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Renesas 71V546S100PFG8

Part No.:
71V546S100PFG8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V546S100PFG8.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,486

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Product details

Overview

71V546S100PFG8 from Integrated Device Technology is a 3.3V, 128K × 36-bit (4.5 Mbit) synchronous SRAM with Zero Bus Turnaround (ZBT™) architecture, pipelined outputs, and 4-word burst capability. It operates at 100 MHz (10 ns clock cycle), delivers 5 ns clock-to-data access, and supports linear or interleaved burst ordering via the LBO pin. It is used in high-speed networking packet buffers and telecom line-card memory subsystems requiring seamless read/write transitions.

For engineers reviewing the 71V546S100PFG8 datasheet, 71V546S100PFG8 pinout, 71V546S100PFG8 application, or 71V546S100PFG8 equivalent, key selection criteria include ZBT™ bus turnaround elimination, 100-pin TQFP package compatibility, industrial temperature support (–40°C to +85°C), and synchronous byte-write control for partial-word updates in burst pipelines.

Technical Context

The 71V546S100PFG8 implements a fully registered synchronous interface with all address, control, and data paths triggered on the rising edge of CLK-except OE, which remains asynchronous. Its internal burst counter advances on ADV/LD = HIGH, enabling four consecutive data cycles per address load without reissuing the address.

ZBT™ operation is achieved by decoupling bus direction control from data phase timing: write-to-read or read-to-write transitions occur with zero dead cycles because output enable is register-controlled and bus tri-state is managed internally with precise 2-cycle deselect latency. The device uses three chip enables (CE1, CE2 low; CE2 high) for flexible depth expansion and supports individual 9-bit byte writes via BW1–BW4.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36 bits (4.5 Mbit); supports 36-bit parallel data path for wide-bus systems
Max Clock Frequency100 MHz; enables 10 ns cycle time for real-time packet buffering in 10Gbps+ interfaces
Access Time (tCD)5 ns; defines minimum latency from clock edge to valid output data in read cycles
Burst Capability4-word burst (linear or interleaved); reduces address bus traffic and improves throughput in sequential access
Supply Voltage3.3 V ±5%; compatible with standard LVCMOS I/O domains and eliminates need for level shifters
Operating Temperature–40°C to +85°C (industrial grade); qualified for base station and carrier-grade equipment
Package100-pin TQFP (14 mm × 20 mm); JEDEC-standard footprint for high-density PCB layout

Pinout & Package

Packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), the 71V546S100PFG8 features a 14 mm × 20 mm body with 0.5 mm pitch leads. Pin 1 is located at the top-left corner (marked by dot or bevel), and the package includes dedicated power/ground pins distributed across all four sides for low-noise operation.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address Inputs17-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CLKSystem Clock InputRising-edge-triggered master clock; all synchronous registers (address, control, I/O) align to this edge
R/WRead/Write ControlSynchronous signal defining access type for current load cycle; determines burst direction at initiation
ADV/LDAddress Load / Burst AdvanceLOW loads new external address; HIGH increments internal burst counter-enables continuous burst mode
LBOBurst Order SelectStatic input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence
BW1–BW4Byte Write EnablesFour independent active-low enables for 9-bit byte segments (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4)
CE1, CE2, CE2Chip Enable GroupThree-input enable logic: CE1=LOW, CE2=LOW, CE2=HIGH selects device; any violation deselects in 2 cycles
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous data path; registered inputs and outputs eliminate external latch requirements
OEOutput EnableAsynchronous control; drives I/O pins to high-Z when HIGH-no timing constraints required for disable
VDD / VSSPower / GroundMultiple distributed 3.3V and ground pins reduce simultaneous switching noise and improve signal integrity

Key Features

FeatureDesign Value
ZBT™ ArchitectureEliminates bus turnaround dead cycles between reads and writes-critical for full-duplex packet buffer operation
Pipelined OutputsInternally registered outputs remove need for external OE timing control and simplify system-level timing closure
4-Word Burst ModeReduces address bus activity by 75% during sequential accesses-lowers controller overhead and power consumption
Individual Byte WriteEnables selective 9-bit updates without disturbing adjacent bytes-essential for header modification in network processors
Three Chip EnablesSupports depth expansion up to 3× without external logic-simplifies multi-SRAM memory banks in modular designs

Applications

Telecom Line CardsNetwork Packet Buffers

Use Scenario: High-speed aggregation of OC-192/STM-64 traffic in carrier-grade routers with strict jitter and latency budgets.

IC Role / Device Role / Timing Role: Primary packet memory buffer interfacing directly to SerDes PHYs and traffic manager ASICs via 36-bit parallel bus.

Use Value: ZBT™ eliminates turnaround gaps that would otherwise cause pipeline stalls and increase end-to-end latency beyond 500 ns.

Use Scenario: Temporary storage of fragmented IPv6 packets undergoing reassembly and deep packet inspection in firewall appliances.

IC Role / Device Role / Timing Role: Dual-port-accessible SRAM serving as ingress/egress FIFO with burst-mode read/write for DMA engines.

Use Value: 4-word burst capability cuts memory transaction count by 75%, reducing bus arbitration contention and improving throughput by ≥30%.

Baseband Processing UnitsIndustrial Real-Time Controllers

Use Scenario: LTE/5G baseband processing where FFT/IFFT results require low-latency, deterministic memory access for channel estimation.

IC Role / Device Role / Timing Role: Synchronous SRAM acting as coefficient and sample buffer between FPGA-based DSP blocks and ADC/DAC interfaces.

Use Value: 100 MHz clock rate and 5 ns tCD ensure sub-cycle memory response-meeting hard real-time deadlines under worst-case thermal conditions.

Use Scenario: Motion control PLCs performing synchronized servo loop updates at 10 kHz with deterministic jitter < 100 ns.

IC Role / Device Role / Timing Role: Deterministic-access memory for storing position setpoints, encoder feedback, and PID coefficients in dual-core safety-critical controllers.

Use Value: Industrial temperature rating (–40°C to +85°C) and 3.3V single-supply operation guarantee reliability in uncooled cabinet environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1355BV18-100BZXI128K × 36, 1.8V core / 3.3V I/O, 100 MHz, different pinout (119-pin FBGA), no ZBT™Lacks ZBT™ bus turnaround optimization; requires external control logic for seamless R/W transitionsChoose when lower core voltage and smaller footprint are prioritized over zero-cycle turnaround
AS7C31026B-10JIN128K × 32, 3.3V, 100 MHz, 100-pin TQFP, no burst counter or ZBT™32-bit width limits data bandwidth; lacks ADV/LD and LBO controls-requires full address per accessChoose for cost-sensitive applications where burst and ZBT™ are unnecessary and 32-bit bus suffices

Compared with CY7C1355BV18-100BZXI and AS7C31026B-10JIN, the 71V546S100PFG8 uniquely delivers ZBT™-enabled zero-dead-cycle operation and integrated 4-word burst sequencing-reducing controller complexity and improving sustained bandwidth in high-throughput memory subsystems.

Availability

71V546S100PFG8 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and high-performance computing applications requiring stable component supply, long-term lifecycle assurance, and industrial-grade thermal performance.

Supply support for 71V546S100PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and sensor solutions for communications and computing markets.

The IDT71V546 product line was designed specifically for high-speed, low-latency memory buffering in networking and telecom equipment-emphasizing ZBT™ architecture, burst efficiency, and industrial reliability.

FAQ

What does the 'S100' suffix in 71V546S100PFG8 indicate?

The 'S100' suffix denotes the speed grade: 100 MHz maximum clock frequency with 10 ns clock cycle time and 5 ns clock-to-data access (tCD). This distinguishes it from the S133 variant (133 MHz, 4.2 ns tCD). The 71V546S100PFG8 is fully specified and tested to meet these timing parameters across industrial temperature and voltage ranges.

How does the ZBT™ feature eliminate bus turnaround cycles in 71V546S100PFG8?

The ZBT™ feature in the 71V546S100PFG8 removes dead cycles between read and write operations by using internally synchronized registered outputs and eliminating the need for external OE control. Bus direction changes occur seamlessly because the device manages output enable and tri-state timing internally-ensuring the next data phase begins immediately after the prior one ends, with no gap.

Can the 71V546S100PFG8 operate with only two chip enables instead of three?

Yes-the 71V546S100PFG8 supports simplified enable logic: CE1 and CE2 can be tied active low while CE2 is tied active high (VDD), satisfying the selection condition (CE1=L, CE2=L, CE2=H). All three pins must meet their respective polarity requirements simultaneously for selection; omitting or misconfiguring any one causes immediate deselect within two clock cycles.

What is the function of the ADV/LD and LBO pins in 71V546S100PFG8 burst operation?

ADV/LD controls burst initiation: sampled LOW to load a new external address, HIGH to advance the internal burst counter. LBO selects burst order-LOW for linear (0,1,2,3), HIGH for interleaved (0,2,1,3)-determining how A0/A1 increment during the 4-word sequence. Both are synchronous inputs sampled on the rising CLK edge when the device is selected.

Is the 71V546S100PFG8 pin-compatible with other members of the IDT71V546 family?

Yes-the 71V546S100PFG8 shares identical 100-pin TQFP pinout and signal mapping with all speed grades (e.g., 71V546S133PFG8) and temperature variants in the IDT71V546 family. Differences are limited to AC timing specifications and DC current ratings; no PCB redesign is needed when upgrading or downgrading speed grades within the same package.

71V546S100PFG8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

71V546S100PFG8 FAQ

1.How can I place an order for 71V546S100PFG8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V546S100PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V546S100PFG8 reliable?

The price and inventory of 71V546S100PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V546S100PFG8 is usually 5 days.

3.What payment methods are accepted for 71V546S100PFG8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V546S100PFG8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V546S100PFG8?

71V546S100PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V546S100PFG8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V546S100PFG8?

For technical support, including 71V546S100PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V546S100PFG8 requirements.

6.How does Aetrix verify that 71V546S100PFG8 is sourced from the original manufacturer or authorized distributors?

All 71V546S100PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V546S100PFG8 meets industry standards.

7.What is the process for return or replacement of 71V546S100PFG8?

All 71V546S100PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V546S100PFG8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V546S100PFG8 part is unused and in its original packaging.

Return procedure for 71V546S100PFG8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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