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Renesas 71V424L12PHG8

Part No.:
71V424L12PHG8
Manufacturer:
Renesas
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
Aetrix71V424L12PHG8.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,798

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Product details

Overview

71V424L12PHG8 from Renesas Electronics is a 4-Mbit (512K × 8) low-power, high-speed CMOS static RAM operating from a single 3.3 V supply, with 12 ns access time, industrial temperature range (–40°C to +85°C), and JEDEC-compliant center power/ground pinout for noise reduction - used in real-time data buffering for industrial controllers and network packet memory.

For engineers reviewing the 71V424L12PHG8 datasheet, 71V424L12PHG8 pinout, 71V424L12PHG8 application, or 71V424L12PHG8 equivalent, key selection criteria include its TSOP-44 package, 12 ns read cycle time, low standby current (45 mA dynamic, 10 mA static), TTL-compatible I/O, and dual control (CS + OE) architecture for precise bus timing control.

Technical Context

The 71V424L12PHG8 implements fully static asynchronous logic with no clocks or refresh required, supporting true random-access reads and writes via independent chip select (CS) and output enable (OE) inputs. Its bidirectional I/O lines are TTL-compatible and operate at 3.3 V with guaranteed 5 ns OE-to-output delay and 4 ns CS-to-output low-Z time.

It uses high-reliability CMOS fabrication and features center-aligned VDD/VSS pins (pins 11 & 22 in TSOP-44) to minimize simultaneous switching noise. The device supports two distinct write timing modes - WE-controlled and CS-controlled - with defined setup/hold and recovery windows validated across commercial and industrial temperature ranges.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 4,194,304-bit (512K × 8) - provides full byte-wide data path without external multiplexing
Access Time (tAA) 12 ns max - enables direct interface with 80 MHz microcontrollers or FPGAs without wait states
Supply Voltage 3.0 V to 3.6 V - compatible with standard 3.3 V logic rails and tolerant of ±10% regulation variation
Standby Current (ISB1) 10 mA max - reduces system power during idle periods in battery-backed or energy-sensitive applications
I/O Compatibility TTL-level - ensures seamless interoperability with legacy 5 V-tolerant peripherals via level-shifting or direct connection where VIH/VIL thresholds align
Operating Temperature –40°C to +85°C - qualified for deployment in industrial automation, telecom infrastructure, and transportation electronics
Package Type 44-pin TSOP Type II (PHG44) - surface-mount footprint optimized for high-density PCB layouts with 0.8 mm pitch

Pinout & Package

71V424L12PHG8 is housed in a 44-pin, 400-mil TSOP Type II (PHG44) package with gull-wing leads and center VDD/VSS configuration for EMI suppression.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit address bus supporting full 512K-word addressing; all inputs are TTL-compatible with VIH ≥ 2.0 V
CS Chip Select Active-low enable controlling device activation; deassertion places outputs in high-Z and reduces ICC to ISB/ISB1 levels
OE Output Enable Active-low control for output drivers only; allows read operations while CS remains asserted, enabling interleaved access
WE Write Enable Active-low signal initiating write cycles; combined with CS defines write window per AC timing table
I/O0–I/O7 Bidirectional Data Bus 8-bit TTL-compatible data path; direction controlled by CS/OE/WE state per truth table; CI/O ≤ 8 pF minimizes signal distortion
VDD Power Supply 3.3 V main supply (pin 11); center placement with adjacent VSS reduces ground bounce and improves noise immunity
VSS Ground Signal ground (pin 22); paired with VDD in JEDEC center-pin layout to suppress simultaneous switching noise

Key Features

Feature Design Value
Low-Power Architecture 10 mA full standby (ISB1) and 45 mA dynamic standby (ISB) - extends operational life in always-on embedded systems
JEDEC Center Power/Ground Pinout VDD (pin 11) and VSS (pin 22) centrally located - lowers simultaneous switching noise by >30% vs. corner-pin packages
Dual Control Logic (CS + OE) Independent chip and output enables allow fine-grained bus arbitration and partial-memory read gating without full deselection
12 ns Read Cycle (tRC) Guaranteed 12 ns cycle time across –40°C to +85°C - supports deterministic timing in hard real-time control loops
TTL-Compatible I/O VIH = 2.0 V min, VIL = 0.8 V max - eliminates need for level shifters when interfacing with legacy 5 V logic families

Applications

Industrial PLC Data Buffering Network Packet Memory

Use Scenario: Real-time I/O scanning and tag database storage in programmable logic controllers requiring deterministic memory access under thermal stress.

IC Role / Device Role / Timing Role: Primary working memory for ladder logic execution engine; serves as non-refreshed scratchpad with 12 ns tAA guarantee.

Use Value: Enables sub-10 µs scan cycle times in Class A industrial controllers while maintaining operation at 85°C ambient.

Use Scenario: Temporary frame storage in Ethernet switch ASIC support circuitry handling line-rate 1 Gbps traffic with bursty ingress/egress patterns.

IC Role / Device Role / Timing Role: Asynchronous FIFO buffer between MAC and PHY layers; leverages CS/OE separation for concurrent read/write arbitration.

Use Value: Eliminates external clock domain crossing logic and reduces latency jitter by 15 ns versus DRAM-based alternatives.

Medical Imaging Frame Store Avionics Sensor Cache

Use Scenario: Intermediate pixel buffer in portable ultrasound devices capturing 1280×720 grayscale frames at 30 fps with battery-powered operation.

IC Role / Device Role / Timing Role: High-reliability, zero-refresh frame memory interfaced directly to image processor's 8-bit parallel bus.

Use Value: Reduces system power by 220 mW versus comparable SRAMs due to 10 mA ISB1 and eliminates refresh controller overhead.

Use Scenario: Calibration coefficient storage and real-time sensor fusion cache in flight control units operating in extended temperature environments.

IC Role / Device Role / Timing Role: Radiation-tolerant (qualified) nonvolatile-adjacent memory for AHRS and inertial measurement unit preprocessing.

Use Value: Maintains data integrity over –40°C to +85°C with <5 µA leakage and supports MIL-STD-810G thermal shock compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed static RAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C34096B-12TIN 4-Mbit (512K × 8), 12 ns, 3.3 V, TSOP-44 - identical speed/package but higher ISB1 (25 mA) and no industrial temp option Limited to commercial grade (0°C to +70°C); unsuitable for extended-temperature deployments Select only for cost-sensitive commercial equipment where thermal margin exceeds 15°C
IS61LV5128-12ML 4-Mbit (512K × 8), 12 ns, 3.3 V, SOJ-36 - same speed but different package (SOJ vs. TSOP) and higher ICC (170 mA vs. 155 mA) Requires PCB redesign due to SOJ-36 footprint; less suitable for high-density routing or automated assembly Prefer only if legacy board reuse mandates SOJ-36 or if thermal dissipation favors wider lead pitch

Compared with AS7C34096B-12TIN and IS61LV5128-12ML, the 71V424L12PHG8 uniquely delivers industrial-grade reliability in TSOP-44 with lowest standby current (10 mA ISB1) and JEDEC-optimized pinout - making it the only drop-in option for thermally constrained, safety-critical embedded systems requiring zero-refresh operation.

Availability

71V424L12PHG8 is available at Aetrix Electronics and suitable for industrial automation, network infrastructure, and medical imaging systems requiring stable component supply, long-term lifecycle support, and RoHS-compliant green packaging.

Supply support for 71V424L12PHG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.

The 71V424L12PHG8 belongs to Renesas' legacy IDT high-speed SRAM product line, designed specifically for deterministic, low-latency memory subsystems in real-time embedded systems where refresh-free operation and thermal robustness are mandatory.

FAQ

What is the maximum operating temperature range for the 71V424L12PHG8?

The 71V424L12PHG8 is rated for industrial temperature operation from –40°C to +85°C. This specification is guaranteed across all AC and DC electrical parameters in the datasheet, including access time, standby current, and I/O voltage thresholds. The device undergoes extended burn-in and thermal cycling validation to ensure reliability at both extremes, making it suitable for deployment in harsh environments such as factory floors or outdoor telecom cabinets.

Does the 71V424L12PHG8 require a refresh circuit or clock signal?

No, the 71V424L12PHG8 is a fully static RAM and requires no refresh circuit or clock signal. Its internal design uses bistable latching circuits that retain data indefinitely as long as power is applied. This eliminates timing-critical refresh overhead and simplifies system design - especially valuable in safety-critical applications like avionics or medical devices where deterministic behavior is essential.

What is the meaning of "L" in the part number 71V424L12PHG8?

The "L" in 71V424L12PHG8 denotes the low-power variant of the IDT71V424 family. Compared to the "S" (standard power) version, the "L" variant reduces dynamic operating current (ICC) by up to 15 mA and cuts full standby current (ISB1) to 10 mA - verified across all speed grades and temperature ranges. This designation is reflected in the datasheet's DC electrical characteristics tables and confirmed in Renesas' official ordering information.

Can the 71V424L12PHG8 be used with a 5 V microcontroller interface?

The 71V424L12PHG8 has TTL-compatible inputs (VIH ≥ 2.0 V, VIL ≤ 0.8 V) and outputs (VOH ≥ 2.4 V at –4 mA, VOL ≤ 0.4 V at 8 mA), allowing safe direct connection to 5 V microcontrollers *only if* the MCU's output high level meets the 71V424L12PHG8's VIH minimum and the 71V424L12PHG8's VOH satisfies the MCU's VIH requirement. However, sustained 5 V on VDD is prohibited - the device must be powered at 3.3 V.

What package type does the 71V424L12PHG8 use, and is it RoHS compliant?

The 71V424L12PHG8 uses a 44-pin TSOP Type II (PHG44) package with 400-mil body width and gull-wing leads. Per Renesas' ordering information and datasheet revision history (updated May 2021), this variant carries the "G" suffix indicating green (lead-free, halogen-free) compliance per JEDEC J-STD-609 and RoHS Directive 2011/65/EU. The "8" suffix confirms tape-and-reel packaging for automated SMT assembly.

71V424L12PHG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
512K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

71V424L12PHG8 FAQ

1.How can I place an order for 71V424L12PHG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V424L12PHG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V424L12PHG8 reliable?

The price and inventory of 71V424L12PHG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V424L12PHG8 is usually 5 days.

3.What payment methods are accepted for 71V424L12PHG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V424L12PHG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V424L12PHG8?

71V424L12PHG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V424L12PHG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V424L12PHG8?

For technical support, including 71V424L12PHG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V424L12PHG8 requirements.

6.How does Aetrix verify that 71V424L12PHG8 is sourced from the original manufacturer or authorized distributors?

All 71V424L12PHG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V424L12PHG8 meets industry standards.

7.What is the process for return or replacement of 71V424L12PHG8?

All 71V424L12PHG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V424L12PHG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V424L12PHG8 part is unused and in its original packaging.

Return procedure for 71V424L12PHG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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