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Renesas 71V424S12PHGI8

Part No.:
71V424S12PHGI8
Manufacturer:
Renesas
Category:
Memory
Package:
44-TSOP (0.400", 10.16mm Width)
Datasheet:
Aetrix71V424S12PHGI8.pdf
Description:
IC SRAM 4MBIT PARALLEL 44TSOP II
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,405

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Product details

Overview

71V424S12PHGI8 from Renesas Electronics is a 512K × 8-bit (4 Mbit), 3.3 V high-speed CMOS static RAM with 12 ns access and cycle times, JEDEC-compliant center-power/ground pinout, and industrial temperature support (–40°C to +85°C). It operates asynchronously without clocks or refresh, features TTL-compatible bidirectional I/O, and is used in real-time embedded control buffers, network packet memory, and FPGA configuration storage.

For engineers reviewing the 71V424S12PHGI8 datasheet, 71V424S12PHGI8 pinout, 71V424S12PHGI8 application, or 71V424S12PHGI8 equivalent, key selection criteria include its 12 ns read access time, TSOP-44 industrial-grade packaging, low-power standby current (50 mA dynamic ISB, 20 mA static ISB1), and compatibility with legacy SRAM-based memory interfaces requiring single-supply 3.3 V operation.

Technical Context

The 71V424S12PHGI8 implements fully static asynchronous logic with no internal clocks or refresh circuitry. Its address decoding, I/O control, and output enable paths are optimized for deterministic timing - tAA = 12 ns, tOE = 6 ns, and tCHZ = 6 ns - enabling reliable interfacing with microcontrollers and FPGAs operating at up to ~83 MHz sustained burst rates.

It supports two distinct write control modes: WE-controlled and CS-controlled cycles, with defined setup/hold requirements (tAS = 0 ns, tDH = 0 ns) and output disable timing (tWHZ = 7 ns). The device uses a 36-pin SOJ or 44-pin TSOP package with JEDEC-standard power/ground pin placement to minimize simultaneous switching noise (SSN) in dense PCB layouts.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 512K × 8-bit (4,194,304-bit total); enables byte-wide data transfers without external multiplexing
Access Time (tAA) 12 ns max; guarantees valid data on I/O pins within 12 ns of stable address and CS assertion
Supply Voltage 3.0 V to 3.6 V; compatible with standard 3.3 V LVTTL and LVCMOS I/O domains
Operating Temperature –40°C to +85°C; qualified for industrial environments including factory automation and telecom infrastructure
Standby Current (ISB1) 20 mA max at VDD = 3.6 V, f = 0; enables ultra-low-power retention during system sleep states
I/O Interface TTL-compatible bidirectional data bus (I/O0–I/O7); eliminates level-shifter requirements in mixed-voltage systems
Package 44-pin TSOP Type II (PHG44); 400-mil width, surface-mount compatible with automated assembly

Pinout & Package

71V424S12PHGI8 is housed in a 44-pin, 400-mil TSOP Type II (PHG44) package with JEDEC-standard center-power/ground pinout for reduced noise coupling. Pin functions are electrically validated per Renesas datasheet revision May 2021.

Pin/Terminal Circuit Role Design Meaning
A0–A18 Address Inputs 19-bit address bus supporting full 512K-word addressing; no internal address latching required
CS Chip Select Active-low enable controlling device selection; tACS = 12 ns defines minimum CS-to-data-valid delay
OE Output Enable Active-low control for output drivers; tOE = 6 ns determines fastest read-enable response
WE Write Enable Active-low write strobe; enables data capture on rising edge when CS is asserted
I/O0–I/O7 Bidirectional Data Bus 8-bit TTL-compatible I/O; direction controlled implicitly by CS/OE/WE state per truth table
VDD Power Supply 3.3 V core supply; pins 22 and 37 provide distributed power delivery to reduce IR drop
VSS Ground Ground reference; pins 21 and 36 placed adjacent to VDD for optimal decoupling

Key Features

Feature Design Value
JEDEC Center Power/Ground Pinout Reduces simultaneous switching noise (SSN) by symmetrically distributing VDD/VSS across package centerline
Equal Access & Cycle Times tRC = tAA = 12 ns ensures predictable timing margins for both read and write cycles in synchronous bus designs
Low-Power Standby Mode ISB1 = 20 mA (static) and ISB = 50 mA (dynamic) enable energy-efficient idle states in battery-backed or thermal-constrained systems
Single 3.3 V Supply Operation Eliminates need for dual-rail supplies or voltage translators, simplifying power delivery and reducing BOM count
Full TTL Compatibility VIH = 2.0 V min, VIL = 0.8 V max, VOH = 2.4 V min, VOL = 0.4 V max ensure robust interoperability with legacy logic families

Applications

Industrial PLC Data Buffers FPGA Configuration Memory

Use Scenario: Storing real-time I/O scan data and ladder logic intermediate values in programmable logic controllers.

IC Role / Device Role / Timing Role: Asynchronous byte-wide scratchpad memory with deterministic 12 ns access for deterministic scan-cycle execution.

Use Value: Enables sub-10 µs I/O update latency without CPU intervention or DRAM refresh overhead.

Use Scenario: Holding configuration bitstreams for Xilinx Spartan or Intel Cyclone FPGAs during cold boot or partial reconfiguration.

IC Role / Device Role / Timing Role: Nonvolatile-equivalent fast-read memory providing parallel bitstream loading at 83 MB/s peak bandwidth.

Use Value: Reduces FPGA startup time by >40% compared to serial PROMs while avoiding volatile SRAM initialization delays.

Telecom Line Card Packet Buffers Medical Imaging Frame Stores

Use Scenario: Temporary storage of Ethernet or TDM packets in carrier-grade line cards before switching or processing.

IC Role / Device Role / Timing Role: Dual-port-emulated buffer using CS/OE/WE handshaking to support concurrent ingress/egress traffic streams.

Use Value: Supports 100 Mbps+ line rates with zero packet loss under bursty traffic due to 12 ns random-access latency.

Use Scenario: Capturing and holding uncompressed grayscale frames (e.g., 1024×1024 @ 8-bit) from ultrasound or endoscopic sensors.

IC Role / Device Role / Timing Role: High-reliability frame buffer with industrial temp rating ensuring stable operation in sterilized enclosures.

Use Value: Guarantees pixel-perfect frame integrity over 10+ years MTBF without refresh-induced corruption artifacts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY62148EV30LL-45ZSXI 512K × 8-bit, 45 ns access, 3.3 V, SOIC-32; higher latency, lower power, no TSOP option Suitable for cost-sensitive, non-real-time buffering where <10 MHz bus speeds suffice Select when board space allows SOIC and timing budget permits ≥45 ns access
AS6C4008-12BIN 512K × 8-bit, 12 ns access, 3.3 V, TSOP-44; identical speed/package but ±10% VDD tolerance vs. 3.0–3.6 V Valid for same industrial applications but requires validation of VDD stability margin at 2.97 V Choose if sourcing diversification is prioritized and VDD regulation meets tighter AS6C spec

Compared with CY62148EV30LL-45ZSXI and AS6C4008-12BIN, the 71V424S12PHGI8 delivers superior noise immunity via JEDEC center-power pinout, guaranteed 12 ns performance across full industrial temperature range, and Renesas' long-term lifecycle support for embedded infrastructure programs.

Availability

71V424S12PHGI8 is available at Aetrix Electronics and suitable for industrial PLCs, telecom line cards, medical imaging subsystems, and FPGA-based prototyping platforms requiring stable component supply, extended temperature operation, and proven SRAM reliability.

Supply support for 71V424S12PHGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and IoT applications.

The 71V424S12PHGI8 belongs to Renesas' legacy high-speed SRAM product line, designed specifically for deterministic, low-latency memory interfacing in real-time embedded systems where DRAM complexity or flash latency is unacceptable.

FAQ

What is the maximum clock frequency supported by the 71V424S12PHGI8?

The 71V424S12PHGI8 is an asynchronous SRAM and does not use a clock signal. Its maximum effective interface rate is determined by timing parameters: with tRC = 12 ns, it supports up to ~83 MHz sustained random-access throughput. System-level bus frequency depends on controller timing margins and board layout, not an internal clock.

Does the 71V424S12PHGI8 require refresh circuitry or periodic maintenance?

No, the 71V424S12PHGI8 is a fully static RAM and requires no refresh cycles, clocks, or periodic maintenance. Its CMOS latch-based memory cells retain data indefinitely as long as VDD remains within 3.0–3.6 V and temperature stays within –40°C to +85°C. This eliminates refresh overhead in microcontroller or FPGA-based systems.

Can the 71V424S12PHGI8 be used with 5 V logic interfaces?

No - the 71V424S12PHGI8 is strictly a 3.3 V device. Its absolute maximum input voltage is VDD + 0.5 V = 4.1 V, and VIH is specified at 2.0 V minimum. Direct connection to 5 V TTL or CMOS outputs risks damage or unreliable operation. Level translation (e.g., TXB0108) is required for 5 V host interfaces.

What is the meaning of "PHGI8" in the part number 71V424S12PHGI8?

In 71V424S12PHGI8, "PHG" denotes 44-pin TSOP Type II package, "I" indicates industrial temperature grade (–40°C to +85°C), and "8" specifies tape-and-reel packaging. The "S" identifies the standard-power variant (vs. "L" for low-power), and "12" is the 12 ns speed grade. This full suffix confirms the device's industrial qualification and assembly-ready format.

How does the JEDEC center-power/ground pinout improve noise performance in the 71V424S12PHGI8?

The JEDEC center-power/ground pinout places VDD and VSS pins symmetrically near the center of the 44-pin TSOP package (pins 22, 21, 37, 36), minimizing loop inductance and balancing return current paths. This reduces simultaneous switching noise (SSN) by up to 40% compared to corner-fed packages, critical for maintaining signal integrity in high-density memory buses operating above 50 MHz.

71V424S12PHGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
44-TSOP (0.400", 10.16mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Asynchronous
Memory Size:
4Mbit
Memory Organization:
512K x 8
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
12ns
Access Time:
12 ns
Voltage - Supply:
3V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
44-TSOP II

71V424S12PHGI8 FAQ

1.How can I place an order for 71V424S12PHGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V424S12PHGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V424S12PHGI8 reliable?

The price and inventory of 71V424S12PHGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V424S12PHGI8 is usually 5 days.

3.What payment methods are accepted for 71V424S12PHGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V424S12PHGI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V424S12PHGI8?

71V424S12PHGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V424S12PHGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V424S12PHGI8?

For technical support, including 71V424S12PHGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V424S12PHGI8 requirements.

6.How does Aetrix verify that 71V424S12PHGI8 is sourced from the original manufacturer or authorized distributors?

All 71V424S12PHGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V424S12PHGI8 meets industry standards.

7.What is the process for return or replacement of 71V424S12PHGI8?

All 71V424S12PHGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V424S12PHGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V424S12PHGI8 part is unused and in its original packaging.

Return procedure for 71V424S12PHGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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