Renesas 71V424S10PHGI8
- Part No.:
- 71V424S10PHGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 44-TSOP (0.400", 10.16mm Width)
- Datasheet:
-
71V424S10PHGI8.pdf
- Description:
- IC SRAM 4MBIT PARALLEL 44TSOP II
- Quantity:
- Payment:

- Shipping:

Inventory:1,976
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
71V424S10PHGI8 from Renesas Electronics is a 4-Mbit (512K × 8) high-speed CMOS static RAM with 10 ns access time, single 3.3 V supply operation, and industrial temperature range (–40°C to +85°C). It features TTL-compatible bidirectional I/O, JEDEC-standard center power/ground pinout for noise reduction, and low-power standby modes. It serves as main or buffer memory in real-time embedded controllers requiring deterministic, clockless data access.
For engineers reviewing the 71V424S10PHGI8 datasheet, 71V424S10PHGI8 pinout, 71V424S10PHGI8 application, or 71V424S10PHGI8 equivalent, key selection criteria include its 10 ns read cycle time, 36-pin SOJ vs. 44-pin TSOP package options, industrial-grade reliability, and compatibility with legacy 3.3 V SRAM-based memory subsystems in avionics and industrial PLCs.
Technical Context
The 71V424S10PHGI8 implements fully static asynchronous logic-no clocks or refresh required-and uses dual-control enable architecture with independent Chip Select (CS) and Output Enable (OE) inputs. Its address decoding supports 19-bit addressing (A0–A18), enabling direct mapping of 512K × 8-bit memory space without external latching.
It delivers guaranteed 10 ns address access time (tAA) and 10 ns read cycle time (tRC) under industrial conditions (VDD = 3.0–3.6 V, TA = –40°C to +85°C), with output enable propagation delay ≤5 ns (tOE) and chip deselect-to-high-Z ≤7 ns (tCHZ). Power management includes three distinct current states: dynamic active (180 mA max), dynamic standby (60 mA max), and full static standby (20 mA max).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4,194,304 bits (512K × 8) - supports byte-wide data bus interfacing without multiplexing |
| Access Time | 10 ns (tAA) - enables sub-100 MHz synchronous bus handshaking in microcontroller co-processor systems |
| Supply Voltage | 3.3 V ±10% - compatible with standard LVTTL and LVCMOS I/O domains without level translation |
| Operating Temperature | –40°C to +85°C - qualified for industrial control, railway signaling, and outdoor telecom equipment |
| Package | 44-pin TSOP Type II (PHG44) - surface-mount footprint with 0.8 mm pitch, optimized for high-density PCB layouts |
| Power Modes | Three-tier current control: 180 mA active, 60 mA dynamic standby, 20 mA full static standby - reduces system-level thermal load during idle intervals |
| I/O Compatibility | TTL-compatible inputs/outputs - interfaces directly with 3.3 V microcontrollers (e.g., Renesas RX, SH, RZ families) and FPGAs |
Pinout & Package
44-pin, 400 mil TSOP Type II (PHG44) package with standard JEDEC pinout. Center-aligned VDD (Pin 22) and VSS (Pin 23) reduce simultaneous switching noise (SSN) in high-speed memory buses.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit unidirectional address bus; supports full 512K-word addressing without external address latches |
| CS | Chip Select | Active-low enable; controls device activation and entry into low-power standby (ISB1) when deasserted |
| OE | Output Enable | Active-low control for output drivers; allows shared data bus operation with other peripherals without contention |
| WE | Write Enable | Active-low write strobe; defines write cycle timing boundaries (tWP, tDW) and disables outputs during writes |
| I/O0–I/O7 | Bidirectional Data I/O | 8-bit TTL-compatible data path; direction controlled implicitly by CS/OE/WE state per truth table |
| VDD | Power Supply | 3.3 V core supply (Pin 22); center placement minimizes IR drop and improves signal integrity on dense boards |
| VSS | Ground | Ground reference (Pin 23); adjacent to VDD for optimal decoupling and reduced ground bounce |
Key Features
| Feature | Design Value |
|---|---|
| JEDEC Center Power/Ground Pinout | Reduces simultaneous switching noise by 30–40% compared to corner-placed VDD/VSS layouts in multi-SRAM systems |
| Equal Access & Cycle Times | 10 ns tAA = tRC - eliminates wait-state insertion in fixed-cycle memory controllers (e.g., Motorola 68K derivatives) |
| Low-Power Standby Modes | 20 mA ISB1 (full static) enables >90% power reduction during CPU sleep without data loss or refresh overhead |
| TTL-Compatible I/O | Direct interface with legacy 3.3 V microcontrollers and ASICs; no level-shifter required for voltage domain bridging |
| Industrial Temperature Range | Validated operation from –40°C to +85°C ensures reliability in uncontrolled environments like factory floors and vehicle ECUs |
Applications
| Industrial PLC Memory Buffer | Railway Signaling Data Cache |
|---|---|
|
Use Scenario: Stores real-time I/O status and motion control parameters in programmable logic controllers operating in dusty, vibration-prone factory environments. IC Role / Device Role / Timing Role: Asynchronous byte-wide SRAM providing zero-wait-state access to ladder logic execution engine and fieldbus interface buffers. Use Value: 10 ns access time ensures deterministic response to emergency stop interrupts; industrial temp rating guarantees uptime across seasonal ambient swings. |
Use Scenario: Caches track occupancy and signal state data in ERTMS/ETCS Level 1 balise readers mounted on rail vehicles exposed to wide thermal cycling. IC Role / Device Role / Timing Role: Nonvolatile-supporting volatile memory holding transient safety-critical telemetry between GPS updates and radio transmission cycles. Use Value: Full static standby (20 mA ISB1) extends battery backup runtime during power interruptions; TSOP package withstands mechanical shock per EN 50155. |
| Avionics Display Frame Buffer | Medical Imaging Preprocessing Buffer |
|
Use Scenario: Holds pixel data for cockpit multifunction displays in commercial aircraft where EMI resilience and thermal stability are critical. IC Role / Device Role / Timing Role: High-reliability SRAM acting as frame buffer between graphics controller and display serializer, synchronized via discrete handshaking. Use Value: Center VDD/VSS pinout suppresses radiated emissions in RF-sensitive zones; 3.3 V operation aligns with DO-254 power domain requirements. |
Use Scenario: Buffers raw sensor data from ultrasound transducer arrays prior to FPGA-based beamforming in portable diagnostic devices. IC Role / Device Role / Timing Role: Low-latency scratchpad memory enabling pipelined processing of 12-bit echo samples at >20 MSPS aggregate throughput. Use Value: 10 ns tAA supports burst-mode DMA transfers without cycle stealing; industrial temp range accommodates sterilization and clinical ambient variations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY62148EV30LL-10ZSXIT | 512K × 8, 10 ns, 3.3 V, 44-pin TSOP; lower ISB1 (5 µA vs. 20 mA) but higher tCHZ (10 ns vs. 7 ns) | Better suited for ultra-low-power battery-backed systems; less ideal for high-speed bus arbitration due to slower high-Z transition | Select when standby current dominates thermal budget; verify tCHZ meets system bus release timing. |
| AS6C4008-10TIN | 512K × 8, 10 ns, 3.3 V, 44-pin TSOP; identical tAA/tRC but lacks OE pin (single CS-only control) | Requires redesign of bus arbitration logic; not drop-in for systems using OE for shared-data-bus tri-state control | Choose only if existing design already omits OE usage; otherwise, avoid due to functional mismatch in I/O control. |
Compared with CY62148EV30LL-10ZSXIT and AS6C4008-10TIN, the 71V424S10PHGI8 provides balanced performance: faster output disable (tCHZ = 7 ns), robust industrial qualification, and dedicated OE support-making it optimal for deterministic real-time systems where bus timing predictability and environmental resilience are non-negotiable.
Availability
71V424S10PHGI8 is available at Aetrix Electronics and suitable for industrial PLCs, railway signaling units, avionics displays, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for 71V424S10PHGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, infrastructure, and IoT applications.
The 71V424S10PHGI8 belongs to Renesas' legacy high-speed SRAM product line, designed specifically for deterministic, low-latency memory interfacing in mission-critical embedded systems where clockless operation and industrial-grade reliability are mandatory.
FAQ
What is the operating temperature range for the 71V424S10PHGI8?
The 71V424S10PHGI8 is rated for industrial temperature operation from –40°C to +85°C. This specification is validated across all AC and DC electrical parameters in the datasheet, including 10 ns access time and full standby current (ISB1 = 20 mA), making it suitable for deployment in harsh environments such as factory automation and transportation systems.
Does the 71V424S10PHGI8 require a refresh circuit or clock signal?
No, the 71V424S10PHGI8 is a fully static RAM and requires neither refresh circuitry nor a clock signal. Its asynchronous design relies solely on address, CS, OE, and WE transitions to control read/write operations-enabling seamless integration with microcontrollers, FPGAs, and ASICs lacking dedicated memory controllers.
What package type does the 71V424S10PHGI8 use, and is it RoHS-compliant?
The 71V424S10PHGI8 uses a 44-pin TSOP Type II (PHG44) package with 0.8 mm lead pitch. Per Renesas' ordering information and datasheet revision history (May 2021), this part is marked "Green", confirming compliance with RoHS Directive 2011/65/EU and absence of restricted hazardous substances.
How does the JEDEC center power/ground pinout improve noise performance in the 71V424S10PHGI8?
The 71V424S10PHGI8 places VDD (Pin 22) and VSS (Pin 23) adjacent and centered in the 44-pin TSOP array. This layout minimizes loop inductance and ground bounce during simultaneous I/O switching, reducing SSN by up to 40% versus corner-placed power pins-critical for stable operation in high-density memory subsystems.
Can the 71V424S10PHGI8 be used as a direct replacement for older IDT 71V424 variants?
Yes-the 71V424S10PHGI8 maintains pin-for-pin and function-for-function compatibility with earlier IDT-branded 71V424S10PHGI8 units, including identical AC/DC specifications, timing waveforms, and truth table behavior. Renesas retained full backward compatibility after acquiring IDT's memory portfolio in 2019.
71V424S10PHGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 44-TSOP (0.400", 10.16mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Asynchronous
- Memory Size:
- 4Mbit
- Memory Organization:
- 512K x 8
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 10ns
- Access Time:
- 10 ns
- Voltage - Supply:
- 3V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 44-TSOP II
71V424S10PHGI8 FAQ
1.How can I place an order for 71V424S10PHGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V424S10PHGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V424S10PHGI8 reliable?
The price and inventory of 71V424S10PHGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V424S10PHGI8 is usually 5 days.
3.What payment methods are accepted for 71V424S10PHGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V424S10PHGI8 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V424S10PHGI8?
71V424S10PHGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V424S10PHGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V424S10PHGI8?
For technical support, including 71V424S10PHGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V424S10PHGI8 requirements.
6.How does Aetrix verify that 71V424S10PHGI8 is sourced from the original manufacturer or authorized distributors?
All 71V424S10PHGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V424S10PHGI8 meets industry standards.
7.What is the process for return or replacement of 71V424S10PHGI8?
All 71V424S10PHGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V424S10PHGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V424S10PHGI8 part is unused and in its original packaging.
Return procedure for 71V424S10PHGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V424S10PHGI8 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

