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Renesas 71V416S15BEG8

Part No.:
71V416S15BEG8
Manufacturer:
Renesas
Category:
Memory
Package:
48-TFBGA
Datasheet:
Aetrix71V416S15BEG8.pdf
Description:
IC SRAM 4MBIT PARALLEL 48CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,207

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Product details

Overview

71V416S15BEG8 from Renesas Electronics is a 4-Mbit (256K × 16) high-speed CMOS static RAM with 15 ns access time, single 3.3 V supply operation, LVTTL-compatible I/O, and JEDEC-standard center-power/ground pinout for noise reduction. It supports byte-wide and word-wide read/write operations in commercial temperature range (0°C to +70°C) and is packaged in a 48-ball BGA (BEG48, 9 mm × 9 mm).

For engineers reviewing the 71V416S15BEG8 datasheet, 71V416S15BEG8 pinout, 71V416S15BEG8 application, or 71V416S15BEG8 equivalent, key selection criteria include access time consistency (tAA = tRC = 15 ns), low-Z output enable timing (tOE = 7 ns), byte enable control (BHE/BLE), and compatibility with legacy 3.3 V SRAM-based memory subsystems in industrial controllers and communications equipment.

Technical Context

The 71V416S15BEG8 implements fully static asynchronous circuitry-no clocks or refresh required-and uses high-reliability CMOS technology optimized for deterministic timing across address, chip select, and output enable paths. Its dual-byte enable architecture (BHE/BLE) enables independent 8-bit access to upper and lower data bytes without external logic.

Timing is guaranteed under LVTTL-compatible voltage thresholds (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and operates with 3.0–3.6 V supply tolerance. The device features three distinct power states: dynamic active (ICC = 170 mA max), dynamic standby (ISB = 50 mA max), and full static standby (ISB1 = 20 mA max), all specified at fMAX for 15 ns grade.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density4,194,304 bits (256K × 16 organization)
Access Time (tAA)15 ns - guarantees data valid within 15 ns of stable address and CS assertion
Read Cycle Time (tRC)15 ns - minimum interval between successive read cycles
Supply Voltage3.3 V nominal (3.0–3.6 V range) - compatible with standard LVTTL logic rails
I/O InterfaceLVTTL-compatible bidirectional data bus - direct interface to FPGA/CPU without level shifters
Byte Enable ControlDedicated BHE and BLE inputs - enables selective 8-bit writes without masking logic
Operating Temperature0°C to +70°C - validated for commercial-grade embedded systems
Package48-ball CABGA (BEG48), 9 mm × 9 mm - surface-mount footprint with thermal pad option

Pinout & Package

71V416S15BEG8 is housed in a 48-ball fine-pitch ball grid array (BEG48) package with 0.8 mm pitch and 9 mm × 9 mm body size. Pinout follows JEDEC-standard center-power/ground configuration to minimize simultaneous switching noise.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit address bus supporting full 256K-word addressing
CSChip SelectActive-low enable controlling device selection and power state transition
WEWrite EnableActive-low signal initiating write cycle; controls data latching direction
OEOutput EnableActive-low signal enabling output drivers; tOE = 7 ns ensures fast read response
BHE / BLEByte EnableIndependent high/low byte gating - enables partial writes without external logic
I/O0–I/O15Bidirectional Data16-bit LVTTL I/O bus with high-impedance tri-state during deselect or disable
VDDPower Supply3.3 V core supply; multiple balls distributed per JEDEC center-power layout
VSSGroundGround reference; multiple balls placed symmetrically to reduce ground bounce
NCNo ConnectBall 28 is NC or optionally tied to VSS per design flexibility

Key Features

FeatureDesign Value
JEDEC Center Power/Ground PinoutReduces simultaneous switching noise by distributing VDD/VSS pins centrally across the array
Equal Access and Cycle TimestAA = tRC = 15 ns eliminates timing margin uncertainty in burst or sequential read patterns
Low-Z Output Enable TimingtOE = 7 ns enables rapid data sampling in high-throughput memory interfaces
Separate Byte Write EnablesBHE/BLE allow independent 8-bit writes - eliminates need for external byte-mask logic
Single 3.3 V Supply OperationEliminates dual-rail power design complexity and reduces BOM count vs. 5 V/3.3 V mixed systems
Full Static Asynchronous CoreNo clocks or refresh required - simplifies timing closure and reduces system-level jitter sensitivity

Applications

Industrial PLC Memory BufferTelecom Line Card Data Cache

Use Scenario: Storing real-time I/O mapping tables and firmware scratchpad in programmable logic controllers.

IC Role / Device Role / Timing Role: Non-volatile shadow RAM replacement for fast, deterministic read/write access during scan cycles.

Use Value: 15 ns tAA and tRC ensure sub-microsecond response to ladder logic execution, improving scan time predictability.

Use Scenario: Holding packet header buffers and lookup tables in TDM-over-IP gateway line cards.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency data staging buffer interfacing directly with FPGA-based packet processors.

Use Value: LVTTL-compatible I/O and byte-enable support enable seamless integration with Xilinx Spartan-6 or Intel Cyclone IV I/O banks.

Medical Imaging Frame StoreAutomotive ADAS Sensor Preprocessing Buffer

Use Scenario: Temporary storage of digitized ultrasound or X-ray frame segments prior to DSP compression.

IC Role / Device Role / Timing Role: Burst-access memory bank synchronized to ADC capture clock for zero-wait-state transfers.

Use Value: 16-bit bus width and 15 ns access match common 12–14 bit medical ADC parallel outputs, minimizing glue logic.

Use Scenario: Buffering raw camera or radar sensor data streams before fusion algorithm execution in domain controllers.

IC Role / Device Role / Timing Role: Low-power, high-reliability SRAM for safety-critical preprocessing pipelines requiring deterministic latency.

Use Value: ISB1 = 20 mA full standby current enables aggressive power gating during sensor idle periods without data loss.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY62167EV30LL-45ZSXIT4-Mbit (256K × 16), 45 ns access, 3.3 V, TSOP-44 packageSlower timing; lacks byte enable pins; requires external gating for partial writesUse only where 45 ns latency is acceptable and board space allows TSOP footprint
AS6C4008-55TIN4-Mbit (512K × 8), 55 ns access, 3.3 V, SOJ-32 package8-bit bus width; no BHE/BLE; higher access time; different address depthSelect only when 8-bit data path suffices and PCB layout constraints favor SOJ

Compared with 71V416S15BEG8, CY62167EV30LL-45ZSXIT offers lower cost but sacrifices 30 ns of timing margin and byte-select capability, while AS6C4008-55TIN trades density and speed for smaller package size and simplified routing-neither matches the 71V416S15BEG8's combination of 15 ns performance, 16-bit bus, and integrated byte enable control in BGA form factor.

Availability

71V416S15BEG8 is available at Aetrix Electronics and suitable for industrial PLC memory buffers, telecom line card data caches, and medical imaging frame stores requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.

Supply support for 71V416S15BEG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V416S15BEG8 belongs to Renesas' legacy high-speed SRAM product line, designed specifically for deterministic, low-latency memory expansion in resource-constrained embedded systems requiring pin-compatible upgrade paths from earlier IDT-era devices.

FAQ

What is the maximum operating frequency supported by the 71V416S15BEG8?

The 71V416S15BEG8 does not use a clock and therefore has no maximum operating frequency specification. Its performance is defined by timing parameters: tRC = 15 ns sets the minimum interval between successive read or write cycles, corresponding to an effective throughput ceiling of approximately 66.7 MHz for continuous sequential access. This value is derived directly from the datasheet's AC Electrical Characteristics table for the 71V416S15 speed grade.

Does the 71V416S15BEG8 support both byte and word write operations?

Yes, the 71V416S15BEG8 supports independent byte and word writes via dedicated BHE (high byte enable) and BLE (low byte enable) inputs. When both are asserted low, a full 16-bit word write occurs; asserting only BHE or only BLE enables 8-bit writes to I/O8–I/O15 or I/O0–I/O7 respectively-confirmed in the Truth Table (Table 03) and Functional Block Diagram of the Renesas datasheet.

Is the 71V416S15BEG8 pin-compatible with other members of the 71V416 family?

Yes, the 71V416S15BEG8 shares identical pinout and signal definitions with all BEG48-packaged variants of the 71V416 family-including 71V416S10BEG8 and 71V416L15BEG8-as verified in the Pin Configurations – BGA(1) diagram and Pin Descriptions table. Differences are limited to speed grade (tAA/tRC) and power profile (S vs. L), not pin function or assignment.

What is the input capacitance specification for the 71V416S15BEG8 address and control pins?

The 71V416S15BEG8 specifies CIN = 6 pF maximum for all address and control inputs (A0–A17, CS, WE, OE, BHE, BLE) under TA = +25°C and f = 1.0 MHz conditions, as documented in the BGA Capacitance table (Table 02b). This value is critical for determining trace impedance and fanout limits in high-speed memory bus layouts.

Can the 71V416S15BEG8 operate reliably at 3.0 V supply voltage?

Yes, the 71V416S15BEG8 is fully specified for operation across VDD = 3.0 V to 3.6 V, including DC and AC parameters. The Recommended DC Operating Conditions table (Table 06) explicitly lists 3.0 V as the minimum supply, and all timing values (e.g., tAA = 15 ns) are guaranteed over this full range-not just at nominal 3.3 V-per the "VDD = Min. to Max." condition in the AC Electrical Characteristics section.

71V416S15BEG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
48-TFBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
256K x 16
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
15ns
Access Time:
15 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-CABGA (9x9)

71V416S15BEG8 FAQ

1.How can I place an order for 71V416S15BEG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V416S15BEG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V416S15BEG8 reliable?

The price and inventory of 71V416S15BEG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V416S15BEG8 is usually 5 days.

3.What payment methods are accepted for 71V416S15BEG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V416S15BEG8 transactions.

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71V416S15BEG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V416S15BEG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V416S15BEG8?

For technical support, including 71V416S15BEG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V416S15BEG8 requirements.

6.How does Aetrix verify that 71V416S15BEG8 is sourced from the original manufacturer or authorized distributors?

All 71V416S15BEG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V416S15BEG8 meets industry standards.

7.What is the process for return or replacement of 71V416S15BEG8?

All 71V416S15BEG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V416S15BEG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V416S15BEG8 part is unused and in its original packaging.

Return procedure for 71V416S15BEG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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