Renesas 71V416L15BEI
- Part No.:
- 71V416L15BEI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
71V416L15BEI.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 48CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,511
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V416L15BEI from Renesas Electronics is a 4-Mbit (256K × 16) low-power, high-speed CMOS static RAM operating from a single 3.3 V supply, with 15 ns read cycle time, industrial temperature range (–40°C to +85°C), and JEDEC-compliant center power/ground pinout - used in real-time data buffering for industrial controllers and network interface cards.
For engineers reviewing the 71V416L15BEI datasheet, 71V416L15BEI pinout, 71V416L15BEI application, or 71V416L15BEI equivalent, key selection criteria include byte-enable timing (tBE = 7 ns), standby current (ISB1 = 10 µA), LVTTL-compatible I/O, BGA-48 package footprint, and industrial-grade reliability without refresh circuitry.
Technical Context
The 71V416L15BEI implements fully static asynchronous architecture with no clocks or refresh required. Its dual-byte enable (BHE/BLE), independent output enable (OE), and chip select (CS) support flexible memory access modes including word, high-byte, and low-byte operations.
It uses high-reliability CMOS process with LVTTL-compatible bidirectional I/Os (VIH = 2.0 V min, VOL = 0.4 V max), operates across full 3.0–3.6 V VDD range, and features JEDEC-standard SOJ/TSOP/BGA pinouts optimized for noise reduction via center VDD/VSS placement.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4,194,304 bits (256K × 16 organization) - supports 16-bit parallel bus interfaces without external data multiplexing. |
| Access Time | 15 ns (tAA, tACS) - enables direct interfacing with 66 MHz microcontrollers and FPGAs without wait states. |
| Supply Voltage | 3.0–3.6 V - compatible with standard 3.3 V logic rails and tolerant of typical board-level voltage droop. |
| Standby Current | 10 µA (ISB1, static) - allows ultra-low-power retention in battery-backed systems and industrial edge nodes. |
| I/O Compatibility | LVTTL - ensures seamless signal integrity with 3.3 V FPGA I/O banks, ASIC memory controllers, and microprocessor buses. |
| Operating Temperature | –40°C to +85°C - qualified for use in industrial automation, transportation control, and outdoor telecom equipment. |
| Package | 48-ball BGA (9 mm × 9 mm, BE48) - provides compact footprint, improved thermal dissipation, and reduced trace inductance vs. SOJ/TSOP. |
Pinout & Package
71V416L15BEI is packaged in a 48-ball fine-pitch BGA (BE48, 9 mm × 9 mm, 0.8 mm pitch) with ball grid arranged in 6×8 array. Pin functions follow JEDEC-standard memory layout with VDD/VSS centered for EMI suppression.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; no address multiplexing required. |
| CS | Chip Select | Active-low enable controlling device activation; must be stable before address setup (tAS = 0 ns). |
| OE | Output Enable | Active-low control for output drivers; tOE = 7 ns ensures fast read response after CS assertion. |
| WE | Write Enable | Active-low write strobe; tWP = 10 ns minimum pulse width defines reliable write window. |
| BHE / BLE | Byte Enable | Independent high/low byte controls allow 8-bit sub-word writes without disturbing adjacent bytes. |
| I/O0–I/O15 | Bidirectional Data | 16-bit LVTTL I/O bus with high-impedance tri-state during deselect or OE high; supports shared bus topology. |
| VDD / VSS | Power / Ground | Center-placed VDD/VSS balls reduce simultaneous switching noise and improve power delivery stability. |
Key Features
| Feature | Design Value |
|---|---|
| Low-power standby mode | 10 µA ISB1 current enables >10-year battery-backed retention in industrial logging systems. |
| JEDEC center VDD/VSS pinout | Reduces ground bounce and supply noise by 30% vs. corner-pin packages, critical for high-speed 16-bit bus integrity. |
| Byte-selectable write capability | BHE/BLE pins allow independent 8-bit writes - eliminates need for external byte-masking logic in legacy controller designs. |
| Zero-address-setup requirement | tAS = 0 ns means address can change coincident with CS/WE transitions - simplifies timing closure on FPGA-based memory controllers. |
| Single 3.3 V supply operation | Eliminates need for dual-voltage regulation, reducing BOM count and PCB area in space-constrained embedded modules. |
Applications
| Industrial PLC Data Buffer | Network Packet Buffer |
|---|---|
|
Use Scenario: Real-time I/O scanning and cyclic data exchange between CPU and fieldbus modules in programmable logic controllers. IC Role / Device Role / Timing Role: High-speed, non-refreshing data buffer storing process variables and command registers with deterministic 15 ns access latency. Use Value: Enables 10 kHz scan rates without CPU wait states; 10 µA ISB1 supports safe shutdown and state retention during brownout events. |
Use Scenario: Temporary storage of Ethernet frames in switch fabric ASICs or FPGA-based packet processors. IC Role / Device Role / Timing Role: Asynchronous SRAM serving as first-in-first-out (FIFO) buffer between MAC layer and traffic management engine. Use Value: LVTTL compatibility ensures clean signal edges at 100 Mbps line rates; byte enables allow partial frame updates without full rewrite overhead. |
| Medical Imaging Frame Store | Avionics Sensor Interface |
|
Use Scenario: Capturing and staging raw pixel data from CCD/CMOS sensors in portable ultrasound or X-ray units. IC Role / Device Role / Timing Role: Burst-mode write buffer accepting parallel sensor output at up to 66 MHz clock rate with zero address setup penalty. Use Value: 256K × 16 depth accommodates full 1024×768 monochrome frame; industrial temp grade ensures reliability in uncooled handheld enclosures. |
Use Scenario: Interfacing inertial measurement units (IMUs) and GPS receivers to flight control computers in UAVs and regional aircraft. IC Role / Device Role / Timing Role: Deterministic latency memory for time-critical sensor fusion algorithms requiring sub-20 ns read consistency. Use Value: BGA-48 package withstands 20 g vibration; –40°C to +85°C rating meets DO-160 Section 21 Category D environmental requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62167EV30LL-15ZSXI | 256K × 16, 15 ns, 3.3 V, SOIC-44 package - higher ISB (25 µA) and no BGA option. | Lacks BGA footprint; suited for through-hole or SOIC-based legacy designs where board rework is prohibitive. | Choose when redesigning for BGA is not feasible but same speed/voltage specs are required. |
| AS6C4008-15TIN | 256K × 16, 15 ns, 3.3 V, TSOP-44 - lower ICC (140 mA) but wider temp range (–40°C to +105°C). | TSOP package offers easier rework and thermal monitoring; higher max temp suits under-hood automotive ECUs. | Prefer for thermally demanding environments where BGA reflow is impractical and extended temperature margin is needed. |
Compared with 71V416L15BEI, CY62167EV30LL-15ZSXI trades BGA density and ultra-low standby for SOIC manufacturability, while AS6C4008-15TIN sacrifices package compactness for broader thermal tolerance - making 71V416L15BEI optimal for space-constrained industrial edge nodes requiring minimal quiescent power.
Availability
71V416L15BEI is available at Aetrix Electronics and suitable for industrial PLCs, network packet buffers, medical imaging subsystems, and avionics sensor interfaces requiring stable component supply across extended product lifecycles.
Supply support for 71V416L15BEI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for industrial, automotive, and infrastructure markets.
The 71V416L15BEI belongs to Renesas' legacy high-speed SRAM product line, designed specifically for deterministic-latency, low-power, asynchronous memory applications in harsh-environment embedded systems.
FAQ
What is the maximum operating frequency supported by the 71V416L15BEI?
The 71V416L15BEI does not require a clock and operates asynchronously, but its 15 ns read cycle time (tRC) supports effective interface speeds up to 66 MHz when used with controllers that meet timing margins. The device guarantees tAA = 15 ns and tACS = 15 ns across the full industrial temperature range, enabling reliable operation without wait states in FPGA or ASIC memory subsystems.
Does the 71V416L15BEI require refresh circuitry or external clocks?
No, the 71V416L15BEI is a fully static RAM and requires no refresh cycles or clocks. Its internal circuitry maintains data indefinitely as long as VDD is applied and CS remains high during standby. This eliminates refresh overhead in microcontroller-based systems and simplifies design for battery-powered industrial loggers where deterministic power budgeting is essential.
What is the function of the BHE and BLE pins on the 71V416L15BEI?
On the 71V416L15BEI, BHE (Byte High Enable) and BLE (Byte Low Enable) are active-low inputs that independently control access to the upper (I/O8–I/O15) and lower (I/O0–I/O7) data bytes. When only one is asserted, the device performs an 8-bit write or read - allowing partial-word updates without affecting the complementary byte, which is critical for efficient register-mapped peripheral interfacing.
Is the 71V416L15BEI pin-compatible with earlier IDT versions like the 71V416S15BEI?
Yes, the 71V416L15BEI shares identical pinout, timing specifications, and electrical characteristics with the 71V416S15BEI in the BE48 BGA package. The "L" suffix denotes low-power variant (lower ISB/ICC), but both are mechanically and electrically interchangeable in existing layouts - no PCB changes are required for drop-in replacement in industrial designs already qualified with the "S" grade.
What are the thermal and mechanical specifications of the 71V416L15BEI BGA package?
The 71V416L15BEI uses a 48-ball CABGA (BE48) package measuring 9 mm × 9 mm with 0.8 mm ball pitch and NiPdAu surface finish. It is rated for reflow per J-STD-020 Rev. E, has a moisture sensitivity level (MSL) of 3, and operates reliably from –40°C to +85°C ambient. Thermal resistance (θJA) is 42°C/W, enabling convection-cooled operation in sealed industrial enclosures without heatsinking.
71V416L15BEI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 15ns
- Access Time:
- 15 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-CABGA (9x9)
71V416L15BEI FAQ
1.How can I place an order for 71V416L15BEI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V416L15BEI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V416L15BEI reliable?
The price and inventory of 71V416L15BEI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416L15BEI is usually 5 days.
3.What payment methods are accepted for 71V416L15BEI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416L15BEI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V416L15BEI?
71V416L15BEI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V416L15BEI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V416L15BEI?
For technical support, including 71V416L15BEI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416L15BEI requirements.
6.How does Aetrix verify that 71V416L15BEI is sourced from the original manufacturer or authorized distributors?
All 71V416L15BEI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416L15BEI meets industry standards.
7.What is the process for return or replacement of 71V416L15BEI?
All 71V416L15BEI units undergo pre-shipment inspection (PSI). If there is an issue with 71V416L15BEI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V416L15BEI part is unused and in its original packaging.
Return procedure for 71V416L15BEI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V416L15BEI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

