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Renesas 71V547S100PFGI

Part No.:
71V547S100PFGI
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V547S100PFGI.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,647

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Product details

Overview

71V547S100PFGI from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous SRAM with Zero Bus Turnaround (ZBT™) architecture, flow-through outputs, and 4-word burst capability. It delivers 95 MHz operation (8 ns clock-to-data access), supports linear/interleaved burst ordering via LBO pin, and features three chip enables for depth expansion - used in high-speed packet buffering and network switch data path memory.

For engineers reviewing the 71V547S100PFGI datasheet, 71V547S100PFGI pinout, 71V547S100PFGI application, or 71V547S100PFGI equivalent, key selection criteria include ZBT™ bus turnaround elimination, 100-pin TQFP package compatibility, industrial temperature range (–40°C to +85°C), and synchronous byte write control (BW1–BW4) for partial-word updates without external logic.

Technical Context

The 71V547S100PFGI implements a synchronous, clock-driven interface where address/control registration occurs on the rising CLK edge, with data output appearing one cycle later via flow-through (unregistered) path. Its ZBT™ architecture eliminates dead cycles between read/write transitions by decoupling bus direction control from OE - only R/W and ADV/LD determine access type and address progression.

Burst operation is managed by an on-chip counter advanced synchronously when ADV/LD = HIGH; LBO selects linear or interleaved sequence (A0–A1). CEN provides clock gating for power management, while CE1/CE2/CE2 enable hierarchical chip select with one-cycle deselect and tri-state hold behavior.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization128K × 36 bits (4.5 Mbit), enabling 36-bit wide data paths for telecom and networking ASIC interfaces
Max Clock Frequency100 MHz (tCYC = 15 ns), supporting 100 MT/s sustained throughput in burst mode
Access TimetCD = 10 ns max (clock-high to valid data), defining minimum latency for first-word read response
Supply Voltage3.3 V ±5%, compatible with standard LVCMOS-3.3 I/O domains and eliminating level-shifting needs
Operating Temperature–40°C to +85°C (industrial grade), validated for deployment in carrier-grade infrastructure equipment
Burst LengthFixed 4-word burst (linear or interleaved), reducing address bus overhead and simplifying controller design
Byte Write ControlFour independent BW1–BW4 signals, allowing 9-bit sub-word writes without masking logic or extra timing constraints

Pinout & Package

Packaged in a JEDEC-standard 100-pin TQFP (14 mm × 20 mm), lead-free and RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A16Address Inputs17-bit synchronous address bus; latched on rising CLK with ADV/LD low and CEN low
CE1, CE2, CE2Chip EnablesThree-input hierarchical select: CE1/CE2 active-low, CE2 active-high; any false condition forces one-cycle deselect
R/WRead/Write ControlSynchronous signal determining access type at load cycle; ignored during burst (ADV/LD = HIGH)
ADV/LDAddress Load / Burst AdvanceLow = load new external address; High = increment internal burst counter; defines burst boundary
LBOBurst Order SelectStatic input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word sequence per base address
BW1–BW4Byte Write EnablesActive-low 9-bit group controls: BW1→I/O[0:7]+I/OP1, BW2→I/O[8:15]+I/OP2, etc.
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional bus; input path registered, output path flow-through (no output register delay)
CLKSystem Clock InputPrimary timing reference; all synchronous inputs referenced to rising edge; OE is sole asynchronous signal
OEOutput EnableAsynchronous active-low; can be tied low permanently since outputs are otherwise controlled by CE and R/W state

Key Features

FeatureDesign Value
ZBT™ ArchitectureEliminates bus turnaround dead cycles between consecutive reads/writes - critical for full-duplex packet buffer operation
Flow-Through OutputsRemoves output register delay, enabling deterministic 1-cycle data availability after clock edge - simplifies timing closure
4-Word Burst ModeReduces address bus toggling and controller complexity; supports both linear and interleaved sequences for cache-line alignment
Individual Byte WriteEnables precise 9-bit sub-word updates without external byte-enable logic or additional clock cycles
Three Chip EnablesAllows seamless depth expansion across multiple devices using shared CLK/R/W/ADV/LD while maintaining independent select control

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches with real-time forwarding decisions.

IC Role / Device Role / Timing Role: Primary data-path SRAM holding frame headers and payloads; operates at 100 MHz with zero-turnaround bus to sustain line-rate traffic.

Use Value: Eliminates pipeline stalls caused by bus direction switching - increases effective bandwidth by up to 15% vs. conventional SSRAMs.

Use Scenario: Buffering TDM voice channels and control messages in carrier-class DSLAMs and OLTs.

IC Role / Device Role / Timing Role: Synchronous memory interfacing directly with TI TMS320C64x+ DSPs and FPGA-based framer logic.

Use Value: 36-bit width matches common ATM/SONET cell payload size; industrial temp rating ensures reliability in uncooled chassis.

High-Speed Test Equipment FIFOIndustrial PLC Data Logging

Use Scenario: Capturing high-resolution analog waveform samples at >50 MS/s for semiconductor ATE systems.

IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via ZBT™ and burst reads - acts as deep, low-latency capture FIFO.

Use Value: Flow-through outputs deliver sampled data within 10 ns of clock edge, meeting tight jitter budgets for precision measurement.

Use Scenario: Storing sensor history and motion-control trajectory points in ruggedized factory automation controllers.

IC Role / Device Role / Timing Role: Nonvolatile-backed SRAM buffer holding critical runtime data during brownouts or firmware updates.

Use Value: Industrial temperature range and 3.3V single supply simplify power design; byte-write capability enables efficient timestamped logging.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1371DV33-100AXC128K × 36, 3.3V, 100 MHz, but uses QDR-II architecture with separate read/write ports and no ZBT™Requires dual-port controller logic; lacks burst counter and ADV/LD flow - better suited for true concurrent R/W workloadsSelect only if application demands simultaneous read/write access; not drop-in for ZBT™-optimized designs
AS7C3256B-10JIN128K × 32, 3.3V, 100 MHz, standard sync SRAM without ZBT™, burst, or byte-write enablesNo burst mode or zero-turnaround; requires external OE control and full-word writes onlyConsider for cost-sensitive, lower-performance buffering where bus turnaround overhead is acceptable

Compared with CY7C1371DV33-100AXC and AS7C3256B-10JIN, the 71V547S100PFGI uniquely delivers ZBT™-enabled seamless read/write transitions, integrated burst sequencing, and granular byte-write control - making it optimal for high-efficiency packet processing and deterministic real-time buffering.

Availability

71V547S100PFGI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and high-speed test equipment requiring stable component supply and long-term industrial-grade availability.

Supply support for 71V547S100PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a leader in high-performance timing, memory, and interface solutions for communications and computing infrastructure.

The 71V547S100PFGI belongs to IDT's ZBT™ synchronous SRAM product line, engineered specifically for zero-latency bus turnaround in high-speed data-path applications such as routers, switches, and baseband processors.

FAQ

What is the maximum operating frequency of the 71V547S100PFGI?

The 71V547S100PFGI is rated for 100 MHz operation, corresponding to a minimum clock cycle time (tCYC) of 15 ns. This specification is guaranteed across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply, with tCD (clock-to-data) ≤10 ns. The device achieves this performance using a high-volume 3.3V CMOS process and flow-through output architecture.

Does the 71V547S100PFGI support true ZBT™ (Zero Bus Turnaround) functionality?

Yes, the 71V547S100PFGI implements genuine ZBT™ architecture: it eliminates dead cycles between consecutive read and write operations by decoupling bus direction control from OE and using synchronous R/W and ADV/LD signals. This allows immediate back-to-back accesses without bus idle periods - confirmed in functional timing diagrams and truth tables in the official datasheet.

How does burst addressing work on the 71V547S100PFGI?

Burst addressing on the 71V547S100PFGI is controlled by the ADV/LD and LBO pins. When ADV/LD is sampled HIGH on a rising clock edge, the internal 2-bit burst counter increments, generating the next address in sequence. LBO selects linear (LBO = LOW) or interleaved (LBO = HIGH) order for the four-word burst - both sequences wrap automatically after the fourth word.

Can the 71V547S100PFGI operate with OE tied permanently low?

Yes, OE can be tied low continuously because it is the only asynchronous signal and is not required for normal read/write operation. The device uses synchronous chip enables (CE1/CE2/CE2) and R/W to control data bus activity. OE is provided solely for optional asynchronous output disable - e.g., during system reset or bus sharing - and has no effect on internal timing or functionality when asserted.

What is the purpose of the three chip enable pins (CE1, CE2, CE2) on the 71V547S100PFGI?

The three chip enables provide flexible depth expansion: CE1 and CE2 are active-low, while CE2 is active-high. The device is selected only when CE1 = LOW, CE2 = LOW, and CE2 = HIGH. This configuration allows cascading multiple 71V547S100PFGI devices with shared control lines while enabling individual selection - essential for building wider or deeper memory subsystems without external decoding logic.

71V547S100PFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
10 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V547S100PFGI FAQ

1.How can I place an order for 71V547S100PFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V547S100PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V547S100PFGI reliable?

The price and inventory of 71V547S100PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V547S100PFGI is usually 5 days.

3.What payment methods are accepted for 71V547S100PFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V547S100PFGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V547S100PFGI?

71V547S100PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V547S100PFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V547S100PFGI?

For technical support, including 71V547S100PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V547S100PFGI requirements.

6.How does Aetrix verify that 71V547S100PFGI is sourced from the original manufacturer or authorized distributors?

All 71V547S100PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V547S100PFGI meets industry standards.

7.What is the process for return or replacement of 71V547S100PFGI?

All 71V547S100PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V547S100PFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V547S100PFGI part is unused and in its original packaging.

Return procedure for 71V547S100PFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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