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Renesas 71V547S80PFGI8

Part No.:
71V547S80PFGI8
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V547S80PFGI8.pdf
Description:
IC SRAM 4.5MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,037

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Product details

Overview

71V547S80PFGI8 from IDT (now Renesas) is a 3.3V, 128K × 36-bit synchronous SRAM with Zero Bus Turnaround (ZBT™) architecture, flow-through outputs, and 4-word burst capability. It delivers 95 MHz operation (8 ns clock-to-data access), supports linear/interleaved burst ordering via LBO pin, and features three chip enables for depth expansion in high-speed networking and packet buffering applications.

For engineers reviewing the 71V547S80PFGI8 datasheet, 71V547S80PFGI8 pinout, 71V547S80PFGI8 application, or 71V547S80PFGI8 equivalent, key selection criteria include ZBT™ bus turnaround elimination, 3.3V ±5% supply tolerance, industrial temperature range (–40°C to +85°C), JEDEC-standard 100-pin TQFP package, and synchronous control with ADV/LD-driven burst counter.

Technical Context

The 71V547S80PFGI8 implements a synchronous, clock-triggered memory interface where address/control registration occurs on the rising CLK edge when CEN = LOW, ADV/LD = LOW, and chip enables are asserted. Its ZBT™ architecture eliminates dead cycles between read/write transitions by decoupling bus direction control from data timing - writes complete one cycle before reads begin on the same bus.

Burst operation is managed by an on-chip counter advanced synchronously on CLK rising edges when ADV/LD = HIGH; LBO selects linear or interleaved 4-word sequences. Output enable (OE) remains asynchronous, allowing dynamic tri-state control independent of clock phase, while all other inputs - including BW1–BW4 byte write enables and R/W - are fully synchronous with setup/hold timing referenced to CLK.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 128K × 36 bits (4.5 Mbit); supports full-word or individual 9-bit byte writes via BW1–BW4.
Clock Frequency / tCYC Up to 95 MHz (tCYC = 10.5 ns min); defines maximum sustained throughput for burst and random accesses.
Access Time (tCD) 8 ns max clock-to-valid-data; determines minimum latency from CLK rise to stable output for read cycles.
Supply Voltage 3.3 V ±5% (3.135 V to 3.465 V); compatible with standard 3.3V logic families without level translation.
Operating Temperature –40°C to +85°C (industrial grade); validated for embedded telecom, base station, and industrial control environments.
Package JEDEC-standard 100-pin TQFP (14 mm × 20 mm); surface-mount compatible with automated PCB assembly.
Power Consumption IDDD = 260 mA max (industrial, 95 MHz); ISB1 = 45 mA max standby (deselected, outputs open).

Pinout & Package

71V547S80PFGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm lead pitch. Pin 1 identifier is marked with a dot or beveled corner per standard orientation.

Pin/Terminal Circuit Role Design Meaning
A0–A16 Address Inputs 17-bit synchronous address bus; latched on rising CLK when ADV/LD = LOW and chip selected.
CE1, CE2, CE2 Chip Enables Three synchronous enables: CE1/CE2 active-low, CE2 active-high; any false condition deselects device in one cycle.
R/W Read/Write Control Synchronous signal defining access type at load cycle; ignored during burst (ADV/LD = HIGH).
ADV/LD Address Load / Burst Advance LOW loads new external address; HIGH advances internal burst counter - core to ZBT™ burst sequencing.
BW1–BW4 Byte Write Enables Four synchronous active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4).
LBO Burst Order Select Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence per base address.
I/O0–I/O31, I/OP1–I/OP4 Data I/O 36-bit bidirectional bus; input path registered, output path flow-through (no output register, zero hold time).
CLK System Clock Primary timing reference; all synchronous operations triggered on rising edge (except OE, which is asynchronous).
OE Output Enable Asynchronous control: LOW enables outputs, HIGH forces high-impedance - usable for bus sharing without clock alignment.
CEN Clock Enable Synchronous suspend: HIGH blocks CLK propagation, freezing registers and outputs without reset or reinitialization.

Key Features

Feature Design Value
ZBT™ Architecture Eliminates bus turnaround dead cycles between consecutive reads and writes - enables continuous back-to-back memory transactions without wait states.
Flow-Through Outputs No output register; data appears on I/O pins with minimal delay after CLK edge - reduces read latency and simplifies timing closure in high-speed designs.
4-Word Burst Mode Single address initiates four sequential data transfers; LBO pin configures linear or interleaved addressing - optimized for cache-line and packet-buffer access patterns.
Individual Byte Write Control BW1–BW4 allow selective 9-bit writes without masking or read-modify-write - essential for partial updates in protocol header processing and descriptor management.
Three Chip Enables CE1/CE2 (active-low) and CE2 (active-high) support flexible depth expansion across multiple devices with minimal glue logic.

Applications

Packet Buffering in Switch ASICs Network Processor Descriptor Cache

Use Scenario: High-throughput Ethernet switch fabric requiring low-latency, burst-capable memory for ingress/egress packet buffering and queue management.

IC Role / Device Role / Timing Role: Primary ZBT™ SRAM providing 36-bit wide, 95 MHz burst-access storage for packet headers and metadata with zero turnaround overhead.

Use Value: Enables deterministic 4-word burst reads/writes per clock cycle, eliminating bus arbitration delays and supporting line-rate 10G+ switching performance.

Use Scenario: Network processor subsystem managing thousands of concurrent packet descriptors with frequent partial updates and sequential access patterns.

IC Role / Device Role / Timing Role: Synchronous SRAM serving as descriptor cache with individual byte write (BW1–BW4) and flow-through outputs for rapid status flag updates.

Use Value: Reduces descriptor update latency by 30% vs. registered-output SRAMs and avoids read-modify-write cycles via granular 9-bit write enables.

Baseband Digital Signal Processing Industrial PLC Real-Time Data Logging

Use Scenario: LTE/5G baseband unit performing real-time FFT, channel estimation, and symbol mapping with strict timing deadlines and large intermediate buffers.

IC Role / Device Role / Timing Role: High-speed buffer memory interfacing directly to FPGA-based DSP engines using synchronous 3.3V logic and burst-aligned data streams.

Use Value: 8 ns tCD and ZBT™ operation ensure pipeline continuity across multi-stage processing blocks, minimizing stall cycles in critical signal paths.

Use Scenario: Programmable logic controller capturing sensor data at 10 kHz with timestamping, error checking, and non-volatile backup requirements.

IC Role / Device Role / Timing Role: Industrial-grade SRAM acting as high-reliability scratchpad memory for real-time acquisition buffers and firmware parameter tables.

Use Value: –40°C to +85°C rating and 45 mA ISB1 standby current support unattended operation in harsh factory environments with minimal thermal impact.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1355BV33-100AXI 128K × 32-bit, 100 MHz, 3.3V; no ZBT™; uses separate RD/WR pins instead of single R/W. Lacks zero-turnaround capability; requires additional control logic for bus direction management in burst-heavy systems. Select when 32-bit width suffices and ZBT™ is not required; verify timing margins for RD/WR skew in high-frequency layouts.
AS7C3128A-10JIN 128K × 32-bit, 10 ns access, 3.3V; asynchronous interface; no burst counter or ADV/LD functionality. Not synchronous - incompatible with clock-aligned burst protocols; limited to simple random-access use cases. Choose only for legacy designs requiring pin-compatible drop-in replacement of older async SRAMs; not suitable for ZBT™-dependent architectures.

Compared with CY7C1355BV33-100AXI and AS7C3128A-10JIN, the 71V547S80PFGI8 uniquely delivers ZBT™-enabled zero-cycle bus turnaround and integrated burst sequencing - critical for maximizing bandwidth efficiency in packet-processing and DSP pipelines where consecutive read/write alternation is frequent.

Availability

71V547S80PFGI8 is available at Aetrix Electronics and suitable for high-speed networking equipment, industrial automation controllers, and telecom baseband modules requiring stable component supply, long-term lifecycle support, and industrial-temperature reliability.

Supply support for 71V547S80PFGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology), now part of Renesas Electronics, is a semiconductor leader specializing in high-performance timing, memory interface, and RF solutions for communications and computing infrastructure.

The 71V547S80PFGI8 belongs to IDT's ZBT™ SRAM product line, engineered specifically for applications demanding deterministic, low-latency, burst-capable memory with zero bus turnaround - targeting network switches, routers, and baseband processors.

FAQ

What does the 'S80' in 71V547S80PFGI8 indicate?

The 'S80' suffix denotes the speed grade: 8 ns clock-to-data access time (tCD), corresponding to a maximum operating frequency of 95 MHz. This is confirmed in the AC Electrical Characteristics table where 71V547S80 specifies tCD ≤ 8 ns. The 71V547S80PFGI8 meets this timing under industrial conditions (–40°C to +85°C) with VDD = 3.3 V ±5%.

Does 71V547S80PFGI8 support true ZBT™ operation with no dead cycles between read and write?

Yes, the 71V547S80PFGI8 implements genuine Zero Bus Turnaround (ZBT™) architecture. As stated in the datasheet description, it eliminates dead bus cycles when turning the bus around between reads and writes. This is achieved through synchronized control logic and flow-through outputs, enabling back-to-back read/write operations without insertion of idle cycles - a core feature validated across all timing waveforms for the 71V547S80PFGI8.

How is burst addressing controlled on the 71V547S80PFGI8?

Burst addressing on the 71V547S80PFGI8 is controlled by the ADV/LD and LBO pins. When ADV/LD = HIGH on a rising CLK edge, the internal burst counter advances; when ADV/LD = LOW, a new external address is loaded. LBO selects linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word sequences. This dual-signal mechanism is explicitly defined in the Functional Description and Burst Sequence Tables for the 71V547S80PFGI8.

Can OE be tied permanently low on the 71V547S80PFGI8?

Yes, OE can be tied permanently low on the 71V547S80PFGI8. The datasheet states: "In normal operation, OE can be tied low." Since OE is the only asynchronous signal and its sole function is to place outputs in high-impedance state, tying it low ensures continuous output drive - appropriate for dedicated bus implementations where external tri-state control is unnecessary.

What is the valid voltage range for VDD on the 71V547S80PFGI8?

The 71V547S80PFGI8 requires a VDD supply of 3.3 V ±5%, i.e., 3.135 V to 3.465 V, as specified in the Recommended DC Operating Conditions table. This range applies across both commercial (0°C to +70°C) and industrial (–40°C to +85°C) temperature grades. Operation outside this window may cause functional failure or parametric violation.

71V547S80PFGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
4.5Mbit
Memory Organization:
128K x 36
Memory Interface:
Parallel
Clock Frequency:
-
Write Cycle Time - Word, Page:
-
Access Time:
8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V547S80PFGI8 FAQ

1.How can I place an order for 71V547S80PFGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V547S80PFGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V547S80PFGI8 reliable?

The price and inventory of 71V547S80PFGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V547S80PFGI8 is usually 5 days.

3.What payment methods are accepted for 71V547S80PFGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V547S80PFGI8 transactions.

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4.How is shipping managed for 71V547S80PFGI8?

71V547S80PFGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V547S80PFGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V547S80PFGI8?

For technical support, including 71V547S80PFGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V547S80PFGI8 requirements.

6.How does Aetrix verify that 71V547S80PFGI8 is sourced from the original manufacturer or authorized distributors?

All 71V547S80PFGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V547S80PFGI8 meets industry standards.

7.What is the process for return or replacement of 71V547S80PFGI8?

All 71V547S80PFGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V547S80PFGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V547S80PFGI8 part is unused and in its original packaging.

Return procedure for 71V547S80PFGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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