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Renesas 71V546S100PFGI

Part No.:
71V546S100PFGI
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V546S100PFGI.pdf
Description:
IC SRAM 4.5MBIT PAR 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,391

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Product details

Overview

71V546S100PFGI from Integrated Device Technology is a 128K × 36-bit, 4.5 Mbit, 3.3V synchronous SRAM with ZBT™ (Zero Bus Turnaround) architecture, pipelined outputs, and 4-word burst capability. It operates at 100 MHz (10 ns clock cycle), delivers 4.2 ns clock-to-data access in read mode, and supports interleaved or linear burst ordering via the LBO pin. It is used in high-speed packet buffering and network switch fabric control planes where bus turnaround latency must be eliminated.

For engineers reviewing the 71V546S100PFGI datasheet, 71V546S100PFGI pinout, 71V546S100PFGI application, or 71V546S100PFGI equivalent, key selection criteria include its 100-pin TQFP package, synchronous R/W control with ADV/LD-driven burst counter, individual byte write enables (BW1–BW4), and industrial temperature support (–40°C to +85°C).

Technical Context

The 71V546S100PFGI implements a fully pipelined synchronous interface with all address, control, and data registers triggered on the positive clock edge. Its ZBT™ architecture eliminates dead cycles between consecutive read/write operations by decoupling address load and data transfer timing-data appears two clocks after address/control registration.

It integrates an on-chip burst counter and supports both linear and interleaved 4-word burst sequences selected by the static LBO pin. The device uses three chip enables (CE1, CE2 low-active; CE2 high-active) for flexible depth expansion and features registered I/O paths with asynchronous OE for output tri-state control independent of clock timing.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36 bits (4.5 Mbit); supports full 36-bit word or 9-bit byte writes via BW1–BW4
Clock Frequency100 MHz max; enables deterministic 10 ns system timing with tCYC = 10 ns
Access TimetCD = 5 ns (clock-high to valid data); defines minimum read latency for pipeline scheduling
Burst Capability4-word burst (linear or interleaved); reduces address bus traffic by 75% per burst sequence
Supply Voltage3.3 V ±5%; compatible with standard 3.3V logic families and avoids level-shifting overhead
Operating Temperature–40°C to +85°C industrial grade; qualified for telecom infrastructure and industrial control environments
Package100-pin TQFP (14 mm × 20 mm, JEDEC standard); supports high-density PCB layout with 0.5 mm pitch

Pinout & Package

71V546S100PFGI is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm lead pitch and exposed pad not present. Pin 1 is marked by corner notch; pin 14 is NC but requires VIH > 2.0 V if left unconnected.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address InputsSynchronous 17-bit address bus; latched on rising CLK edge when ADV/LD = LOW and CEN = LOW
CLKClock InputPrimary timing reference; all synchronous inputs sampled on rising edge; OE is asynchronous
R/WRead/Write ControlSynchronous signal defining access type for current load cycle; ignored during burst (ADV/LD = HIGH)
ADV/LDAddress Load / Burst AdvanceLOW loads new external address; HIGH increments internal burst counter; determines burst vs. single-cycle operation
LBOBurst Order SelectStatic input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence
BW1–BW4Byte Write EnablesFour independent active-low enables for 9-bit bytes; required for partial writes; may be tied LOW for full-word writes
CE1, CE2Chip Enable (Low)Two active-low enables; both must be LOW (with CE2 HIGH) to select device; supports depth expansion
CE2Chip Enable (High)Active-high enable; complements CE1/CE2 for multi-chip configurations; polarity inverted but functionally identical
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional synchronous data bus; I/O0–I/O31 = 32-bit data; I/OP1–I/OP4 = 4 parity bits
OEOutput EnableAsynchronous control; drives I/O pins to high-Z when HIGH; may be permanently tied LOW for read-only operation

Key Features

FeatureDesign Value
ZBT™ ArchitectureEliminates bus turnaround dead cycles between reads and writes-enables back-to-back memory transactions without wait states
Pipelined OutputsInternally registered outputs remove need for external OE timing control; simplifies system-level timing closure
4-Word Burst ModeReduces address bus activity by 75% per burst; improves bandwidth efficiency in sequential-access applications like FIFOs
Individual Byte WriteGranular 9-bit write control via BW1–BW4 allows partial updates without read-modify-write overhead
Three Chip EnablesSupports seamless depth expansion across multiple devices using CE1/CE2 (low) and CE2 (high) for hierarchical decoding

Applications

Network Packet BufferingTelecom Switch Fabric Control

Use Scenario: Storing variable-length Ethernet frames in ingress/egress queues of Layer 2/3 switches.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM buffer with zero-turnaround writes enabling concurrent frame acceptance and forwarding decisions.

Use Value: Eliminates bus contention stalls during rapid read-after-write transitions, sustaining line-rate throughput at 1 Gbps+.

Use Scenario: Holding configuration tables and lookup entries for crosspoint arbitration in carrier-grade TDM and packet switches.

IC Role / Device Role / Timing Role: Synchronous memory providing deterministic 5 ns read access and burst-aligned writes for real-time table updates.

Use Value: 4-word burst mode accelerates table walk operations; industrial temp rating ensures reliability in fanless chassis.

Industrial PLC Data LoggingMedical Imaging Frame Store

Use Scenario: Capturing sensor time-series data at 10 kHz sampling rates with timestamped metadata in programmable logic controllers.

IC Role / Device Role / Timing Role: Local high-speed buffer interfacing with FPGA-based acquisition engines via synchronous 36-bit bus.

Use Value: Pipelined outputs and registered I/O simplify FPGA timing constraints; 3.3V supply aligns with modern logic families.

Use Scenario: Temporary storage of uncompressed 1024×768 monochrome image frames (786 kB/frame) during DICOM preprocessing pipelines.

IC Role / Device Role / Timing Role: Burst-capable SRAM delivering 4-word bursts to reduce memory controller overhead during frame transfers.

Use Value: Linear burst mode matches raster-scan memory access patterns; 100-pin TQFP enables compact, EMI-controlled board layout.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1355BV18-100BZI128K × 36, 1.8V core / 3.3V I/O; 100 MHz; different pinout (119-pin FBGA); no ZBT™Requires level-shifting for 3.3V-only systems; lacks zero-turnaround; higher density but incompatible footprintSelect only if migrating to lower-voltage design and redesigning PCB layout.
AS7C3256A-10JIN128K × 32 (no parity bits); 100 MHz; 100-pin TQFP; standard sync SRAM (no ZBT™ or burst counter)Missing I/OP1–I/OP4 parity lines and ADV/LD-controlled burst; simpler interface but no zero-turnaround benefitChoose for cost-sensitive designs where burst and ZBT™ are unnecessary and 32-bit width suffices.

Compared with CY7C1355BV18-100BZI and AS7C3256A-10JIN, the 71V546S100PFGI uniquely delivers ZBT™-enabled zero-turnaround operation and integrated burst sequencing in a drop-in 100-pin TQFP package-critical for latency-constrained networking and real-time control systems.

Availability

71V546S100PFGI is available at Aetrix Electronics and suitable for network packet buffering, telecom switch fabric control, and industrial PLC data logging requiring stable component supply and long-term industrial temperature support.

Supply support for 71V546S100PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, is a fabless semiconductor company specializing in timing, memory interface, RF, and power management ICs for communications, computing, and industrial markets.

The IDT71V546 product line was designed specifically for high-performance, low-latency synchronous memory applications in networking equipment and real-time embedded systems where bus turnaround overhead must be eliminated.

FAQ

What does the 'S100' suffix in 71V546S100PFGI indicate?

The 'S100' suffix denotes the speed grade: 100 MHz maximum clock frequency (tCYC = 10 ns). This is confirmed in the AC Electrical Characteristics table, where 71V546S100 specifies tCYC = 10 ns (min) and fMAX = 100 MHz. The 71V546S100PFGI is functionally identical to other S100 variants but qualified in the industrial temperature range (–40°C to +85°C) and packaged in a 100-pin TQFP.

Does 71V546S100PFGI support true ZBT™ (Zero Bus Turnaround) operation?

Yes, the 71V546S100PFGI implements true ZBT™ operation as defined by IDT: it eliminates dead cycles between consecutive read and write operations. The datasheet explicitly states that "no dead cycles between write and read cycles" are required, and timing waveforms confirm back-to-back R/W transitions with no bus idle period-verified in the Synchronous Truth Table and Combined Read/Write Timing Diagram (Figure 3821 drw 08).

How is burst addressing controlled on the 71V546S100PFGI?

Burst addressing is controlled by the ADV/LD and LBO pins. When ADV/LD is sampled HIGH on the rising clock edge, the internal burst counter advances; when sampled LOW, a new external address is loaded. LBO selects burst order: LOW for linear (0,1,2,3), HIGH for interleaved (0,2,1,3). This behavior is documented in the Pin Definitions table (3821 tbl 02) and Burst Sequence Tables (3821 tbl 09–10).

Can the 71V546S100PFGI operate with only two chip enables?

Yes-the 71V546S100PFGI requires CE1 = LOW, CE2 = LOW, and CE2 = HIGH to assert selection. CE2 is active-high and functionally complementary to CE1/CE2; all three must be asserted simultaneously. The datasheet states "to select the chip requires CE1 = L, CE2 = L, CE2 = H" (3821 tbl 07, Note 5), confirming that all three enables are mandatory for normal operation.

What is the role of the I/OP1–I/OP4 pins on the 71V546S100PFGI?

The I/OP1–I/OP4 pins are 4 dedicated parity bits associated with the 32-bit data bus (I/O0–I/O31), forming a full 36-bit interface. They support error detection in mission-critical applications. The Functional Block Diagram (3821 drw 01) and Pin Description Summary (3821 tbl 01) explicitly list them as "Data Input/Output" with P1–P4 designation, and the memory organization is defined as 128K × 36 in the title and description.

71V546S100PFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x20)

71V546S100PFGI FAQ

1.How can I place an order for 71V546S100PFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V546S100PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V546S100PFGI reliable?

The price and inventory of 71V546S100PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V546S100PFGI is usually 5 days.

3.What payment methods are accepted for 71V546S100PFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V546S100PFGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V546S100PFGI?

71V546S100PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V546S100PFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V546S100PFGI?

For technical support, including 71V546S100PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V546S100PFGI requirements.

6.How does Aetrix verify that 71V546S100PFGI is sourced from the original manufacturer or authorized distributors?

All 71V546S100PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V546S100PFGI meets industry standards.

7.What is the process for return or replacement of 71V546S100PFGI?

All 71V546S100PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V546S100PFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V546S100PFGI part is unused and in its original packaging.

Return procedure for 71V546S100PFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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