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Renesas 71V416L12BEG8

Part No.:
71V416L12BEG8
Manufacturer:
Renesas
Category:
Memory
Package:
48-TFBGA
Datasheet:
Aetrix71V416L12BEG8.pdf
Description:
IC SRAM 4MBIT PARALLEL 48CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,644

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Product details

Overview

71V416L12BEG8 from Renesas Electronics is a 4-Mbit (256K × 16) low-power, high-speed CMOS static RAM with 12 ns access time, single 3.3 V supply operation, and LVTTL-compatible I/Os. It features separate byte enable (BHE/BLE), output enable (OE), and chip select (CS) for flexible memory control in embedded systems requiring deterministic timing and low standby current. Used in industrial networking controllers and real-time data buffering.

For engineers reviewing the 71V416L12BEG8 datasheet, 71V416L12BEG8 pinout, 71V416L12BEG8 application, or 71V416L12BEG8 equivalent, key selection criteria include its 12 ns read cycle time, 10 µA full-standby current, JEDEC-compliant SOJ/TSOP/BGA pinout, and industrial temperature support (–40°C to +85°C).

Technical Context

The 71V416L12BEG8 implements fully static asynchronous circuitry-no clocks or refresh required-and uses high-reliability CMOS technology optimized for deterministic memory access. Its dual-byte enable architecture enables independent 8-bit writes without affecting adjacent bytes, while the center-power/ground pinout reduces switching noise in dense PCB layouts.

Operation is controlled via three independent enable signals: CS governs device selection, OE controls output driver activation, and WE determines write direction; BHE/BLE further gate high/low byte paths. All timing parameters-including tAA = 12 ns, tRC = 12 ns, and tOE = 6 ns-are guaranteed across the industrial temperature range.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4,194,304 bits (256K × 16), enabling 32 KB of fast, non-refreshing storage per device
Access Time (tAA)12 ns max - guarantees address-to-data valid latency for real-time control loops
Supply Voltage3.0 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of board-level regulation variance
Full Standby Current (ISB1)10 µA max at VDD = max - supports ultra-low-power sleep modes in battery-backed systems
I/O InterfaceLVTTL-compatible bidirectional data bus - interoperable with 3.3 V microcontrollers and FPGAs without level shifters
Operating Temperature–40°C to +85°C - qualified for industrial automation, transportation, and outdoor equipment
Package48-ball BGA (BEG48), 9 mm × 9 mm - compact footprint for space-constrained embedded modules

Pinout & Package

71V416L12BEG8 is housed in a 48-ball fine-pitch ball grid array (BEG48) package with 0.8 mm pitch and 9 mm × 9 mm body size. Pin assignment follows JEDEC-standard BGA layout with power/ground distributed across central rows to minimize simultaneous switching noise.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit address bus supporting full 256K-word addressing; no address multiplexing required
CSChip SelectActive-low global enable; device enters high-Z standby when deasserted
OEOutput EnableActive-low control for output drivers; allows shared bus operation with other peripherals
WEWrite EnableActive-low signal determining read vs. write mode; latches data on falling edge
BHE / BLEByte EnableIndependent active-low controls for upper (I/O8–I/O15) and lower (I/O0–I/O7) data bytes
I/O0–I/O15Bidirectional Data16-bit LVTTL I/O bus; direction determined by WE and CS states per truth table
VDDPower SupplySingle 3.3 V core and I/O supply; decoupling required per Renesas layout guidelines
VSSGroundDedicated ground pins placed adjacent to VDD for low-inductance return paths

Key Features

FeatureDesign Value
JEDEC Center Power/Ground PinoutReduces simultaneous switching noise by symmetrically distributing VDD/VSS across the BGA array
Separate Byte Enables (BHE/BLE)Enables atomic 8-bit writes without disturbing adjacent byte-critical for protocol stack buffers
10 µA Full Standby Current (ISB1)Permits extended retention in power-gated subsystems without external keep-alive circuitry
12 ns Guaranteed Access TimeMeets timing closure for 83 MHz bus interfaces without wait states in FPGA-based controllers
Industrial Temperature Range SupportValidated operation from –40°C to +85°C ensures reliability in uncontrolled environmental deployments

Applications

Industrial PLC Data BufferingMedical Imaging Frame Storage

Use Scenario: Storing real-time I/O scan data between CPU polling cycles in programmable logic controllers.

IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state access for deterministic cyclic data capture.

Use Value: 12 ns tAA ensures sub-microsecond response to fieldbus interrupts, maintaining hard real-time deadlines.

Use Scenario: Holding uncompressed frame buffers during DICOM image acquisition in portable ultrasound units.

IC Role / Device Role / Timing Role: High-reliability, low-power memory staging pixel data before compression and transmission.

Use Value: 10 µA ISB1 extends battery life during idle periods without compromising wake-up latency.

Avionics Sensor Fusion ModuleRuggedized Network Switch Control Plane

Use Scenario: Temporarily aggregating inertial measurement unit (IMU) and GPS timestamped samples prior to Kalman filtering.

IC Role / Device Role / Timing Role: Deterministic-access SRAM acting as time-aligned sample FIFO with byte-selectable writes.

Use Value: Independent BHE/BLE pins allow concurrent timestamp (high byte) and sensor value (low byte) updates without bus contention.

Use Scenario: Caching MAC address tables and packet metadata in Layer 2 switches deployed in factory-floor environments.

IC Role / Device Role / Timing Role: Non-volatile-configurable buffer supporting rapid forwarding table lookups under thermal stress.

Use Value: Industrial-grade temperature qualification ensures consistent 12 ns performance across ambient swings from –40°C to +85°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY62167EV30LL-45ZSXI4-Mbit (256K × 16), 45 ns access, 5 V tolerant, SOIC-44 packageSlower timing; suited for legacy 5 V systems with relaxed latency budgetsSelect only if backward compatibility with 5 V logic or SOIC footprint is mandatory
AS6C4008-12BIN4-Mbit (256K × 16), 12 ns access, 3.3 V, 44-pin TSOP-II packageSame speed and voltage but different package (TSOP-II); lacks BGA density advantageChoose when board layout requires surface-mount TSOP and avoids BGA rework complexity

Compared with CY62167EV30LL-45ZSXI and AS6C4008-12BIN, the 71V416L12BEG8 delivers identical 12 ns performance in a space-saving 48-ball BGA while offering lower standby current (10 µA vs. 25 µA typical) and industrial temperature assurance-making it optimal for next-gen compact, thermally demanding embedded designs.

Availability

71V416L12BEG8 is available at Aetrix Electronics and suitable for industrial automation, medical imaging, avionics, and rugged network infrastructure requiring stable component supply, long-term lifecycle support, and guaranteed industrial temperature compliance.

Supply support for 71V416L12BEG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications.

The 71V416L12BEG8 belongs to Renesas' legacy high-speed SRAM product line, engineered specifically for deterministic, low-latency memory interfacing in mission-critical industrial and transportation systems.

FAQ

What is the maximum guaranteed access time for the 71V416L12BEG8?

The 71V416L12BEG8 has a maximum guaranteed address access time (tAA) of 12 ns across the full industrial temperature range (–40°C to +85°C), as specified in the AC Electrical Characteristics table. This value is production-tested and applies to all operating conditions within the recommended VDD (3.0 V to 3.6 V) and temperature limits. The 71V416L12BEG8 achieves this timing without requiring clocks or refresh cycles due to its fully static architecture.

Does the 71V416L12BEG8 support byte-level write operations?

Yes, the 71V416L12BEG8 supports independent byte-level writes via dedicated BHE (high byte enable) and BLE (low byte enable) inputs. When BHE is asserted low and BLE is high, only I/O8–I/O15 are written; conversely, asserting BLE low and BHE high writes only I/O0–I/O7. This capability is confirmed in the Truth Table and Functional Block Diagram, and enables efficient handling of mixed-width data structures without overwriting adjacent bytes. The 71V416L12BEG8 implements this using separate write drivers per byte lane.

What package type does the 71V416L12BEG8 use, and what are its mechanical dimensions?

The 71V416L12BEG8 uses a 48-ball fine-pitch ball grid array (BEG48) package with a 9 mm × 9 mm body size and 0.8 mm ball pitch. This package is distinct from the SOJ and TSOP variants in the same family and is documented in the Pin Configurations – BGA(1) section. The BEG48 variant provides higher I/O density and improved thermal performance compared to leaded packages, and is suitable for automated SMT assembly with standard BGA reflow profiles. The 71V416L12BEG8's pinout follows JEDEC MO-245 standards.

Is the 71V416L12BEG8 compatible with 3.3 V LVTTL logic families?

Yes, the 71V416L12BEG8 features LVTTL-compatible inputs and outputs, with VIH(min) = 2.0 V and VOH(min) = 2.4 V at VDD = 3.0 V, matching standard 3.3 V LVTTL thresholds. Its I/Os drive ±8 mA and tolerate input voltages from –0.3 V to VDD + 0.3 V, ensuring robust interoperability with FPGAs, microcontrollers, and ASICs using 3.3 V LVTTL signaling. This compatibility is explicitly stated in the DC Electrical Characteristics table and reinforced in the Description section. The 71V416L12BEG8 requires no external level-shifting circuitry when interfaced with LVTTL devices.

What is the full standby current (ISB1) specification for the 71V416L12BEG8?

The full standby current (ISB1) for the 71V416L12BEG8 is guaranteed at ≤10 µA maximum under static conditions (f = 0), with CS > VHC and outputs open, at VDD = max (3.6 V) and over the full industrial temperature range. This parameter reflects true static leakage with all internal circuitry gated off-distinct from dynamic standby (ISB). The low ISB1 enables energy-efficient sleep modes in battery-powered or thermally constrained applications. This value is verified per the DC Electrical Characteristics table and applies specifically to the 71V416L12BEG8 variant.

71V416L12BEG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
48-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-CABGA (9x9)

71V416L12BEG8 FAQ

1.How can I place an order for 71V416L12BEG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V416L12BEG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V416L12BEG8 reliable?

The price and inventory of 71V416L12BEG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416L12BEG8 is usually 5 days.

3.What payment methods are accepted for 71V416L12BEG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416L12BEG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V416L12BEG8?

71V416L12BEG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V416L12BEG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V416L12BEG8?

For technical support, including 71V416L12BEG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416L12BEG8 requirements.

6.How does Aetrix verify that 71V416L12BEG8 is sourced from the original manufacturer or authorized distributors?

All 71V416L12BEG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416L12BEG8 meets industry standards.

7.What is the process for return or replacement of 71V416L12BEG8?

All 71V416L12BEG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V416L12BEG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V416L12BEG8 part is unused and in its original packaging.

Return procedure for 71V416L12BEG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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