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Renesas 71V416S12PHGI8

Part No.:
71V416S12PHGI8
Manufacturer:
Renesas
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
Aetrix71V416S12PHGI8.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,500

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Product details

Overview

71V416S12PHGI8 from Renesas Electronics is a 4-Mbit (256K × 16) high-speed CMOS static RAM with 12 ns access time, single 3.3 V supply operation, LVTTL-compatible I/O, and industrial temperature range (–40°C to +85°C). It features separate byte enable (BHE/BLE), output enable (OE), and chip select (CS) for flexible memory control in embedded controllers and data acquisition systems.

For engineers reviewing the 71V416S12PHGI8 datasheet, 71V416S12PHGI8 pinout, 71V416S12PHGI8 application, or 71V416S12PHGI8 equivalent, key selection criteria include its 12 ns read cycle time, TSOP Type II (44-pin, 400 mil) package, industrial-grade reliability, byte-level write capability, and low-power standby current of 60 mA (max) under dynamic conditions.

Technical Context

The 71V416S12PHGI8 implements fully static asynchronous circuitry-no clocks or refresh required-and uses high-reliability CMOS technology optimized for deterministic timing. Its dual-byte enable architecture (BHE/BLE) enables independent 8-bit writes without external logic, while JEDEC-standard center power/ground pinout minimizes switching noise in dense PCB layouts.

Timing is controlled via three independent enable paths: CS-controlled, OE-controlled, and BHE/BLE-controlled write cycles, each with defined setup/hold and transition-to-valid parameters. All inputs meet LVTTL voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V), and outputs drive ±4 mA/±8 mA loads with VOH ≥ 2.4 V and VOL ≤ 0.4 V at VDD = 3.0 V.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4,194,304 bits (256K × 16), supporting word-aligned 16-bit data buses without glue logic.
Access Time (tAA)12 ns max - guarantees address-to-data valid delay for real-time interrupt response in microcontroller peripherals.
Supply Voltage3.0 V to 3.6 V - compatible with modern 3.3 V system rails and tolerant of typical board-level regulation ripple.
Operating Temperature–40°C to +85°C - qualified for industrial automation, motor control, and outdoor communications equipment.
Standby Current (ISB)60 mA max (dynamic), 10 mA max (static) - enables low-power sleep modes in battery-backed or energy-sensitive systems.
I/O InterfaceLVTTL-compatible bidirectional data (I/O0–I/O15) - interoperable with FPGA I/O banks, ASICs, and microcontrollers without level shifters.
Package44-pin TSOP Type II (PHG44), 400 mil width - surface-mount compatible with standard reflow profiles and automated optical inspection.

Pinout & Package

71V416S12PHGI8 is supplied in a 44-pin, 400 mil TSOP Type II package (PHG44) with JEDEC-standard center power/ground layout for noise reduction. Pin 1 is located at the bottom-left corner when the notch faces upward.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit address bus supporting full 256K-word addressing; no internal address latching required.
CSChip SelectActive-low enable controlling device activation; must be stable before address or control transitions.
OEOutput EnableActive-low control enabling bidirectional I/O pins as outputs during read cycles; tOE = 6 ns max.
WEWrite EnableActive-low signal initiating write operations; supports WE-controlled, CS-controlled, or byte-enable-controlled writes.
BHE / BLEByte EnableIndependent high- and low-byte controls allowing 8-bit writes to upper or lower half of 16-bit word.
I/O0–I/O15Bidirectional DataTrue bidirectional bus with 3-state outputs; no external transceivers needed for shared data bus architectures.
VDDPower SupplySingle 3.3 V supply pin (two instances) placed centrally per JEDEC spec to reduce IR drop and ground bounce.
VSSGroundGround reference (two instances), symmetrically positioned with VDD to minimize loop inductance.

Key Features

FeatureDesign Value
JEDEC Center Power/Ground PinoutReduces simultaneous switching noise by 30–40% compared to corner-supply layouts, critical for mixed-signal systems.
Byte-Enable Write ArchitectureEnables partial-word updates without read-modify-write cycles, cutting write latency by up to 50% in firmware data logging.
12 ns Read Cycle (tRC)Supports sustained 83 MHz burst reads in FPGA-based DMA engines without wait states.
Low Standby Current (ISB1 = 10 mA)Permits >10-year retention in battery-backed SRAM applications with minimal leakage drain.
LVTTL-Compatible I/OEliminates need for level-shifting components when interfacing with Xilinx Artix-7, NXP i.MX RT, or Renesas RA MCU families.

Applications

Industrial PLC Data BufferMedical Imaging Frame Store

Use Scenario: Real-time buffering of sensor input streams and control command queues in programmable logic controllers operating in harsh factory environments.

IC Role / Device Role / Timing Role: Asynchronous 16-bit SRAM providing zero-wait-state data exchange between ARM Cortex-M7 CPU and fieldbus interface ASICs.

Use Value: 12 ns access ensures sub-microsecond response to emergency stop interrupts, meeting IEC 61508 SIL-3 timing constraints.

Use Scenario: Temporary storage of uncompressed 1024×768 grayscale image frames during ultrasound echo processing before compression and transmission.

IC Role / Device Role / Timing Role: High-bandwidth frame buffer interfaced directly to FPGA pixel pipelines with parallel 16-bit data path.

Use Value: Dual-byte enables allow selective update of ROI (region-of-interest) pixels without disturbing adjacent frame data, reducing DMA overhead by 40%.

Avionics Display Controller CacheTest Equipment Pattern Memory

Use Scenario: Storing GUI assets and rendering metadata in DO-254-compliant cockpit display units where radiation tolerance and deterministic timing are mandatory.

IC Role / Device Role / Timing Role: Non-refreshing memory holding font glyphs and vector overlay instructions for real-time rasterization engines.

Use Value: Industrial temperature rating and static operation eliminate thermal derating concerns and clock-domain crossing hazards in safety-critical displays.

Use Scenario: Holding stimulus/response patterns in automated boundary-scan testers performing IEEE 1149.1 JTAG validation on high-speed digital boards.

IC Role / Device Role / Timing Role: High-reliability pattern store accessed synchronously by test controller FPGA at 83 MHz using CS/OE strobes.

Use Value: 44-pin TSOP package allows compact placement near BGA test fixtures, minimizing trace length and signal integrity degradation above 50 MHz.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed static RAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY62167EV30LL-45ZSXI4-Mbit (256K × 16), 45 ns access, 3.3 V, SOIC-44 package; higher access time, no byte enables.Suitable only for non-real-time buffering where >40 ns latency is acceptable; lacks BHE/BLE for partial writes.Select only if cost sensitivity outweighs timing and flexibility requirements; not suitable for interrupt-driven systems.
AS6C4008-12TIN4-Mbit (256K × 16), 12 ns access, 3.3 V, TSOP-44; identical speed but no industrial temp grade (0°C to +70°C only).Restricted to commercial environments; fails qualification for extended temperature cycling in automotive or industrial deployments.Acceptable for lab-grade instruments or short-lifecycle consumer devices; avoid for field-deployed hardware requiring –40°C startup.

Compared with CY62167EV30LL-45ZSXI and AS6C4008-12TIN, the 71V416S12PHGI8 uniquely combines 12 ns performance, industrial temperature support, byte-enable functionality, and JEDEC-compliant TSOP packaging-making it the only option among the three qualified for deterministic real-time embedded memory subsystems.

Availability

71V416S12PHGI8 is available at Aetrix Electronics and suitable for industrial PLC data buffering, medical imaging frame stores, avionics display controllers, and automated test equipment requiring stable component supply across long production lifecycles.

Supply support for 71V416S12PHGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering trusted embedded solutions for automotive, industrial, infrastructure, and IoT applications, with over 40 years of memory design heritage.

The 71V416S series belongs to Renesas' legacy high-speed CMOS SRAM product line, engineered specifically for deterministic, low-latency memory interfacing in real-time control and instrumentation systems where refresh-free operation and precise timing predictability are essential.

FAQ

What is the maximum operating frequency supported by the 71V416S12PHGI8?

The 71V416S12PHGI8 does not operate on a clock; it is an asynchronous SRAM. Its 12 ns access time (tAA) and 12 ns read cycle time (tRC) support effective data throughput up to 83 MHz in burst-read configurations. System-level frequency depends on controller timing margins, but the 71V416S12PHGI8 itself imposes no clock requirement and needs no refresh cycles.

Does the 71V416S12PHGI8 require external pull-up resistors on its control pins?

No, the 71V416S12PHGI8 has internally biased inputs compliant with LVTTL logic levels (VIH ≥ 2.0 V, VIL ≤ 0.8 V), and no external pull-ups are required for CS, OE, WE, BHE, or BLE under normal operation. External termination is only needed for impedance matching on long traces (>10 cm) in high-speed layouts.

Can the 71V416S12PHGI8 be used in place of the 71V416S10PHGI8?

Yes, the 71V416S12PHGI8 is a functional drop-in replacement for the 71V416S10PHGI8 in designs where 12 ns timing meets system requirements. Both share identical pinout, voltage specs, and feature set. However, the 10 ns version offers tighter timing margins; verify tAA, tRC, and tOE values against your controller's setup/hold windows before substitution.

What is the meaning of the 'I' and '8' suffixes in 71V416S12PHGI8?

In 71V416S12PHGI8, 'I' denotes Industrial temperature grade (–40°C to +85°C), and '8' indicates tape-and-reel packaging (8 mm carrier tape, 1,000 units per reel). The 'PHG' identifies the 44-pin TSOP Type II package, and '12' specifies the 12 ns speed grade. This full ordering code ensures traceable, production-ready sourcing.

Is the 71V416S12PHGI8 RoHS and REACH compliant?

Yes, the 71V416S12PHGI8 is a green-part variant (as indicated by the 'G' in alternate order codes like 71V416S12PHGI8), fully compliant with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Lead-free soldering compatibility is validated per J-STD-020D moisture sensitivity level 3 (MSL-3) for standard reflow profiles.

71V416S12PHGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

71V416S12PHGI8 FAQ

1.How can I place an order for 71V416S12PHGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V416S12PHGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V416S12PHGI8 reliable?

The price and inventory of 71V416S12PHGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416S12PHGI8 is usually 5 days.

3.What payment methods are accepted for 71V416S12PHGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416S12PHGI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V416S12PHGI8?

71V416S12PHGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V416S12PHGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V416S12PHGI8?

For technical support, including 71V416S12PHGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416S12PHGI8 requirements.

6.How does Aetrix verify that 71V416S12PHGI8 is sourced from the original manufacturer or authorized distributors?

All 71V416S12PHGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416S12PHGI8 meets industry standards.

7.What is the process for return or replacement of 71V416S12PHGI8?

All 71V416S12PHGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V416S12PHGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V416S12PHGI8 part is unused and in its original packaging.

Return procedure for 71V416S12PHGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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