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Renesas 71V65603S100BGI

Part No.:
71V65603S100BGI
Manufacturer:
Renesas
Category:
Memory
Package:
119-BGA
Datasheet:
Aetrix71V65603S100BGI.pdf
Description:
IC SRAM 9MBIT PAR 119PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,886

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Product details

Overview

71V65603S100BGI from Renesas Electronics is a 9,437,184-bit (256K × 36) 3.3V synchronous ZBT™ SRAM with zero bus turnaround, 150MHz operation (3.8ns clock-to-data access), pipelined outputs, and 4-word burst capability. It features synchronous address/control/data registers, individual byte write (BW1–BW4), three chip enables (CE1/CE2/CE2), and operates across –40°C to +85°C for industrial applications in high-speed networking and packet buffering.

For engineers reviewing the 71V65603S100BGI datasheet, 71V65603S100BGI pinout, 71V65603S100BGI application, or 71V65603S100BGI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst sequence control via LBO, and industrial temperature support without derating.

Technical Context

The 71V65603S100BGI implements a fully synchronous, pipelined architecture where address and control signals are registered on the rising CLK edge, with data output valid two cycles later. Its ZBT™ feature eliminates dead cycles between read/write transitions by internally synchronizing OE and supporting burst counter advancement via ADV/LD.

It supports linear or interleaved 4-word bursts selected by static LBO input, uses three chip enables (CE1/CE2 active-low, CE2 active-high) for depth expansion, and includes asynchronous ZZ sleep mode and OE for output control - all while maintaining strict 3.3V ±5% VDD/VDDQ compliance and industrial-grade thermal stability.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9,437,184 bits); supports high-bandwidth parallel data paths in telecom and switching ASICs.
Max Clock Frequency150 MHz; enables 6.67 ns cycle time for real-time packet buffer access in line-rate systems.
Clock-to-Data Access3.8 ns typical; guarantees deterministic latency for time-critical memory reads in pipeline-synchronized logic.
Supply VoltageVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; requires dual regulated 3.3V rails with no sequencing dependency.
Operating Temperature–40°C to +85°C; qualified for industrial environments including base station equipment and industrial controllers.
Burst Capability4-word linear or interleaved burst; reduces address bus overhead and improves throughput in sequential access patterns.
Zero Bus TurnaroundZBT™ architecture eliminates idle cycles between read/write transitions; sustains continuous bus utilization in full-duplex traffic buffers.

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm footprint, with 0.5 mm pitch and exposed pad not present. Pinout validated per PKG100 configuration for 256K × 36 variant.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled.
CLKClock InputRising-edge-triggered master clock; all synchronous timing referenced to this signal; OE is the only asynchronous input.
R/WRead/Write ControlSynchronous command signal determining load-cycle operation type; sampled with ADV/LD to initiate read or write.
ADV/LDBurst Address ControlLoads new external address (LOW) or advances internal burst counter (HIGH); defines burst initiation and continuation behavior.
LBOBurst Order SelectStatic input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence; must remain stable during operation.
CE1, CE2, CE2Chip EnablesThree independent enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion and partial deselection with 2-cycle tri-state delay.
BW1–BW4Byte Write EnablesFour active-low synchronous controls for 9-bit bytes; allow granular 36-bit word writes without masking logic.
I/O0–I/O31, I/OP1–I/OP4Data I/O36-bit bidirectional synchronous data bus; registered inputs/outputs aligned to CLK rising edge; supports burst read/write transfers.
ZZSleep ModeAsynchronous input gating internal CLK; reduces power to minimum retention level while preserving data integrity.

Key Features

FeatureDesign Value
ZBTTM Zero Bus TurnaroundEliminates dead cycles between consecutive read/write operations, enabling sustained 100% bus utilization in burst-intensive applications.
Internally Synchronized OERemoves need for external OE timing control; outputs automatically tri-state after deselect or write completion without external coordination.
4-Word Pipelined BurstDelivers four sequential data words per single address load, reducing address bus traffic and improving effective bandwidth by up to 4×.
Three Independent Chip EnablesSupports seamless depth expansion across multiple devices using mixed polarity enables (CE1/CE2 low, CE2 high) without additional logic.
Individual Byte Write ControlEnables selective 9-bit byte updates within a 36-bit word, eliminating read-modify-write cycles and reducing power in partial-write scenarios.

Applications

High-Speed Packet BufferingTelecom Line Card Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with minimal latency jitter.

IC Role / Device Role / Timing Role: Primary synchronous buffer memory interfacing directly with MAC and switch fabric controllers via parallel 36-bit bus.

Use Value: ZBT™ architecture ensures zero-gap transitions between packet ingress (write) and egress (read), sustaining line-rate throughput at 10 Gbps+.

Use Scenario: Serving as frame buffer in OC-192/STM-64 SONET/SDH line cards requiring deterministic access and burst efficiency.

IC Role / Device Role / Timing Role: High-reliability, industrial-temperature SRAM providing burst-aligned payload storage for framer and mapper ICs.

Use Value: 150 MHz clock rate and 3.8 ns tCD guarantee sub-7 ns read latency, meeting SONET jitter budgets under full load.

Network Processor Co-Processor MemoryIndustrial Real-Time Controller Cache

Use Scenario: Offloading packet classification and lookup table storage from network processors in DPI and firewall appliances.

IC Role / Device Role / Timing Role: External high-speed scratchpad memory mapped into NPU address space for TCAM-assisted rule matching.

Use Value: 4-word burst mode accelerates sequential rule table scans, improving pattern-matching throughput by >3× vs. non-burst SRAMs.

Use Scenario: Storing motion control trajectory data and I/O state snapshots in CNC and PLC systems operating in harsh factory environments.

IC Role / Device Role / Timing Role: Deterministic-access local memory for real-time motion sequencers requiring guaranteed worst-case access timing.

Use Value: –40°C to +85°C rating and 3.3V tolerance ensure reliable operation without thermal derating in uncontrolled enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133BZI256K × 36, 133 MHz max, 4.5 ns tCD, 100-pin TQFP, Cypress (now Infineon)Lower speed grade; lacks ZBT™ zero-turnaround; uses standard synchronous protocol without burst counterSelect when ZBT™ timing is not required and system clock is ≤133 MHz; verify OE timing constraints differ.
AS7C3256A-15JCIN256K × 36, 150 MHz, 3.8 ns tCD, 100-pin TQFP, Alliance MemoryDrop-in pin-compatible but non-ZBT™; no ADV/LD or LBO pins; uses conventional burst mode with fixed sequenceUse for cost-sensitive replacements where ZBT™ bus efficiency is secondary to basic timing compliance.

Compared with CY7C1362BV33-133BZI and AS7C3256A-15JCIN, the 71V65603S100BGI uniquely delivers true zero bus turnaround and programmable burst order - critical for maximizing throughput in full-duplex packet buffers where read/write alternation is frequent and deterministic.

Availability

71V65603S100BGI is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, network processor co-processor memory, and industrial real-time controller cache requiring stable component supply across extended temperature ranges.

Supply support for 71V65603S100BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65603S100BGI belongs to Renesas' high-performance ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in telecom, networking, and real-time embedded systems demanding deterministic memory access.

FAQ

What is the memory organization and total capacity of the 71V65603S100BGI?

The 71V65603S100BGI is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9 Megabits). This configuration provides a 36-bit wide data bus optimized for high-throughput parallel interfaces in networking and telecom applications, and is distinct from the 512K × 18 variant offered in the same family.

Does the 71V65603S100BGI support burst read and write operations, and how is burst order controlled?

Yes, the 71V65603S100BGI supports 4-word synchronous burst operations for both reads and writes. Burst order is selected via the static LBO pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The burst counter advances on each rising CLK edge when ADV/LD = HIGH.

What are the voltage and temperature specifications for the 71V65603S100BGI?

The 71V65603S100BGI requires VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. It is rated for industrial temperature operation from –40°C to +85°C, with data retention guaranteed in sleep mode (ZZ = HIGH) across this full range.

How does the ZBTTM feature eliminate dead cycles in the 71V65603S100BGI?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S100BGI removes idle bus cycles between alternating read and write operations by internally synchronizing output enable and using pipelined registers. This allows immediate transition from write-to-read or read-to-write without wait states, sustaining continuous 100% bus utilization in burst-intensive traffic buffers.

What package type and pin count does the 71V65603S100BGI use, and is it RoHS-compliant?

The 71V65603S100BGI uses a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP) with 14 mm × 20 mm body size and 0.5 mm lead pitch. Per Renesas documentation, the "BGI" suffix denotes industrial temperature grade and green (RoHS-compliant, halogen-free) packaging per J-STD-609.

71V65603S100BGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
119-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
119-PBGA (14x22)

71V65603S100BGI FAQ

1.How can I place an order for 71V65603S100BGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65603S100BGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65603S100BGI reliable?

The price and inventory of 71V65603S100BGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100BGI is usually 5 days.

3.What payment methods are accepted for 71V65603S100BGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S100BGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65603S100BGI?

71V65603S100BGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65603S100BGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65603S100BGI?

For technical support, including 71V65603S100BGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100BGI requirements.

6.How does Aetrix verify that 71V65603S100BGI is sourced from the original manufacturer or authorized distributors?

All 71V65603S100BGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100BGI meets industry standards.

7.What is the process for return or replacement of 71V65603S100BGI?

All 71V65603S100BGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100BGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65603S100BGI part is unused and in its original packaging.

Return procedure for 71V65603S100BGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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