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Renesas 71V416S10BEG8

Part No.:
71V416S10BEG8
Manufacturer:
Renesas
Category:
Memory
Package:
48-TFBGA
Datasheet:
Aetrix71V416S10BEG8.pdf
Description:
IC SRAM 4MBIT PARALLEL 48CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,443

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Product details

Overview

71V416S10BEG8 from Renesas Electronics is a 4-Mbit (256K × 16) high-speed CMOS static RAM with 10 ns access time, single 3.3 V supply operation, LVTTL-compatible I/O, and JEDEC-standard center power/ground pinout. It supports byte-wide and word-wide read/write operations in commercial temperature range (0°C to +70°C) and is packaged in a 48-ball CABGA (9 mm × 9 mm, BEG48).

For engineers reviewing the 71V416S10BEG8 datasheet, 71V416S10BEG8 pinout, 71V416S10BEG8 application, or 71V416S10BEG8 equivalent, key selection criteria include its 10 ns tAA/tRC timing, BHE/BLE byte enable control, low-Z output enable response (tOLZ = 0 ns), and compatibility with high-speed microprocessor and FPGA memory interfaces requiring deterministic asynchronous access.

Technical Context

The 71V416S10BEG8 implements fully static asynchronous circuitry-no clocks or refresh required-and uses dual-byte enable (BHE/BLE) for independent high- and low-byte access. Its address decoding supports 18-bit addressing (A0–A17) to select one of 256K words.

It features separate chip select (CS), output enable (OE), and write enable (WE) controls with overlapping timing support for CS-, WE-, or byte-enable-controlled write cycles. All inputs meet LVTTL voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and operate at 3.3 V ±10%.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4,194,304 bits (256K × 16), enabling 512 KB of data storage per device
Access Time (tAA)10 ns max - guarantees sub-100 MHz bus interface timing without wait states
Cycle Time (tRC)10 ns max - supports continuous random-access throughput up to 100 MHz
Supply Voltage3.0 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of typical PCB voltage drop
I/O InterfaceLVTTL-compatible bidirectional data bus (I/O0–I/O15) - interoperable with 3.3 V microcontrollers, FPGAs, and ASICs
Byte Enable ControlDedicated BHE and BLE inputs - enables independent 8-bit writes without masking or extra logic
Operating Temperature0°C to +70°C - qualified for commercial-grade embedded systems and industrial control panels

Pinout & Package

71V416S10BEG8 is housed in a 48-ball fine-pitch CABGA package (BEG48), 9 mm × 9 mm, 0.8 mm ball pitch, with balls arranged in an 8×6 array plus two corner NC positions. Pin 28 may be left unconnected or tied to VSS per design flexibility.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit address bus supporting full 256K-word addressing; no address multiplexing required
CSChip SelectActive-low global enable; device enters standby (ISB1 = 20 µA) when high
OEOutput EnableActive-low control for output drivers; tOE = 5 ns ensures fast read turnaround
WEWrite EnableActive-low write strobe; tWP = 8 ns minimum pulse width for reliable data capture
BHE / BLEByte EnableIndependent high- and low-byte gating; enables partial writes without external logic
I/O0–I/O7 / I/O8–I/O15Bidirectional DataTrue LVTTL I/O with tOLZ = 0 ns - outputs drive immediately upon OE/BHE/BLE assertion
VDDPower Supply3.3 V core supply; two dedicated VDD balls (pins D5, E4) reduce IR drop and noise
VSSGroundGround reference; three VSS balls (pins D4, E5, H3) improve return path integrity
NCNo ConnectPins A1, A2, B1, B2, C1, G1, H1, H2 - must remain unconnected per datasheet

Key Features

FeatureDesign Value
JEDEC Center Power/Ground PinoutReduces simultaneous switching noise (SSN) by symmetrically distributing VDD/VSS across package center
Zero Delay Output Enable ResponsetOLZ = 0 ns means data appears on bus within same cycle as OE assertion - eliminates pipeline stalls
Asynchronous Static OperationNo clocks, no refresh, no hidden latency - simplifies timing closure in FPGA-based controllers
Low-Standby CurrentISB1 = 20 µA (max) in full standby - suitable for battery-backed or low-power wake-on-event designs
Byte-Selectable Write ArchitectureBHE/BLE allow independent 8-bit writes to upper/lower byte lanes - avoids bus contention in mixed-data-width systems

Applications

Industrial PLC Memory BufferFPGA Configuration Cache

Use Scenario: Storing real-time I/O mapping tables and motion control trajectory data in programmable logic controllers.

IC Role / Device Role / Timing Role: Asynchronous SRAM buffer interfacing directly to ARM Cortex-M7 or RISC-V MCU local bus with no wait-state insertion.

Use Value: 10 ns tAA enables deterministic 100 MHz burst reads for servo loop updates, while BHE/BLE supports compact ladder-logic instruction fetch with byte-aligned operand access.

Use Scenario: Holding configuration bitstreams and runtime lookup tables for Xilinx Artix-7 or Intel Cyclone V FPGA-based edge AI accelerators.

IC Role / Device Role / Timing Role: Off-chip high-speed memory mapped to FPGA AXI-Lite or Avalon-MM interface via custom bridge logic.

Use Value: LVTTL compatibility and zero-latency OE response allow seamless integration without level-shifting or timing glue logic, reducing BOM count and board area.

Medical Imaging Frame StoreAutomotive ADAS Preprocessing Buffer

Use Scenario: Temporary storage of digitized ultrasound or endoscope video frames prior to JPEG compression in portable diagnostic devices.

IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via fast OE toggling and byte enables - supports concurrent acquisition and compression engine access.

Use Value: 256K × 16 organization matches common 16-bit pixel pipelines; 10 ns access ensures no frame-drop during 60 fps acquisition at 1280×720 resolution.

Use Scenario: Buffering radar point-cloud metadata and camera feature vectors in automotive surround-view ECUs before fusion processing.

IC Role / Device Role / Timing Role: High-reliability memory node in ASIL-B compliant subsystems, leveraging Renesas qualification and stable 3.3 V operation.

Use Value: Commercial-grade 71V416S10BEG8 meets extended temperature derating requirements for under-hood ambient conditions when paired with thermal margining.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed asynchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY62167EV30LL-10ZSXI16 Mbit (1M × 16), 10 ns, 3.3 V, TSOP-44 - larger density but slower tCHZ (8 ns vs. 7 ns)Requires PCB redesign due to different package (TSOP vs. CABGA) and pinout; no BHE/BLE pinsChoose when higher memory capacity is needed and board layout allows TSOP footprint and signal routing changes
IS61LV25616AL-10TLI4 Mbit (256K × 16), 10 ns, 3.3 V, TSOP-44 - identical density/timing but lacks JEDEC center VDD/VSS pinoutHigher SSN susceptibility in dense layouts; requires additional decoupling and layout careChoose only if TSOP-44 is mandatory and noise budget permits relaxed power integrity constraints

Compared with CY62167EV30LL-10ZSXI and IS61LV25616AL-10TLI, the 71V416S10BEG8 uniquely combines CABGA miniaturization, JEDEC-compliant low-noise pinout, and true byte-enable control - making it optimal for space-constrained, high-integrity memory interfaces where layout efficiency and signal integrity are critical.

Availability

71V416S10BEG8 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, FPGA configuration caches, medical imaging frame stores, and automotive ADAS preprocessing buffers requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for 71V416S10BEG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with over 40 years of memory design heritage.

The 71V416S series targets high-speed, low-latency memory needs in resource-constrained embedded systems where deterministic asynchronous access, small footprint, and LVTTL compatibility are essential - especially in legacy bus architectures and FPGA co-processor subsystems.

FAQ

What is the maximum operating frequency supported by the 71V416S10BEG8?

The 71V416S10BEG8 does not use a clock, so it has no "operating frequency" in the synchronous sense. Its 10 ns access and cycle times support effective bus rates up to 100 MHz in asynchronous interfaces. For example, with tRC = 10 ns, consecutive random reads can occur every 10 ns, yielding a theoretical peak throughput of 100 million 16-bit words per second. The 71V416S10BEG8 achieves this without clocks, refresh, or wait states.

Does the 71V416S10BEG8 require external pull-up resistors on its control pins?

No, the 71V416S10BEG8 does not require external pull-ups on CS, OE, WE, BHE, or BLE. Its inputs are TTL-compatible with defined VIH (≥2.0 V) and VIL (≤0.8 V) thresholds and have negligible input leakage (|ILI| ≤ 5 µA). Pull-ups are only needed if system-level noise immunity or default-high idle states are required - not for basic functionality. The 71V416S10BEG8 operates correctly with clean, actively driven control signals.

Can the 71V416S10BEG8 be used in industrial temperature applications?

No - the 71V416S10BEG8 is specified only for the commercial temperature range (0°C to +70°C). For industrial operation (–40°C to +85°C), Renesas offers the 71V416S10BEGI8 variant. The 71V416S10BEG8's datasheet explicitly lists "C" grade in ordering information and confirms commercial-only qualification. Using the 71V416S10BEG8 outside 0°C–70°C voids parametric guarantees and may result in timing violations or data retention failure.

What is the purpose of the NC pins on the 71V416S10BEG8 BGA package?

The 71V416S10BEG8 has eight NC (No Connect) pins: A1, A2, B1, B2, C1, G1, H1, and H2. These pins are internally unconnected and must remain unconnected on the PCB - neither tied high nor low. They exist for mechanical symmetry, future die revision compatibility, or test structure isolation. Connecting them risks latch-up or undefined behavior. The 71V416S10BEG8 datasheet mandates leaving all NC pins floating per reliability and functional requirements.

How does the 71V416S10BEG8 handle simultaneous read and write operations?

The 71V416S10BEG8 does not support true simultaneous read/write - it is a single-port SRAM. However, its fast OE deassertion (tOHZ = 7 ns) and WE-controlled write timing allow tightly interleaved access. For example, a read can complete, OE goes high, then WE goes low for a write within ~15 ns. This pseudo-concurrent behavior is sufficient for many buffering applications. True dual-port operation requires a different device; the 71V416S10BEG8 relies on external arbitration for shared bus access.

71V416S10BEG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
48-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
10ns
Access Time:
10 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-CABGA (9x9)

71V416S10BEG8 FAQ

1.How can I place an order for 71V416S10BEG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V416S10BEG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V416S10BEG8 reliable?

The price and inventory of 71V416S10BEG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416S10BEG8 is usually 5 days.

3.What payment methods are accepted for 71V416S10BEG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416S10BEG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V416S10BEG8?

71V416S10BEG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V416S10BEG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V416S10BEG8?

For technical support, including 71V416S10BEG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416S10BEG8 requirements.

6.How does Aetrix verify that 71V416S10BEG8 is sourced from the original manufacturer or authorized distributors?

All 71V416S10BEG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416S10BEG8 meets industry standards.

7.What is the process for return or replacement of 71V416S10BEG8?

All 71V416S10BEG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V416S10BEG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V416S10BEG8 part is unused and in its original packaging.

Return procedure for 71V416S10BEG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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