Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 71V416L12BEGI

Name: 71V416L12BEGI
Brand: Renesas
SKU: 71V416L12BEGI
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: 71V416L12BEGI

Manufacturer:: Renesas

Category:: Memory

Package:: 48-TFBGA

Datasheet:: 71V416L12BEGI.pdf

Description:: IC SRAM 4MBIT PARALLEL 48CABGA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:250

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

71V416L12BEGI from Renesas Electronics is a 4,194,304-bit (256K × 16) high-speed CMOS static RAM with 12 ns access time, single 3.3 V supply operation, and industrial temperature range (–40°C to +85°C). It features LVTTL-compatible bidirectional I/O, separate high- and low-byte enables (BHE/ BLE), and JEDEC-standard center power/ground pinout for noise reduction. Used in real-time embedded controllers requiring deterministic memory access without refresh.

For engineers reviewing the 71V416L12BEGI datasheet, 71V416L12BEGI pinout, 71V416L12BEGI application, or 71V416L12BEGI equivalent, key selection criteria include industrial-grade timing consistency, byte-selectable write capability, SOJ/TSOP/BGA package compatibility, and low-power standby current (10 mA typical).

Technical Context

The 71V416L12BEGI implements fully static asynchronous logic with no clocks or refresh required. Its address decoding supports 18-bit addressing (A0–A17), enabling direct 256K-word access across the 16-bit data bus (I/O0–I/O15).

It uses dual enable architecture: Chip Select (CS) controls device activation while Output Enable (OE) independently gates output drivers-enabling fast 5 ns OE-to-valid read response. Byte enables (BHE/ BLE) allow independent 8-bit writes without affecting the opposite byte lane.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Organization	256K × 16-bit (4,194,304 bits total); supports word-level random access without wait states.
Access Time (tAA)	12 ns max at VDD = 3.0–3.6 V and –40°C to +85°C; guarantees deterministic latency for hard real-time systems.
Supply Voltage	3.3 V nominal (3.0–3.6 V range); compatible with LVTTL logic families and modern low-voltage system rails.
Standby Current (ISB1)	10 mA max in full standby (CS high, no address transitions); enables low-power hold mode during processor sleep.
Input/Output Compatibility	LVTTL-compatible inputs and outputs; VIH = 2.0 V min, VOH = 2.4 V min at IOH = –4 mA ensures robust interfacing with FPGA/CPLD I/O banks.
Operating Temperature	–40°C to +85°C industrial grade; validated for use in automotive control units, industrial PLCs, and telecom line cards.
Package Type	48-ball BGA (BEG48), 9 mm × 9 mm, 0.8 mm pitch; supports high-density PCB layouts with improved thermal dissipation vs. SOJ/TSOP.

Pinout & Package

71V416L12BEGI is packaged in a 48-ball fine-pitch BGA (BEG48) with 9 mm × 9 mm footprint and 0.8 mm ball pitch. Pin 28 is NC or optionally connected to VSS per design flexibility.

Pin/Terminal	Circuit Role	Design Meaning
A0–A17	Address Inputs	18-bit address bus supporting full 256K-word addressing; all inputs are LVTTL-compatible with 7 pF max input capacitance.
CS	Chip Select	Active-low global enable; deactivates internal circuitry and forces I/O into high-Z when high, reducing dynamic current to 10 mA.
OE	Output Enable	Active-low output gate; enables data output within 5 ns of assertion, independent of CS timing for flexible bus arbitration.
WE	Write Enable	Active-low write strobe; initiates write cycle with 8 ns minimum pulse width; controls data latching on rising edge.
BHE / BLE	Byte Enable Inputs	Active-low enables for upper (I/O8–I/O15) and lower (I/O0–I/O7) bytes; allows partial-word writes without read-modify-write overhead.
I/O0–I/O15	Bidirectional Data Bus	16-bit LVTTL I/O with 8 pF max I/O capacitance; supports concurrent read/write via direction control by WE/OE state.
VDD / VSS	Power / Ground	Single 3.3 V supply pair; JEDEC center-power pinout minimizes simultaneous switching noise in high-speed parallel buses.

Key Features

Feature	Design Value
Industrial temperature support	Rated for –40°C to +85°C operation with guaranteed 12 ns access time across full range-enables deployment in harsh environments without derating.
Byte-selectable write capability	Dual independent byte enables (BHE/ BLE) permit 8-bit writes to either half of the 16-bit bus, eliminating unnecessary bus contention in mixed-data-width systems.
Low standby power	10 mA max ISB1 (full static standby) reduces system-level power budget impact during idle cycles-critical for fanless industrial enclosures.
LVTTL interface compliance	Guaranteed VIH ≥ 2.0 V and VOL ≤ 0.4 V at 8 mA sink ensure reliable interoperability with Xilinx Artix-7, Intel MAX 10, and Renesas RA MCU I/O banks.
48-ball BGA packaging	BEG48 package provides superior signal integrity and thermal performance over SOJ/TSOP variants, supporting >100 MHz bus clocking in dense routing scenarios.

Applications

Industrial PLC Memory Buffer	Automotive Engine Control Unit (ECU)
Use Scenario: Stores real-time sensor fusion results and actuator command queues in programmable logic controller backplanes. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between ARM Cortex-M7 CPU and fieldbus interface ASIC, providing zero-wait-state access at 83 MHz effective bus rate. Use Value: 12 ns tAA and byte-enable support reduce instruction fetch stalls and enable deterministic jitter-free I/O scanning at 1 ms cycle intervals.	Use Scenario: Holds calibration tables and transient engine parameter snapshots in Tier-1 ECU modules operating under under-hood thermal stress. IC Role / Device Role / Timing Role: Non-refresh volatile memory for fast lookup of fuel injection maps and knock sensor history buffers, directly mapped to AHB bus. Use Value: Industrial-grade –40°C to +85°C rating and 10 mA ISB1 ensure uninterrupted operation during cold cranking and sustained high-temperature idling.
Telecom Line Card Packet Buffer	Medical Imaging Real-Time Frame Store
Use Scenario: Temporarily stores packet headers and metadata in multi-gigabit Ethernet switch line cards before classification and forwarding. IC Role / Device Role / Timing Role: High-speed parallel SRAM interfaced to FPGA-based traffic manager, accepting burst writes at 100+ MB/s with precise byte alignment. Use Value: BHE/ BLE pins enable selective update of header fields without disturbing payload storage, minimizing bus arbitration latency.	Use Scenario: Captures raw pixel streams from ultrasound transducer arrays prior to GPU-accelerated beamforming in portable diagnostic devices. IC Role / Device Role / Timing Role: Low-latency frame buffer synchronized to ADC sampling clock, delivering 16-bit pixel data to DMA controller with <12 ns access uncertainty. Use Value: 48-ball BGA package enables compact layout adjacent to high-speed ADC and FPGA, reducing trace length-induced skew and jitter.

Industrial PLC Memory Buffer

Automotive Engine Control Unit (ECU)

Use Scenario: Stores real-time sensor fusion results and actuator command queues in programmable logic controller backplanes.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer between ARM Cortex-M7 CPU and fieldbus interface ASIC, providing zero-wait-state access at 83 MHz effective bus rate.

Use Value: 12 ns tAA and byte-enable support reduce instruction fetch stalls and enable deterministic jitter-free I/O scanning at 1 ms cycle intervals.

Use Scenario: Holds calibration tables and transient engine parameter snapshots in Tier-1 ECU modules operating under under-hood thermal stress.

IC Role / Device Role / Timing Role: Non-refresh volatile memory for fast lookup of fuel injection maps and knock sensor history buffers, directly mapped to AHB bus.

Use Value: Industrial-grade –40°C to +85°C rating and 10 mA ISB1 ensure uninterrupted operation during cold cranking and sustained high-temperature idling.

Telecom Line Card Packet Buffer

Medical Imaging Real-Time Frame Store

Use Scenario: Temporarily stores packet headers and metadata in multi-gigabit Ethernet switch line cards before classification and forwarding.

IC Role / Device Role / Timing Role: High-speed parallel SRAM interfaced to FPGA-based traffic manager, accepting burst writes at 100+ MB/s with precise byte alignment.

Use Value: BHE/ BLE pins enable selective update of header fields without disturbing payload storage, minimizing bus arbitration latency.

Use Scenario: Captures raw pixel streams from ultrasound transducer arrays prior to GPU-accelerated beamforming in portable diagnostic devices.

IC Role / Device Role / Timing Role: Low-latency frame buffer synchronized to ADC sampling clock, delivering 16-bit pixel data to DMA controller with <12 ns access uncertainty.

Use Value: 48-ball BGA package enables compact layout adjacent to high-speed ADC and FPGA, reducing trace length-induced skew and jitter.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed static RAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY62167EV30LL-45ZSXI	512K × 16 organization, 45 ns access, 3.3 V, SOIC-44; higher density but slower timing.	Suitable for non-real-time buffering where latency tolerance exceeds 30 ns.	Select when memory depth > 256K is required and 45 ns access suffices-no PCB redesign needed for SOIC-44 footprint.
AS6C4008-12TIN	256K × 16, 12 ns access, 3.3 V, TSOP-44; identical timing but commercial temp only (0°C to +70°C).	Limited to climate-controlled indoor equipment with no thermal cycling requirements.	Choose for cost-sensitive consumer or test equipment designs where industrial temperature range is not mandated.

Compared with 71V416L12BEGI, CY62167EV30LL-45ZSXI trades speed for density and package simplicity, while AS6C4008-12TIN matches timing but lacks industrial qualification-making 71V416L12BEGI the sole option for thermally demanding, latency-critical embedded systems requiring both 12 ns access and –40°C support.

Availability

71V416L12BEGI is available at Aetrix Electronics and suitable for industrial PLCs, automotive ECUs, telecom line cards, and medical imaging subsystems requiring stable component supply across extended lifecycle commitments.

Supply support for 71V416L12BEGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V416L12BEGI belongs to Renesas' legacy high-speed CMOS SRAM product line, engineered for deterministic, low-latency memory interfacing in mission-critical embedded systems where refresh-free operation and industrial reliability are mandatory.

FAQ

What is the maximum operating frequency supported by the 71V416L12BEGI?

The 71V416L12BEGI does not operate on a clock; it is an asynchronous SRAM. Its 12 ns access time (tAA) supports effective bus frequencies up to ~83 MHz in worst-case continuous-address scenarios. Cycle time (tRC) is also 12 ns, enabling back-to-back random accesses without inter-cycle delay.

Does the 71V416L12BEGI require external refresh circuitry?

No. The 71V416L12BEGI is a fully static RAM using CMOS latch-based cells. It retains data indefinitely as long as VDD is applied and requires no clocks, timers, or refresh cycles-unlike DRAM or pseudo-SRAM devices.

Can the 71V416L12BEGI be used with 5 V logic interfaces?

No. The 71V416L12BEGI is strictly a 3.3 V LVTTL device. Its absolute maximum input voltage is VDD + 0.5 V (≤4.1 V), and VIH is specified minimum 2.0 V-not compatible with 5 V TTL thresholds. Level-shifting circuitry is required for interfacing with 5 V systems.

What is the function of pin 28 on the BEG48 package of the 71V416L12BEGI?

Pin 28 on the 71V416L12BEGI BEG48 package is designated NC (No Connect), but may optionally be tied to VSS per board layout requirements. This flexibility aids ground plane routing and noise mitigation in high-density designs.

How does the 71V416L12BEGI handle partial-word writes?

The 71V416L12BEGI supports true partial-word writes via dedicated BHE (high byte) and BLE (low byte) inputs. Asserting only one enables writing to I/O8–I/O15 or I/O0–I/O7 independently-eliminating read-modify-write sequences and preserving unselected byte contents.

71V416L12BEGI Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 48-TFBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Asynchronous

Memory Size:: 4Mbit

Memory Organization:: 256K x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 12ns

Access Time:: 12 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 48-CABGA (9x9)

71V416L12BEGI FAQ

1.How can I place an order for 71V416L12BEGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V416L12BEGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V416L12BEGI reliable?

The price and inventory of 71V416L12BEGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416L12BEGI is usually 5 days.

3.What payment methods are accepted for 71V416L12BEGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416L12BEGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V416L12BEGI?

71V416L12BEGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V416L12BEGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V416L12BEGI?

For technical support, including 71V416L12BEGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416L12BEGI requirements.

6.How does Aetrix verify that 71V416L12BEGI is sourced from the original manufacturer or authorized distributors?

All 71V416L12BEGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416L12BEGI meets industry standards.

7.What is the process for return or replacement of 71V416L12BEGI?

All 71V416L12BEGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V416L12BEGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V416L12BEGI part is unused and in its original packaging.

Return procedure for 71V416L12BEGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…