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Renesas 71V632S6PFGI

Part No.:
71V632S6PFGI
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V632S6PFGI.pdf
Description:
IC SRAM 2MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,896

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Product details

Overview

71V632S6PFGI from IDT is a 64K × 32-bit (2 Mbit), 3.3V synchronous SRAM with pipelined outputs, single-cycle deselect, and burst counter logic. It supports 100 MHz operation (5.5 ns clock access), operates across industrial temperature range (–40°C to +85°C), and features LBO-controlled interleaved/linear burst mode for Pentium™ and PowerPC™ processor cache interfaces.

For engineers reviewing the 71V632S6PFGI datasheet, 71V632S6PFGI pinout, 71V632S6PFGI application, or 71V632S6PFGI equivalent, this page delivers verified timing parameters, JEDEC-standard TQFP-100 package mapping, burst sequence behavior, power-down control via ZZ, and byte-write enable functionality - all critical for secondary cache design in legacy high-speed embedded systems.

Technical Context

The 71V632S6PFGI implements a synchronous, pipelined read architecture where the first output data appears one clock cycle after address presentation, enabling 3-1-1-1 burst performance. Its internal burst counter advances A0/A1 automatically based on LBO state, supporting both linear and interleaved addressing sequences without external logic.

Write operations are self-timed using global write (GW), byte write enable (BWE), and four independent byte write controls (BW1–BW4). The device integrates dedicated address, data, and control registers, with CE/CS0/CS1 chip select hierarchy and ADSP/ADSC dual address strobe support for flexible bus interfacing.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 64K × 32-bit (2,097,152 bits); enables 4-word burst transfers per address cycle
Clock Access Time 5.5 ns at 100 MHz - defines minimum clock period for full-speed operation
Supply Voltage 3.3 V ±5% - requires tight regulation; VDDQ separate for I/O to reduce noise coupling
Burst Mode Control LBO input selects linear (LBO = GND) or interleaved (LBO = VDD) address sequencing
Power-Down Entry ZZ = HIGH places device in low-power sleep mode; exit requires deselection then reselection
Package JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow profiles
Temperature Range Industrial: –40°C to +85°C - validated for extended thermal cycling in embedded computing

Pinout & Package

71V632S6PFGI is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm lead pitch. Pin 1 is located at top-left corner (marked by dot or bevel), and pin numbering proceeds counterclockwise.

Pin/Terminal Circuit Role Design Meaning
A0–A15 Address Inputs 16-bit address bus; A0/A1 advanced internally during burst; A2–A15 latched on ADSP/ADSC
I/O0–I/O31 Bi-directional Data Bus 32-bit parallel interface; supports simultaneous read/write with OE/GW/BWE control
CLK Master Clock Input Synchronizes all register updates; rising-edge triggered; tCH/tCL define setup/hold windows
CE, CS0, CS1 Chip Select Inputs Three-level decode: CE active-low enables chip; CS0/CS1 provide hierarchical selection
ADSP / ADSC Address Strobe Inputs ADSP initiates burst; ADSC enables non-burst access; functionally interchangeable for reads
GW / BWE / BW1–BW4 Write Control Inputs GW enables global write; BWE enables byte writes; BW1–BW4 mask individual 8-bit lanes
OE Output Enable Asynchronous control; drives outputs to high-Z when LOW, regardless of clock state
ZZ Power-Down Control Active-HIGH entry to standby mode; reduces ICC to ≤10 µA; requires re-deselection on wake
LBO Burst Mode Selector Static input defining burst address order: linear (VSS) or interleaved (VDD)
VDD / VDDQ / VSS / VSSQ Power & Ground VDD (core), VDDQ (I/O), VSS (core ground), VSSQ (I/O ground); separate planes required

Key Features

Feature Design Value
Pipelined Burst Read Delivers first data on second CLK edge, then three more words on successive edges - eliminates wait states in cache line fills
Single-Cycle Deselect Device exits active state within one clock cycle after CE/CS deassertion - enables rapid bus arbitration
Self-Timed Write Cycle Internal timing logic resolves write completion without external delay control - simplifies system timing closure
Byte-Selectable Write Four independent 8-bit write masks (BW1–BW4) allow partial-word updates without read-modify-write overhead
Low-Power Sleep Mode ZZ-driven power-down reduces ICC to 10 µA max - extends uptime in battery-backed or thermally constrained systems

Applications

Desktop CPU Cache Industrial PLC Memory Buffer

Use Scenario: Secondary cache for Intel Pentium-class processors in legacy desktop motherboards.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM providing 4-word burst reads aligned to processor bus cycles.

Use Value: Enables 3-1-1-1 burst timing matching Pentium's cache refill requirements, reducing average memory access latency by >40% vs. non-burst alternatives.

Use Scenario: Real-time data buffering in programmable logic controllers handling deterministic I/O scanning.

IC Role / Device Role / Timing Role: Synchronous memory staging buffer between FPGA-based logic and fieldbus interface ASICs.

Use Value: Single-cycle deselect and pipelined outputs ensure predictable 100 MHz timing margins under variable scan cycle loads.

Network Router Packet Buffer Medical Imaging Frame Store

Use Scenario: Temporary packet storage in legacy enterprise routers with PowerPC-based control planes.

IC Role / Device Role / Timing Role: Burst-capable SRAM interfacing directly to PowerPC 603/604 local bus for zero-wait-state DMA transfers.

Use Value: Interleaved burst mode (LBO = VDD) matches PowerPC's cache line ordering, eliminating software address remapping.

Use Scenario: Frame buffer in ultrasound or X-ray imaging systems requiring deterministic pixel data streaming.

IC Role / Device Role / Timing Role: Synchronous memory holding full-resolution image frames prior to DSP processing or display output.

Use Value: 3.3V operation and industrial temp rating ensure stable frame capture in fanless enclosures with ambient swings up to 85°C.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-100AXC 64K × 32, 3.3V, 100 MHz, but uses QCC-100 package and lacks LBO-controlled burst mode Requires external burst counter logic; not drop-in for Pentium/PowerPC cache interfaces Choose only if board layout allows QCC-100 footprint and burst control is implemented externally
AS7C32099B-10JCN 64K × 32, 3.3V, 100 MHz, TQFP-100, but asynchronous read and no pipelining or burst counter Cannot deliver 3-1-1-1 timing; unsuitable for processor cache; limited to simple buffer use cases Select only for non-critical buffering where clock-aligned burst performance is unnecessary

Compared with CY7C1371DV33-100AXC and AS7C32099B-10JCN, the 71V632S6PFGI uniquely integrates pipelined burst logic and LBO-selectable addressing - making it irreplaceable for legacy Pentium/PowerPC secondary cache designs without redesigning timing control logic.

Availability

71V632S6PFGI is available at Aetrix Electronics and suitable for desktop motherboard repair, industrial PLC refurbishment, and legacy network equipment maintenance requiring stable component supply and long-term obsolescence mitigation.

Supply support for 71V632S6PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

IDT (Integrated Device Technology) was a fabless semiconductor company specializing in timing, memory interface, and RF solutions before its acquisition by Renesas in 2019.

The 71V632S6PFGI belongs to IDT's high-speed synchronous SRAM product line, designed specifically to meet the burst-access and pipelining requirements of 1990s-era x86 and PowerPC microprocessors.

FAQ

What is the maximum operating frequency supported by the 71V632S6PFGI?

The 71V632S6PFGI supports up to 100 MHz operation, corresponding to a 5.5 ns clock access time. This speed grade is validated across the full industrial temperature range (–40°C to +85°C) and requires strict adherence to setup/hold timing on CLK, ADSP, and address inputs. Operation above 100 MHz is not guaranteed and may result in data corruption or timing violations.

Does the 71V632S6PFGI support true pipelined burst reads, and how does it differ from standard burst SRAMs?

Yes, the 71V632S6PFGI implements true pipelined burst reads: the first output appears on the second rising CLK edge after address presentation, followed by three more words on successive edges - achieving 3-1-1-1 timing. Unlike non-pipelined burst SRAMs, this eliminates pipeline stalls during cache line fills and aligns precisely with Pentium and PowerPC processor bus protocols.

How is burst address sequencing controlled on the 71V632S6PFGI, and what happens if the LBO pin is left unconnected?

Burst address sequencing is controlled by the LBO pin: tied to VSS for linear mode (00→01→10→11), or to VDD for interleaved mode (00→10→01→11). If left unconnected, LBO is internally pulled to VDD, defaulting to interleaved burst mode. This behavior is documented in the datasheet note on pin definitions and must be accounted for in PCB layout.

Can the 71V632S6PFGI be used in power-sensitive applications, and what is its standby current?

Yes, the 71V632S6PFGI supports low-power operation via the ZZ pin: asserting ZZ = HIGH places the device in sleep mode with typical ICC of 5 µA and maximum of 10 µA. Wake-up requires full deselection (CE/CS high) followed by reselection - no additional reset sequence is needed. This makes it suitable for battery-backed or thermally constrained industrial systems.

Is the 71V632S6PFGI pin-compatible with other members of the IDT 71V6xx family, such as the 71V656 or 71V676?

No, the 71V632S6PFGI is not pin-compatible with the 71V656 (64K × 16) or 71V676 (128K × 32), despite shared package and functional overlap. Differences in address width (A0–A15 vs. A0–A16), data bus width (32-bit vs. 16-bit), and control signal assignments prevent direct substitution. Each variant requires unique PCB layout and firmware configuration.

71V632S6PFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR
Memory Size:
2Mbit
Memory Organization:
64K x 32
Memory Interface:
Parallel
Clock Frequency:
83 MHz
Write Cycle Time - Word, Page:
-
Access Time:
6 ns
Voltage - Supply:
3.135V ~ 3.63V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V632S6PFGI FAQ

1.How can I place an order for 71V632S6PFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V632S6PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V632S6PFGI reliable?

The price and inventory of 71V632S6PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V632S6PFGI is usually 5 days.

3.What payment methods are accepted for 71V632S6PFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V632S6PFGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V632S6PFGI?

71V632S6PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V632S6PFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V632S6PFGI?

For technical support, including 71V632S6PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V632S6PFGI requirements.

6.How does Aetrix verify that 71V632S6PFGI is sourced from the original manufacturer or authorized distributors?

All 71V632S6PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V632S6PFGI meets industry standards.

7.What is the process for return or replacement of 71V632S6PFGI?

All 71V632S6PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V632S6PFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V632S6PFGI part is unused and in its original packaging.

Return procedure for 71V632S6PFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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