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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Renesas 71V416L12PHG8

Name: 71V416L12PHG8
Brand: Renesas
SKU: 71V416L12PHG8
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: 71V416L12PHG8

Manufacturer:: Renesas

Category:: Memory

Package:: 44-TSOP (0.400", 10.16mm Width)

Datasheet:: 71V416L12PHG8.pdf

Description:: IC SRAM 4MBIT PARALLEL 44TSOP II

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Product details

Overview

71V416L12PHG8 from Renesas Electronics is a 4-Mbit (256K × 16) high-speed CMOS static RAM with 12 ns access time, single 3.3 V supply operation, LVTTL-compatible I/O, and JEDEC-standard center-power/ground pinout for noise reduction. It supports byte-wide and word-wide read/write operations in industrial temperature range (–40°C to +85°C) and is used in real-time embedded controllers requiring deterministic memory latency.

For engineers reviewing the 71V416L12PHG8 datasheet, 71V416L12PHG8 pinout, 71V416L12PHG8 application, or 71V416L12PHG8 equivalent, key selection criteria include its 12 ns tAA/tACS timing, low-power standby current (ISB = 45 mA max), dual byte enable (BHE/BLE), and TSOP Type II (PHG44) package compatibility with space-constrained industrial PCB layouts.

Technical Context

This device implements fully static asynchronous circuitry-no clocks or refresh required-and uses high-reliability CMOS fabrication optimized for stable operation across industrial temperature extremes. Its bidirectional I/O buffers are LVTTL-compatible with VIH = 2.0 V min and VOL = 0.4 V max at 8 mA sink, ensuring interoperability with legacy 3.3 V logic families.

The memory array is organized as 256K words × 16 bits, with independent high-byte (I/O8–I/O15) and low-byte (I/O0–I/O7) control via BHE and BLE pins. Chip select (CS), output enable (OE), and write enable (WE) support multiple access modes-including word, high-byte, and low-byte reads/writes-as confirmed by the truth table and timing waveforms.

Key Specifications

Parameter	Value and Actual Design Meaning
Memory Density	4,194,304 bits (256K × 16), enabling direct interface to 16-bit data buses without external multiplexing.
Access Time (tAA)	12 ns max (industrial grade), guaranteeing sub-83 MHz random read throughput in synchronous bus systems.
Supply Voltage	3.0 V to 3.6 V - operates reliably across full 3.3 V rail tolerance without external regulation.
Standby Current (ISB)	45 mA max (industrial), reducing power in sleep states while maintaining fast wake-up capability.
I/O Interface	LVTTL-compatible with 0.4 V VOL (8 mA) and 2.4 V VOH (–4 mA), ensuring signal integrity on 50 Ω transmission lines.
Package	44-pin TSOP Type II (PHG44), 400 mil width - compatible with standard surface-mount reflow profiles and automated assembly.
Temperature Range	–40°C to +85°C - qualified for industrial control, motor drives, and transportation electronics.

Pinout & Package

71V416L12PHG8 is packaged in a 44-pin, 400-mil TSOP Type II (PHG44) with JEDEC-standard center-power/ground pinout for reduced switching noise. Pin 1 is located at the top-left corner of the top view, with pins numbered counter-clockwise.

Pin/Terminal	Circuit Role	Design Meaning
A0–A17	Address Inputs	18-bit address bus supporting full 256K-word addressing; no address multiplexing required.
CS	Chip Select	Active-low enable controlling device selection; enables low-power standby when deasserted.
OE	Output Enable	Active-low control for output drivers; allows shared-bus operation with tOE = 6 ns max (industrial).
WE	Write Enable	Active-low write strobe; initiates write cycles with tWP = 8 ns min and tDW = 6 ns min setup.
BHE / BLE	Byte Enable	Independent high- and low-byte controls enabling 8-bit partial writes without disturbing adjacent bytes.
I/O0–I/O15	Bidirectional Data	16-bit LVTTL I/O bus with high-impedance state during deselect or OE high; supports byte/word granularity.
VDD	Power Supply	3.3 V core supply; two dedicated VDD pins (pins 13 and 27) reduce IR drop and improve noise immunity.
VSS	Ground	Ground reference; two dedicated VSS pins (pins 12 and 26) provide low-inductance return paths.

Key Features

Feature	Design Value
JEDEC Center Power/GND Pinout	Reduces simultaneous switching noise (SSN) by minimizing ground bounce and supply ripple during high-speed access.
Equal Access & Cycle Times	tAA = tRC = 12 ns ensures predictable timing margins in both read and write cycles - simplifies timing closure in FPGA/CPU interfaces.
Dual Byte Enable (BHE/BLE)	Enables selective 8-bit writes to upper or lower byte lanes without read-modify-write overhead - critical for efficient peripheral register access.
Low-Power Standby Mode	ISB = 45 mA max (industrial) reduces system-level power consumption during idle periods while retaining data retention.
Single 3.3 V Supply Operation	Eliminates need for dual-voltage rails or level shifters - lowers BOM cost and board complexity in modern 3.3 V systems.

Applications

Industrial PLC Memory Buffer	Medical Imaging Frame Store
Use Scenario: Stores real-time I/O scan data and ladder logic variables in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Asynchronous SRAM buffer interfacing directly to microcontroller or FPGA data bus with deterministic 12 ns access. Use Value: Industrial temperature rating (–40°C to +85°C) and low ISB ensure reliable operation during extended thermal cycling and unattended runtime.	Use Scenario: Holds uncompressed image frames (e.g., ultrasound or endoscopy) during acquisition before compression and transfer to host processor. IC Role / Device Role / Timing Role: High-speed frame buffer providing burst-mode read/write capability with byte-selectable writes to manage pixel alignment. Use Value: Dual BHE/BLE enables efficient 8-bit pixel packing into 16-bit words, reducing memory bandwidth pressure during real-time capture.
Avionics Data Logger	Test & Measurement Equipment
Use Scenario: Captures sensor telemetry (accelerometer, gyroscope, pressure) at kHz rates in airborne black-box recorders with strict EMI requirements. IC Role / Device Role / Timing Role: Deterministic-access SRAM acting as first-stage circular buffer before flash storage, synchronized to discrete clock domains. Use Value: JEDEC center-power/ground pinout minimizes radiated emissions - critical for DO-160 compliance in avionics subsystems.	Use Scenario: Serves as acquisition memory in digital oscilloscopes and logic analyzers capturing high-speed digital signals at multi-GHz sampling rates. IC Role / Device Role / Timing Role: Low-latency memory bank feeding FIFO controllers or direct-to-ADC data path with minimal pipeline delay. Use Value: 12 ns tAA and tOE allow tight timing alignment between trigger events and stored waveform data - essential for jitter-sensitive measurements.

Industrial PLC Memory Buffer

Medical Imaging Frame Store

Use Scenario: Stores real-time I/O scan data and ladder logic variables in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer interfacing directly to microcontroller or FPGA data bus with deterministic 12 ns access.

Use Value: Industrial temperature rating (–40°C to +85°C) and low ISB ensure reliable operation during extended thermal cycling and unattended runtime.

Use Scenario: Holds uncompressed image frames (e.g., ultrasound or endoscopy) during acquisition before compression and transfer to host processor.

IC Role / Device Role / Timing Role: High-speed frame buffer providing burst-mode read/write capability with byte-selectable writes to manage pixel alignment.

Use Value: Dual BHE/BLE enables efficient 8-bit pixel packing into 16-bit words, reducing memory bandwidth pressure during real-time capture.

Avionics Data Logger

Test & Measurement Equipment

Use Scenario: Captures sensor telemetry (accelerometer, gyroscope, pressure) at kHz rates in airborne black-box recorders with strict EMI requirements.

IC Role / Device Role / Timing Role: Deterministic-access SRAM acting as first-stage circular buffer before flash storage, synchronized to discrete clock domains.

Use Value: JEDEC center-power/ground pinout minimizes radiated emissions - critical for DO-160 compliance in avionics subsystems.

Use Scenario: Serves as acquisition memory in digital oscilloscopes and logic analyzers capturing high-speed digital signals at multi-GHz sampling rates.

IC Role / Device Role / Timing Role: Low-latency memory bank feeding FIFO controllers or direct-to-ADC data path with minimal pipeline delay.

Use Value: 12 ns tAA and tOE allow tight timing alignment between trigger events and stored waveform data - essential for jitter-sensitive measurements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed static RAM applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
CY62167EV30LL-45ZSXI	512K × 16, 45 ns access, 3.3 V, SOIC-44 - slower but higher density and wider availability.	Used where longer access time is acceptable and larger buffer size is needed (e.g., firmware staging).	Select when system timing budget permits >30 ns latency and board layout accommodates SOIC instead of TSOP.
AS6C4008-12TIN	256K × 16, 12 ns access, 3.3 V, TSOP-44 - identical speed and organization, but lower ISB (25 mA) and different manufacturer qualification.	Preferred in cost-sensitive industrial designs requiring same timing but tighter power constraints.	Choose for new designs prioritizing ultra-low standby current without changing PCB footprint or timing analysis.

Compared with 71V416L12PHG8, CY62167EV30LL-45ZSXI trades speed for density and package flexibility, while AS6C4008-12TIN matches timing and form factor but delivers 45% lower standby current - making it suitable for battery-backed or thermally constrained deployments.

Availability

71V416L12PHG8 is available at Aetrix Electronics and suitable for industrial PLCs, medical imaging subsystems, avionics data loggers, and test equipment requiring stable component supply across extended product lifecycles.

Supply support for 71V416L12PHG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.

The 71V416L family was designed specifically for high-reliability, low-latency memory buffering in industrial and transportation systems where deterministic timing, wide temperature operation, and noise-immune packaging are mandatory.

FAQ

What is the maximum operating temperature range for the 71V416L12PHG8?

The 71V416L12PHG8 is rated for industrial temperature operation from –40°C to +85°C. This specification is validated per Renesas' DC and AC electrical characteristics tables under "Recommended Operating Temperature and Supply Voltage" and confirmed in the ordering information where "I" denotes industrial grade. The device maintains full functionality-including 12 ns access time and 45 mA max ISB-across this full range.

Does the 71V416L12PHG8 require external refresh circuitry?

No, the 71V416L12PHG8 is a fully static RAM and requires no refresh cycles or clocks. Its internal circuitry is asynchronous and retains data indefinitely as long as VDD remains within 3.0 V–3.6 V and ambient temperature stays within –40°C to +85°C. This eliminates timing-critical refresh overhead in microcontroller or FPGA-based systems.

Can the 71V416L12PHG8 be used with 5 V logic interfaces?

No - the 71V416L12PHG8 is strictly a 3.3 V LVTTL device. Its absolute maximum input voltage is VDD + 0.5 V (≤4.1 V), and VIH minimum is 2.0 V. Direct connection to 5 V logic violates absolute maximum ratings and risks permanent damage. Level translation (e.g., TXB0108) is required for mixed-voltage systems.

What is the function of the BHE and BLE pins on the 71V416L12PHG8?

BHE (Byte High Enable) and BLE (Byte Low Enable) are active-low inputs that independently control access to the upper (I/O8–I/O15) and lower (I/O0–I/O7) data bytes. When only one is asserted during a write cycle, only that byte is updated - enabling efficient 8-bit peripheral register updates without read-modify-write sequences or bus contention.

Is the 71V416L12PHG8 RoHS-compliant and halogen-free?

Yes - the 71V416L12PHG8 is a green part, as indicated in the "Features" section ("Green parts available") and confirmed in the "Ordering Information" where "G" suffix denotes RoHS-compliant, halogen-free packaging. Renesas' 2021 datasheet revision explicitly references "Restricted hazardous substance device" compliance per applicable standards.

71V416L12PHG8 Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 44-TSOP (0.400", 10.16mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Programmable:: Not Verified

Memory Type:: Volatile

Memory Format:: SRAM

Technology:: SRAM - Asynchronous

Memory Size:: 4Mbit

Memory Organization:: 256K x 16

Memory Interface:: Parallel

Clock Frequency:: -

Write Cycle Time - Word, Page:: 12ns

Access Time:: 12 ns

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 44-TSOP II

71V416L12PHG8 FAQ

1.How can I place an order for 71V416L12PHG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V416L12PHG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V416L12PHG8 reliable?

The price and inventory of 71V416L12PHG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416L12PHG8 is usually 5 days.

3.What payment methods are accepted for 71V416L12PHG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416L12PHG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V416L12PHG8?

71V416L12PHG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V416L12PHG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V416L12PHG8?

For technical support, including 71V416L12PHG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416L12PHG8 requirements.

6.How does Aetrix verify that 71V416L12PHG8 is sourced from the original manufacturer or authorized distributors?

All 71V416L12PHG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416L12PHG8 meets industry standards.

7.What is the process for return or replacement of 71V416L12PHG8?

All 71V416L12PHG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V416L12PHG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V416L12PHG8 part is unused and in its original packaging.

Return procedure for 71V416L12PHG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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