My Inquiry
My Account
Renesas 71V416L12PHGI
- Part No.:
- 71V416L12PHGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
71V416L12PHGI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:
- Shipping:
Inventory:170
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V416L12PHGI from Renesas Electronics is a 4-Mbit (256K × 16) low-power, high-speed CMOS static RAM with 12 ns access time, single 3.3 V supply operation, and industrial temperature range (–40°C to +85°C). It features separate byte enable (BHE/BLE), LVTTL-compatible I/Os, and JEDEC-standard center power/ground pinout for noise reduction-used in real-time embedded controllers requiring deterministic memory access without refresh.
For engineers reviewing the 71V416L12PHGI datasheet, 71V416L12PHGI pinout, 71V416L12PHGI application, or 71V416L12PHGI equivalent, key selection criteria include industrial-grade timing consistency, byte-selectable write capability, SOJ/TSOP package compatibility, and low-standby current (10 mA max) in full standby mode.
Technical Context
This device implements fully static asynchronous architecture-no clocks or refresh required-and uses dual-byte write control (BHE/BLE) to enable independent 8-bit writes to upper or lower data words. Its address access time (tAA = 12 ns) and read cycle time (tRC = 12 ns) are matched, ensuring symmetrical read performance across all operating conditions.
The 71V416L12PHGI supports three distinct write control modes: WE-controlled, CS-controlled, and BHE/BLE-controlled, each with defined setup/hold and pulse-width requirements (e.g., tWP = 8 ns min). All inputs and outputs meet LVTTL voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) at 3.3 V supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4,194,304 bits (256K × 16), enabling direct interface to 16-bit microcontrollers without data bus multiplexing. |
| Access Time (tAA) | 12 ns maximum-guarantees deterministic latency for time-critical buffer or cache applications in industrial PLCs. |
| Supply Voltage | 3.0 V to 3.6 V-compatible with standard 3.3 V logic rails and tolerant of typical board-level ripple. |
| Standby Current (ISB1) | 10 mA maximum at VDD = max and f = 0-enables ultra-low-power hold states in battery-backed systems. |
| Operating Temperature | –40°C to +85°C-qualified for use in automotive engine control units and industrial motor drives. |
| Input/Output Compatibility | LVTTL-ensures seamless interoperability with FPGA I/O banks, ASIC interfaces, and legacy 3.3 V microprocessors. |
| Package Type | 44-pin, 400-mil TSOP Type II (PHG44)-supports high-density PCB layouts with standard reflow profiles. |
Pinout & Package
71V416L12PHGI is housed in a 44-pin, 400-mil TSOP Type II package (PHG44) with JEDEC-standard center power/ground pinout for reduced switching noise and improved signal integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; no address multiplexing required. |
| CS | Chip Select | Active-low enable controlling device selection; must be stable before address or control transitions. |
| OE | Output Enable | Active-low control for output drivers; enables fast 5 ns output valid timing independent of WE. |
| WE | Write Enable | Active-low signal initiating write cycles; supports multiple write timing modes (WE-, CS-, or BHE/BLE-controlled). |
| BHE / BLE | Byte Enable | Independent active-low controls for upper (I/O8–I/O15) and lower (I/O0–I/O7) byte writes-eliminates need for external gating logic. |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit LVTTL-compatible I/O lines; high-impedance state when CS, OE, BHE, or BLE inactive. |
| VDD | Power Supply | 3.3 V core supply; two dedicated pins (pins 13 & 32) reduce IR drop and improve noise immunity. |
| VSS | Ground | Ground reference; two dedicated pins (pins 12 & 31) provide low-inductance return paths. |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC Center Power/Ground Pinout | Reduces simultaneous switching noise by distributing VDD/VSS across center positions-critical for EMI-sensitive industrial environments. |
| Equal Access and Cycle Times | tAA = tRC = 12 ns ensures predictable worst-case latency for both random and sequential reads-simplifies real-time scheduler design. |
| Dual Byte Write Enable (BHE/BLE) | Enables selective 8-bit writes without masking logic or additional control signals-reduces FPGA resource usage and PCB routing complexity. |
| Low-Power Standby Mode | ISB1 = 10 mA max at zero address activity allows extended hold states in energy-constrained edge devices. |
| Industrial Temperature Range | –40°C to +85°C qualification supports deployment in uncontrolled enclosures such as factory-floor HMIs and outdoor telecom nodes. |
Applications
| Industrial PLC Data Buffer | Automotive Engine Control Unit (ECU) |
|---|---|
|
Use Scenario: Real-time I/O scan buffering in programmable logic controllers where deterministic memory access prevents scan-time jitter. IC Role / Device Role / Timing Role: Asynchronous SRAM providing zero-wait-state 16-bit data storage for input/output image tables and intermediate calculation results. Use Value: 12 ns tAA guarantees sub-microsecond response to fieldbus interrupts, meeting IEC 61131-3 cycle-time requirements. |
Use Scenario: Storing calibrated sensor lookup tables and transient engine parameters in closed-loop fuel injection control. IC Role / Device Role / Timing Role: Non-refreshing memory holding critical runtime variables during cold cranking when main CPU clock may be unstable. Use Value: Full industrial temperature range and 10 mA ISB1 support reliable operation at –40°C ambient and under hood thermal stress. |
| Medical Imaging Frame Buffer | Avionics Display Controller |
|
Use Scenario: Temporary storage of digitized X-ray or ultrasound frames prior to compression and transmission over DICOM networks. IC Role / Device Role / Timing Role: High-bandwidth, low-latency frame buffer interfacing directly to 16-bit ADC/DAC pipelines and FPGA pixel processors. Use Value: Matched 12 ns access/cycle times and LVTTL compatibility eliminate glue logic between imaging SoC and memory subsystem. |
Use Scenario: Holding display list commands and glyph bitmaps in certified flight deck display management units (DMUs). IC Role / Device Role / Timing Role: Deterministic-access SRAM ensuring guaranteed worst-case rendering latency for primary flight displays (PFDs). Use Value: JEDEC center VDD/VSS pinout minimizes radiated emissions-supporting DO-160 Section 20 Level A EMC compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-45ZSXI | 512K × 16 organization, 45 ns access, 2.5 V supply-larger density but slower and incompatible voltage. | Suitable for non-time-critical data logging where bandwidth is secondary to capacity. | Select only if system redesign accommodates 2.5 V rail and relaxed timing; not drop-in compatible. |
| AS6C4008-12ZIN | 512K × 8 organization, 12 ns access, 3.3 V supply-same speed but narrower 8-bit bus and different pinout. | Fits 8-bit microcontroller buses; requires two devices for 16-bit width, increasing layout area and power. | Use when cost-per-bit is prioritized over board space and single-device simplicity. |
Compared with CY62167EV30LL-45ZSXI and AS6C4008-12ZIN, the 71V416L12PHGI delivers optimal balance of 16-bit bus width, industrial-grade 12 ns timing, and 3.3 V compatibility-minimizing redesign effort while meeting deterministic latency requirements in safety-critical embedded systems.
Availability
71V416L12PHGI is available at Aetrix Electronics and suitable for industrial automation, automotive electronics, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for 71V416L12PHGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.
The 71V416L12PHGI belongs to Renesas' legacy high-speed SRAM portfolio, engineered specifically for deterministic, low-latency memory in harsh-environment embedded control systems.
FAQ
What is the maximum operating frequency supported by the 71V416L12PHGI?
The 71V416L12PHGI does not operate on a clock; it is an asynchronous SRAM. Its maximum effective throughput is determined by its 12 ns read/write cycle time (tRC), enabling up to ~83 MHz sustained random access in ideal conditions. System-level bandwidth depends on bus protocol overhead and controller arbitration-not internal clocking.
Does the 71V416L12PHGI require refresh circuitry or periodic maintenance?
No-the 71V416L12PHGI is a fully static CMOS SRAM and requires no refresh cycles, clocks, or periodic maintenance. Data retention is indefinite as long as VDD remains within specification (3.0–3.6 V) and temperature stays within –40°C to +85°C. This eliminates refresh-related timing constraints in real-time systems.
Can the 71V416L12PHGI be used with a 5 V microcontroller interface?
No-the 71V416L12PHGI is strictly a 3.3 V LVTTL device. Its absolute maximum input voltage is VDD + 0.5 V (≤ 4.1 V), and VIH minimum is 2.0 V. Direct connection to 5 V logic risks damage and violates DC operating conditions. Level-shifting circuitry is mandatory for 5 V host interfaces.
What is the purpose of the NC (No Connect) pin on the 71V416L12PHGI TSOP package?
Pin 28 in the PHG44 TSOP package is designated NC (No Connect) per Renesas datasheet revision May.26.21. It must remain unconnected-neither tied to VDD nor VSS. This pin has no internal bond wire and serves only as mechanical reinforcement; grounding or powering it may cause unpredictable behavior or reliability issues.
How does the 71V416L12PHGI handle simultaneous byte writes to upper and lower data lanes?
The 71V416L12PHGI does not support simultaneous BHE and BLE assertion for concurrent byte writes. When both BHE and BLE are low, the device performs a full 16-bit word write. To write upper and lower bytes independently, software must issue two separate write cycles-first with BHE low/ BLE high, then with BHE high/ BLE low-ensuring correct data alignment and timing compliance.
71V416L12PHGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 12ns
- Access Time:
- 12 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
71V416L12PHGI FAQ
1.How can I place an order for 71V416L12PHGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V416L12PHGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V416L12PHGI reliable?
The price and inventory of 71V416L12PHGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416L12PHGI is usually 5 days.
3.What payment methods are accepted for 71V416L12PHGI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416L12PHGI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V416L12PHGI?
71V416L12PHGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V416L12PHGI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V416L12PHGI?
For technical support, including 71V416L12PHGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416L12PHGI requirements.
6.How does Aetrix verify that 71V416L12PHGI is sourced from the original manufacturer or authorized distributors?
All 71V416L12PHGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416L12PHGI meets industry standards.
7.What is the process for return or replacement of 71V416L12PHGI?
All 71V416L12PHGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V416L12PHGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V416L12PHGI part is unused and in its original packaging.
Return procedure for 71V416L12PHGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V416L12PHGI Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
