 18-bit alignment and reduced pin count; versus AS7C3256B-8TIN, it delivers deterministic burst timing and lower latency through synchronous flow-through architecture - essential for real-time control and telecom buffering.

Availability

71V3579S80PFGI8 is available at Aetrix Electronics and suitable for industrial automation, telecom infrastructure, and avionics data acquisition requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature performance.

Supply support for 71V3579S80PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V3579S series belongs to Renesas' high-speed synchronous SRAM product line, engineered for deterministic low-latency memory in real-time networking, control, and signal processing systems.

FAQ

What memory organization does the 71V3579S80PFGI8 implement?

The 71V3579S80PFGI8 implements a 256K × 18-bit synchronous SRAM organization, providing 4.608 Mbit total capacity with an 18-bit data bus. This configuration is distinct from the 128K × 36 variant (71V3577S) and omits BW3/BW4 pins - confirmed in Renesas datasheet section "Pin Configuration – 256K x 18, PKG100".

Does the 71V3579S80PFGI8 support burst mode, and how is it configured?

Yes, the 71V3579S80PFGI8 supports 4-word synchronous burst mode using an internal binary counter. Burst initiation is triggered by ADV LOW, and the sequence order (linear or interleaved) is selected statically via the LBO pin - LBO LOW = linear, LBO HIGH = interleaved. This is documented in the "Linear Burst Sequence Table" and "Interleaved Burst Sequence Table" of the datasheet.

What is the significance of the "80" in 71V3579S80PFGI8?

The "80" in 71V3579S80PFGI8 denotes the 8.0 ns access time (tCD) specification - the maximum clock-to-data delay under industrial temperature conditions at 100 MHz operation. This speed grade is validated in the "AC Electrical Characteristics" table (tCD = 8.0 ns max) and applies to both commercial and industrial versions of the 71V3579S.

How does power management work on the 71V3579S80PFGI8?

Power management on the 71V3579S80PFGI8 operates across three states: active (IDD ≤ 180 mA), standby (ISB1 ≤ 30 mA), and full sleep (IZZ ≤ 30 mA). The asynchronous ZZ input controls entry into sleep mode - asserting ZZ HIGH immediately gates the internal clock and reduces current draw while retaining memory contents, as specified in the DC Electrical Characteristics table.

Is the 71V3579S80PFGI8 pin-compatible with other members of the 71V3577/79 family?

No - the 71V3579S80PFGI8 is not fully pin-compatible with the 71V3577S80PFGI8. While both use the same 100-pin TQFP package, the 71V3579S configures A17 as active and A16 as NC, whereas the 71V3577S uses A16 and leaves A17 NC. Additionally, BW3 and BW4 are NC on the 71V3579S but functional on the 71V3577S - verified in the "Pin Configuration" diagrams for each variant.

71V3579S80PFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
4.5Mbit
Memory Organization:
256K x 18
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V3579S80PFGI8 FAQ

1.How can I place an order for 71V3579S80PFGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V3579S80PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V3579S80PFGI8 reliable?

The price and inventory of 71V3579S80PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V3579S80PFGI8 is usually 5 days.

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71V3579S80PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V3579S80PFGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V3579S80PFGI8?

For technical support, including 71V3579S80PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V3579S80PFGI8 requirements.

6.How does Aetrix verify that 71V3579S80PFGI8 is sourced from the original manufacturer or authorized distributors?

All 71V3579S80PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V3579S80PFGI8 meets industry standards.

7.What is the process for return or replacement of 71V3579S80PFGI8?

All 71V3579S80PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V3579S80PFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V3579S80PFGI8 part is unused and in its original packaging.

Return procedure for 71V3579S80PFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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