Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V546S133PFG

Part No.:
71V546S133PFG
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V546S133PFG.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,711

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V546S133PFG from Integrated Device Technology is a 3.3V, 128K × 36-bit (4.5 Mbit) synchronous SRAM with ZBT™ (Zero Bus Turnaround) architecture, pipelined outputs, and 4-word burst capability. It operates at 133 MHz (7.5 ns cycle time), delivers 4.2 ns clock-to-data access, and supports interleaved or linear burst ordering via the LBO pin. It is used in high-speed packet buffering and network switch fabric control planes.

For engineers reviewing the 71V546S133PFG datasheet, 71V546S133PFG pinout, 71V546S133PFG application, or 71V546S133PFG equivalent, key selection criteria include ZBT™ bus turnaround elimination, synchronous 3.3V operation with CEN/ADV/LD control logic, 100-pin TQFP packaging, and industrial temperature support (–40°C to +85°C).

Technical Context

The 71V546S133PFG implements a fully pipelined synchronous interface with address, control, and data registers triggered on the rising edge of CLK. All inputs except OE are synchronous, and internal burst counter advancement is controlled by ADV/LD level sampling - low loads new address, high increments counter.

ZBT™ functionality eliminates dead cycles between read/write transitions by decoupling bus direction control from data transfer timing. The device uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion and supports individual byte write (BW1–BW4) with 9-bit granularity per byte group.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36 bits (4.5 Mbit); supports 36-bit parallel data path for wide-bus applications like switch ASIC interfaces.
Clock Frequency 133 MHz (tCYC = 7.5 ns); enables sustained 532 MB/s peak bandwidth in burst-read mode.
Access Timing tCD = 4.2 ns (clock-to-data valid); ensures deterministic latency for real-time packet header processing.
Burst Capability 4-word burst (linear or interleaved); reduces address overhead and improves throughput in sequential access patterns.
Supply Voltage 3.3 V ±5%; compatible with standard 3.3V logic families and avoids mixed-voltage translation circuitry.
Operating Temperature –40°C to +85°C (industrial grade); validated for deployment in telecom infrastructure and industrial networking equipment.
Package 100-pin TQFP (14 mm × 20 mm); JEDEC-standard footprint enabling board-level compatibility with legacy IDT SRAM designs.

Pinout & Package

Packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body size, with exposed pad not required for thermal performance per datasheet.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address Inputs Synchronous 17-bit address bus; sampled on rising CLK edge when ADV/LD = LOW and chip enabled.
CLK Clock Input Single-phase positive-edge-triggered master clock; all synchronous timing referenced to this signal.
R/W Read/Write Control Synchronous command signal; determines access type during address load cycle (two-cycle pipeline delay).
ADV/LD Address Load / Burst Advance LOW loads new external address; HIGH advances internal burst counter - critical for burst sequencing control.
LBO Linear/Interleaved Burst Order Static DC input selecting burst sequence (LOW = linear, HIGH = interleaved); defines A0/A1 bit progression order.
CE1, CE2, CE2 Chip Enables Three independent enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion without external logic.
BW1–BW4 Byte Write Enables Four active-low signals controlling 9-bit byte groups (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4).
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional synchronous data bus; registered input/output paths eliminate external latch requirements.
OE Output Enable Asynchronous control; drives I/O pins to high-Z when HIGH - usable for bus sharing but not required for normal operation.
CEN Clock Enable Synchronous gate for CLK propagation; suspends all internal register updates while preserving output state.

Key Features

Feature Design Value
ZBT™ Architecture Eliminates bus turnaround dead cycles between consecutive reads and writes - enables continuous back-to-back memory transactions without inter-cycle gaps.
Pipelined Outputs Internally registered outputs remove need for external OE timing control and simplify system-level timing closure in high-frequency designs.
4-Word Burst Mode Reduces address bus activity by 75% per burst; supports both linear (sequential) and interleaved (cache-line-friendly) addressing via LBO pin.
Individual Byte Write Enables precise 9-bit sub-word writes without masking logic; BWx signals must be asserted two cycles before data arrival.
Three Chip Enables Allows seamless depth expansion across multiple devices using simple AND/OR logic - no additional decode circuitry required.

Applications

Network Packet Buffering Switch Fabric Control Memory

Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 switches with strict latency budgets.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM serving as descriptor buffer and forwarding table cache.

Use Value: 133 MHz operation and 4.2 ns tCD ensure header lookup completion within one clock cycle, supporting line-rate 10G Ethernet processing.

Use Scenario: Holding configuration state and queue management entries in modular chassis-based routers.

IC Role / Device Role / Timing Role: Synchronous SRAM providing deterministic access to control-plane registers and scheduling tables.

Use Value: ZBT™ eliminates turnaround penalties during mixed read/write bursts, improving scheduler throughput by up to 25% vs. conventional SRAM.

Telecom Line Card Memory Industrial Protocol Gateway Cache

Use Scenario: Buffering ATM cell payloads and SONET/SDH overhead bytes in carrier-grade access equipment.

IC Role / Device Role / Timing Role: Wide-data-path SRAM interfacing directly with framer ASICs via 36-bit parallel bus.

Use Value: 100-pin TQFP package and industrial temp rating (–40°C to +85°C) meet NEBS Level 3 environmental compliance requirements.

Use Scenario: Caching Modbus TCP or PROFINET IRT frame buffers in factory automation gateways.

IC Role / Device Role / Timing Role: Deterministic-access memory storing protocol translation tables and real-time message queues.

Use Value: CEN pin allows synchronized power-down during idle periods, reducing average current draw to 40 mA in standby (ISB1).

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1355BV18-133BZI 128K × 36, 1.8V core / 3.3V I/O; different voltage domain and pinout; no ZBT™ feature. Requires level-shifting for 3.3V-only systems; lacks zero-turnaround capability - introduces 1-cycle gap between R/W transitions. Select only if migrating to lower-power 1.8V core architecture and redesigning power delivery and interface logic.
AS7C33128PFSI-133 128K × 36, 3.3V; supports ZBT™ but uses 128-pin FBGA; no ADV/LD or LBO pins - fixed linear burst only. Higher pin count increases PCB routing complexity; missing burst-order flexibility limits optimization for cache-aligned access patterns. Choose only when board space permits larger package and burst-mode flexibility is not required for target application.

Compared with CY7C1355BV18-133BZI and AS7C33128PFSI-133, the 71V546S133PFG uniquely combines true ZBT™ operation, 100-pin TQFP compatibility, and programmable burst ordering - making it optimal for retrofitting legacy IDT-based switch fabric designs without layout changes.

Availability

71V546S133PFG is available at Aetrix Electronics and suitable for network packet buffering, switch fabric control memory, and telecom line card memory requiring stable component supply and long-term industrial temperature support.

Supply support for 71V546S133PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Integrated Device Technology (IDT), now part of Renesas Electronics, specializes in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.

The IDT71V546 product line was designed specifically for high-speed, low-latency data buffering in networking ASIC interfaces - emphasizing ZBT™ efficiency, burst predictability, and industrial reliability.

FAQ

What does the "S133" suffix in 71V546S133PFG indicate?

The "S133" suffix denotes the speed grade: 133 MHz maximum operating frequency (7.5 ns clock cycle). This is confirmed in the AC Electrical Characteristics table (tCYC = 7.5 ns, fMAX = 133 MHz) and distinguishes it from slower variants like 71V546S100. The 71V546S133PFG is fully specified and tested to operate reliably at this rate across industrial temperature ranges.

Does the 71V546S133PFG require external OE control during normal operation?

No - the 71V546S133PFG does not require active OE control. Its internally synchronized registered outputs eliminate the need to manage OE timing; OE can be tied low permanently. This simplifies interface design and removes a critical timing constraint from the system bus, as stated in the Features section and Pin Definitions table.

How does the ZBT™ feature improve system performance compared to standard synchronous SRAMs?

ZBT™ eliminates dead cycles between read and write operations by allowing immediate bus direction reversal without wait states. In the 71V546S133PFG, this enables back-to-back R/W transitions with zero turnaround penalty - verified in the Synchronous Truth Table and Timing Waveforms - increasing effective bandwidth in mixed-access applications like packet buffering by up to 30%.

Can the 71V546S133PFG be used in linear burst mode only, or is interleaved mode mandatory?

The 71V546S133PFG supports both linear and interleaved burst modes, selected dynamically via the LBO pin: LOW configures linear (A0–A1 increment sequentially), HIGH selects interleaved (A0–A1 follow cache-line pattern). Both modes are fully characterized and documented in Tables 9 and 10, giving designers flexibility for different memory access profiles.

What is the function of the three chip enable pins (CE1, CE2, CE2) on the 71V546S133PFG?

The 71V546S133PFG uses CE1 and CE2 as active-low enables and CE2 as an active-high enable. All three must be asserted (CE1 = L, CE2 = L, CE2 = H) to select the device. This arrangement allows flexible depth expansion - e.g., using CE1/CE2 for row decoding and CE2 for bank selection - without external logic, as defined in the Pin Definitions and Truth Table.

71V546S133PFG Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V546S133PFG FAQ

1.How can I place an order for 71V546S133PFG through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V546S133PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V546S133PFG reliable?

The price and inventory of 71V546S133PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V546S133PFG is usually 5 days.

3.What payment methods are accepted for 71V546S133PFG?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V546S133PFG transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V546S133PFG?

71V546S133PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V546S133PFG order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V546S133PFG?

For technical support, including 71V546S133PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V546S133PFG requirements.

6.How does Aetrix verify that 71V546S133PFG is sourced from the original manufacturer or authorized distributors?

All 71V546S133PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V546S133PFG meets industry standards.

7.What is the process for return or replacement of 71V546S133PFG?

All 71V546S133PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V546S133PFG, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V546S133PFG part is unused and in its original packaging.

Return procedure for 71V546S133PFG:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V546S133PFG Tags

  • 71V546S133PFG
  • 71V546S133PFG PDF
  • 71V546S133PFG Datasheet
  • 71V546S133PFG Specifications
  • 71V546S133PFG Images
  • Renesas
  • Renesas 71V546S133PFG
  • Buy 71V546S133PFG
  • 71V546S133PFG Price
  • 71V546S133PFG Distributor
  • 71V546S133PFG Supplier
  • 71V546S133PFG Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER