Renesas 71V65603S100BG
- Part No.:
- 71V65603S100BG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65603S100BG.pdf
- Description:
- IC SRAM 9MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65603S100BG from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit organization (9,437,184 bits), 150 MHz maximum clock frequency, 3.8 ns clock-to-data access time, and zero bus turnaround (ZBT) architecture enabling immediate read-after-write transitions without dead cycles. It operates across industrial temperature range (–40°C to +85°C) and is used in high-speed packet buffering, network switch fabric control, and real-time DSP memory subsystems.
For engineers reviewing the 71V65603S100BG datasheet, 71V65603S100BG pinout, 71V65603S100BG application, or 71V65603S100BG equivalent, key selection criteria include its pipelined synchronous interface, 4-word burst capability (linear/interleaved), individual byte write enables (BW1–BW4), three-chip-enable depth expansion support, and JEDEC-standard 100-pin TQFP package with 14 mm × 20 mm footprint.
Technical Context
The 71V65603S100BG implements a fully pipelined synchronous architecture where address/control signals are registered on the rising edge of CLK, and data transfers occur two cycles later. Its ZBT™ feature eliminates bus turnaround latency by allowing consecutive reads and writes without idle cycles, enabled by internal burst counter and ADV/LD-controlled address loading or incrementing.
It supports dual-mode burst sequencing via static LBO input (linear or interleaved), asynchronous OE for output tri-state control, and ZZ input for low-power sleep mode. All synchronous inputs-including R/W, CEN, CE1/CE2/CE2, BWx, and ADV/LD-meet setup/hold timing relative to CLK, while OE and ZZ operate asynchronously.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports high-bandwidth parallel data paths in telecom and networking ASIC interfaces. |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for sustained burst throughput in pipeline-critical systems. |
| Clock-to-Data Access | 3.8 ns typical; guarantees deterministic read latency for real-time control loop timing budgets. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); decoupled power domains simplify noise isolation in mixed-signal designs. |
| Operating Temperature | –40°C to +85°C industrial grade; qualified for deployment in base station equipment and industrial automation controllers. |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic and improves effective bandwidth in sequential access patterns. |
| Byte Write Control | Four independent active-low BW1–BW4 pins; enables precise 9-bit subword writes without masking logic or extra glue logic. |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch, lead-free and RoHS-compliant. Pin 1 marked via corner notch or dot; top-side marking includes "71V65603S100BG" and date code.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled. |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous operations referenced to this edge. |
| R/W | Read/Write Control | Synchronous signal defining load-cycle operation type; determines whether data transfer two cycles later is read or write. |
| ADV/LD | Burst Address Control | Loads new external address (LOW) or advances internal burst counter (HIGH); enables seamless burst chaining. |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence; no runtime switching required. |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit I/O bytes; allows partial-word writes without bus contention. |
| CE1, CE2, CE2 | Chip Enables | Three-input enable logic: CE1 = LOW, CE2 = LOW, CE2 = HIGH selects device; supports depth expansion with minimal decode logic. |
| OE | Output Enable | Asynchronous, active-low; tri-states outputs independently of clock-enables shared-bus arbitration without timing constraints. |
| ZZ | Sleep Mode Input | Asynchronous, active-high; gates internal clock and reduces power to minimum retention level; data integrity maintained. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered inputs/outputs eliminate external latch requirements. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between read/write transitions-enables continuous 150 MHz burst streaming without inter-cycle gaps. |
| Internally Synchronized OE | Removes need for external OE timing control; outputs remain valid or tri-state deterministically without clock-phase alignment. |
| 4-Word Pipelined Burst | Single address initiates four consecutive data transfers; reduces address bus overhead by 75% in sequential access scenarios. |
| Individual Byte Write (BW1–BW4) | Enables 9-bit granularity writes without external byte-lane gating-reduces PCB layer count and routing complexity. |
| Three-Chip-Enable Architecture | Supports seamless depth expansion using CE1/CE2/CE2 logic-no additional address decoding needed for multi-SRAM banks. |
| Industrial Temperature Range | Qualified from –40°C to +85°C with full AC/DC specs-meets reliability requirements for outdoor telecom and factory-floor equipment. |
Applications
| Network Packet Buffering | Switch Fabric Control Memory |
|---|---|
|
Use Scenario: Storing ingress/egress packet headers and metadata in Layer 2/L3 switches with line-rate forwarding. IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly with MAC and switching ASICs via parallel synchronous bus. Use Value: 3.8 ns clock-to-data access and ZBT™ architecture ensure zero-cycle turnaround between header read and payload write-maximizing switch throughput. |
Use Scenario: Holding forwarding table entries, queue management descriptors, and priority scheduling state in modular chassis switches. IC Role / Device Role / Timing Role: Dedicated control-plane SRAM providing deterministic access for real-time traffic shaping and congestion management logic. Use Value: 4-word burst mode accelerates table walk operations; industrial temp rating ensures stable operation in fanless chassis environments. |
| DSP Algorithm Data Cache | Real-Time Industrial Controller Memory |
|
Use Scenario: Serving as on-chip cache extension for fixed-point DSPs executing FFT, filtering, or motor control algorithms. IC Role / Device Role / Timing Role: Low-latency, pipelined memory co-processor synchronized to DSP's system clock domain. Use Value: 150 MHz operation matches high-MIPS DSP clocks; byte-write enables efficient coefficient updates without full-word overwrites. |
Use Scenario: Storing PLC scan-cycle variables, I/O image tables, and motion trajectory buffers in CNC and robotics controllers. IC Role / Device Role / Timing Role: Deterministic-access working memory interfaced to microcontroller or FPGA-based control engine. Use Value: –40°C to +85°C qualification and robust 3.3V supply tolerance ensure uninterrupted operation in unconditioned factory environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 36-bit, 133 MHz max, 4.5 ns tCD; uses different burst control (MODE pin vs. LBO) and lacks ZZ sleep mode. | Compatible in non-sleep, lower-frequency designs; requires redesign of burst sequencing logic and power management. | Select when cost sensitivity outweighs need for 150 MHz speed or deep-sleep power savings. |
| AS7C33128PFS-15BIN | 256K × 36-bit, 150 MHz, but only supports linear burst; no interleaved mode, no individual byte write-uses global WE#. | Suitable for simpler burst patterns; incompatible with designs requiring interleaved addressing or partial-word writes. | Choose only if application uses exclusively linear bursts and does not require per-byte write granularity. |
Compared with CY7C1362BV33-133AXC and AS7C33128PFS-15BIN, the 71V65603S100BG delivers superior timing headroom (3.8 ns vs. ≥4.5 ns), flexible burst sequencing (LBO-selectable), and hardware sleep mode-making it optimal for latency-constrained, power-aware, and protocol-diverse systems.
Availability
71V65603S100BG is available at Aetrix Electronics and suitable for network packet buffering, switch fabric control memory, and real-time industrial controller memory requiring stable component supply, long-term lifecycle support, and guaranteed industrial-grade performance.
Supply support for 71V65603S100BG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65603S100BG belongs to Renesas' high-speed ZBT™ SRAM product line, engineered specifically for zero-latency, burst-capable memory subsystems in networking, telecom, and real-time embedded systems.
FAQ
What is the memory organization and total capacity of the 71V65603S100BG?
The 71V65603S100BG is configured as 256K × 36-bit, delivering a total capacity of 9,437,184 bits (9.4 Mbit). This organization provides a 36-bit wide data bus ideal for applications requiring high-throughput parallel access, such as network ASIC interfacing and DSP co-processing. The part does not support 512K × 18-bit configuration-only the 256K × 36-bit variant is implemented in the 71V65603S100BG.
Does the 71V65603S100BG support both linear and interleaved burst modes?
Yes, the 71V65603S100BG supports both linear and interleaved 4-word burst sequences via the static LBO (Linear/Interleaved Burst Order) input pin. When LBO = LOW, the burst follows linear order (A0, A0+1, A0+2, A0+3); when LBO = HIGH, it follows interleaved order (A0, A0+2, A0+1, A0+3). This flexibility allows optimization for specific memory access patterns in switch fabric or cache controller designs.
What is the function of the ADV/LD pin on the 71V65603S100BG?
The ADV/LD pin on the 71V65603S100BG serves a dual role: when sampled LOW at the rising CLK edge, it loads a new external address into the internal register; when sampled HIGH, it advances the internal burst counter. This enables seamless transition between single-address load cycles and multi-cycle burst operations-critical for maintaining continuous data flow in high-speed packet processing applications.
How does the ZBTTM feature improve system performance in the 71V65603S100BG?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S100BG eliminates idle cycles between consecutive read and write operations. Unlike conventional SRAMs that require bus turnaround time, the 71V65603S100BG allows immediate back-to-back read-after-write or write-after-read transitions-directly increasing effective bandwidth and reducing latency in burst-intensive applications like network switch buffers and real-time control loops.
Can the 71V65603S100BG operate in low-power mode, and how is it controlled?
Yes, the 71V65603S100BG supports low-power sleep mode via the asynchronous ZZ input pin. When ZZ is driven HIGH, the internal clock is gated and the device enters its lowest power consumption state while retaining stored data. Power resumes automatically upon ZZ returning LOW, with no initialization delay-making it suitable for energy-conscious systems with intermittent activity patterns.
71V65603S100BG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65603S100BG FAQ
1.How can I place an order for 71V65603S100BG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S100BG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S100BG reliable?
The price and inventory of 71V65603S100BG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100BG is usually 5 days.
3.What payment methods are accepted for 71V65603S100BG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S100BG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65603S100BG?
71V65603S100BG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65603S100BG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S100BG?
For technical support, including 71V65603S100BG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100BG requirements.
6.How does Aetrix verify that 71V65603S100BG is sourced from the original manufacturer or authorized distributors?
All 71V65603S100BG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100BG meets industry standards.
7.What is the process for return or replacement of 71V65603S100BG?
All 71V65603S100BG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100BG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S100BG part is unused and in its original packaging.
Return procedure for 71V65603S100BG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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