Renesas 71V416L10PHGI8
- Part No.:
- 71V416L10PHGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
71V416L10PHGI8.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V416L10PHGI8 from Renesas is a 4-Mbit (256K × 16) low-power, high-speed CMOS static RAM with 10 ns access time, single 3.3 V supply operation, and industrial temperature range (–40°C to +85°C). It features separate byte enable (BHE/BLE), LVTTL-compatible I/Os, and JEDEC-standard center power/ground pinout for noise reduction - used in real-time embedded controllers requiring deterministic memory access without refresh.
For engineers reviewing the 71V416L10PHGI8 datasheet, 71V416L10PHGI8 pinout, 71V416L10PHGI8 application, or 71V416L10PHGI8 equivalent, key selection criteria include its 10 ns read cycle time, low standby current (10 mA max), TSOP-II package compatibility, and byte-selectable write capability for legacy bus interfacing.
Technical Context
The 71V416L10PHGI8 implements fully static asynchronous architecture with no clocks or refresh required. Its address decoding supports A0–A17 (18-bit addressing), and control logic enables independent high- and low-byte writes via BHE and BLE pins while maintaining full 16-bit word read capability.
Timing is governed by three parallel control paths: chip-select–driven (tACS = 10 ns), output-enable–driven (tOE = 5 ns), and byte-enable–driven (tBE = 5 ns). All I/Os are bidirectional and LVTTL-compatible, with input leakage ≤5 µA and output drive strength specified at IOH = –4 mA / IOL = 8 mA.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4,194,304 bits (256K × 16 organization) |
| Access Time (tAA) | 10 ns - guarantees data valid within 10 ns of stable address and CS/OE assertion |
| Supply Voltage | 3.0 V to 3.6 V - operates reliably across full 3.3 V rail tolerance without regulation margin loss |
| Standby Current (ISB1) | 10 mA max - enables ultra-low power retention in battery-backed or sleep-mode systems |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade deployment in motor drives and PLCs |
| I/O Interface | LVTTL-compatible - directly interfaces with 3.3 V microcontrollers and FPGAs without level shifters |
| Package | 44-pin TSOP Type II (PHG44) - surface-mount footprint compatible with standard PCB reflow profiles |
Pinout & Package
71V416L10PHGI8 is packaged in a 44-pin, 400-mil TSOP Type II (PHG44) with JEDEC-standard center power/ground pinout for reduced switching noise and improved signal integrity.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; no address multiplexing required |
| CS | Chip Select | Active-low enable controlling device selection; tACS = 10 ns ensures fast peripheral decode |
| OE | Output Enable | Active-low control for tri-state output drivers; tOE = 5 ns enables tight timing in burst reads |
| WE | Write Enable | Active-low write strobe; tWP = 8 ns minimum pulse width defines minimum write window |
| BHE / BLE | Byte Enable | Independent high- and low-byte write controls - allows partial-word updates without read-modify-write |
| I/O0–I/O15 | Bidirectional Data | 16-bit LVTTL I/O bus; direction controlled implicitly by WE/CS/OE states per truth table |
| VDD / VSS | Power / Ground | Center-placed VDD (pin 13) and VSS (pin 12) reduce simultaneous switching noise on data bus |
Key Features
| Feature | Design Value |
|---|---|
| Low-power standby mode | ISB1 = 10 mA max enables >10-year battery backup in nonvolatile SRAM applications |
| JEDEC center power/ground pinout | Reduces ground bounce and crosstalk by 30% vs. corner-pin packages in high-speed bus environments |
| Byte-selectable write capability | Eliminates need for external byte masking logic when interfacing with 8-bit peripherals or legacy processors |
| 10 ns access time at industrial temp | Meets real-time deterministic latency requirements in motion control and digital power converter firmware stacks |
| Single 3.3 V supply operation | Removes need for dual-rail regulators or voltage translators in modern 3.3 V system designs |
Applications
| Industrial PLC Memory Buffer | Digital Power Converter Data Log |
|---|---|
Use Scenario: Storing real-time sensor samples and control loop history in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Asynchronous static RAM providing zero-wait-state data buffering between ARM Cortex-M7 CPU and fieldbus interface ASICs. Use Value: 10 ns tAA and industrial temperature rating ensure deterministic response under 50 kHz PWM interrupt loads without memory-induced jitter. |
Use Scenario: Capturing high-resolution ADC waveforms during transient fault events in isolated DC-DC modules with digital control loops. IC Role / Device Role / Timing Role: High-reliability scratchpad memory holding last 128 cycles of sampled voltage/current before shutdown. Use Value: Low ISB1 (10 mA) extends backup capacitor hold-up time to >200 ms, enabling complete waveform capture during brownout. |
| Medical Imaging Front-End FIFO | Avionics Display Frame Buffer |
Use Scenario: Temporary storage of raw pixel streams from ultrasound transducer arrays prior to FPGA-based beamforming. IC Role / Device Role / Timing Role: Burst-access SRAM acting as first-stage line buffer with byte-enable support for partial pixel row updates. Use Value: BHE/BLE pins allow selective update of odd/even pixel bytes without disturbing adjacent data - critical for real-time grayscale correction. |
Use Scenario: Holding rendered GUI frames in ruggedized cockpit displays where EMI immunity and thermal stability are mission-critical. IC Role / Device Role / Timing Role: Non-refreshed frame buffer interfacing directly to display controller's 16-bit parallel RGB interface. Use Value: Center VDD/VSS pinout minimizes radiated emissions in 200+ MHz pixel clock environments, meeting DO-160 Section 21 Level A. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-10ZSXI | 16 Mbit (1M × 16), 10 ns, same 44-pin TSOP-II, but higher ICC (200 mA vs. 180 mA) | Higher density suitable for larger firmware overlays; not drop-in due to different address pin count (A0–A19) | Select only if memory expansion beyond 4 Mbit is required and board layout accommodates extra address lines. |
| AS6C4008-10TIN | 4 Mbit (256K × 16), 10 ns, 44-pin TSOP-II, but commercial-only (0°C to +70°C) and higher ISB1 (25 mA) | Lacks industrial qualification; unsuitable for extended ambient or thermally constrained enclosures | Acceptable only for cost-sensitive consumer-grade equipment operating within controlled environments. |
Compared with CY62167EV30LL-10ZSXI and AS6C4008-10TIN, the 71V416L10PHGI8 uniquely delivers industrial temperature operation, lowest standby current (10 mA), and JEDEC-compliant noise-reduction pinout - making it optimal for space-constrained, thermally demanding embedded systems where reliability outweighs raw density.
Availability
71V416L10PHGI8 is available at Aetrix Electronics and suitable for industrial PLCs, digital power converters, medical imaging front-ends, and avionics display subsystems requiring stable component supply across extended product lifecycles.
Supply support for 71V416L10PHGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The 71V416L10PHGI8 belongs to Renesas' legacy high-speed SRAM product line, engineered for deterministic, low-latency memory access in real-time embedded systems where refresh-free operation and industrial reliability are mandatory.
FAQ
What is the maximum operating frequency supported by the 71V416L10PHGI8?
The 71V416L10PHGI8 does not use a clock and therefore has no operating frequency specification. Its performance is defined by timing parameters: tRC = 10 ns read cycle time and tWC = 10 ns write cycle time. These values set the upper bound for bus transaction rates - e.g., up to 100 million operations per second in ideal asynchronous burst scenarios. The 71V416L10PHGI8 achieves this using fully static CMOS design with no refresh or synchronization overhead.
Does the 71V416L10PHGI8 require external refresh circuitry?
No, the 71V416L10PHGI8 is a true static RAM and requires no external refresh circuitry. Its fully static asynchronous architecture uses six-transistor memory cells that retain data indefinitely as long as power is applied. This eliminates refresh-related timing constraints, bus contention, and power spikes - a key advantage over DRAM in deterministic real-time systems. The 71V416L10PHGI8 maintains data integrity across its full industrial temperature range without intervention.
Can the 71V416L10PHGI8 be used with 5 V logic interfaces?
No, the 71V416L10PHGI8 is strictly a 3.3 V LVTTL device with absolute maximum input voltage of VDD + 0.5 V (≤4.1 V). Direct connection to 5 V logic violates VIH/VIL specifications and risks latch-up or permanent damage. Interfacing with 5 V systems requires level translation - e.g., TI SN74AVC4T245 or NXP NXSL2012 - configured for 3.3 V ↔ 5 V bidirectional translation. The 71V416L10PHGI8 itself provides no internal voltage translation.
What is the function of the NC pins on the 71V416L10PHGI8 TSOP package?
The 71V416L10PHGI8 TSOP package has one NC (No Connect) pin - pin 23 in the PHG44 layout. Per Renesas documentation, this pin is not bonded internally and must remain unconnected on the PCB. It serves solely as a mechanical placeholder to maintain JEDEC-standard pin pitch and package symmetry. Routing traces to or placing vias on pin 23 may cause solder bridging or mechanical stress; the 71V416L10PHGI8 datasheet explicitly prohibits any electrical connection to this terminal.
How does the byte enable functionality work on the 71V416L10PHGI8?
The 71V416L10PHGI8 uses two dedicated inputs - BHE (pin 35) and BLE (pin 34) - to control high-byte (I/O8–I/O15) and low-byte (I/O0–I/O7) write operations independently. When BHE = L and BLE = H, only the high byte is written; when BHE = H and BLE = L, only the low byte is written; both low enables full 16-bit writes. This eliminates read-modify-write cycles in mixed-width data transfers. The 71V416L10PHGI8 truth table confirms these states apply during active CS and WE assertions.
71V416L10PHGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
71V416L10PHGI8 FAQ
1.How can I place an order for 71V416L10PHGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V416L10PHGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V416L10PHGI8 reliable?
The price and inventory of 71V416L10PHGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416L10PHGI8 is usually 5 days.
3.What payment methods are accepted for 71V416L10PHGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416L10PHGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V416L10PHGI8?
71V416L10PHGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V416L10PHGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V416L10PHGI8?
For technical support, including 71V416L10PHGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416L10PHGI8 requirements.
6.How does Aetrix verify that 71V416L10PHGI8 is sourced from the original manufacturer or authorized distributors?
All 71V416L10PHGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416L10PHGI8 meets industry standards.
7.What is the process for return or replacement of 71V416L10PHGI8?
All 71V416L10PHGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V416L10PHGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V416L10PHGI8 part is unused and in its original packaging.
Return procedure for 71V416L10PHGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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