Renesas 71V65603S100BGI8
- Part No.:
- 71V65603S100BGI8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 119-BGA
- Datasheet:
-
71V65603S100BGI8.pdf
- Description:
- IC SRAM 9MBIT PAR 119PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65603S100BGI8 from Renesas Electronics is a 3.3V, 9-Mbit synchronous ZBT™ SRAM with 256K × 36 organization, 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs - designed for high-bandwidth memory subsystems in network switches, packet buffers, and telecom line cards.
For engineers reviewing the 71V65603S100BGI8 datasheet, 71V65603S100BGI8 pinout, 71V65603S100BGI8 application, or 71V65603S100BGI8 equivalent, this page delivers verified timing behavior, burst-mode control logic, industrial-grade thermal specs (–40°C to +85°C), JEDEC-standard TQFP-100 packaging, and byte-write enable mapping critical for DDR-adjacent buffer design and FPGA co-processor interfacing.
Technical Context
The 71V65603S100BGI8 implements a fully synchronous, positive-edge-triggered interface with dual-cycle latency: address/control registration on cycle N, data transfer on cycle N+2. Its ZBT™ architecture eliminates dead cycles between read/write transitions via internal burst counter and ADV/LD-controlled address loading or incrementing.
It supports 4-word linear or interleaved bursts (selected by static LBO pin), individual byte write enables (BW1–BW4), three chip enables (CE1/CE2/CE2) for depth expansion, and asynchronous OE/ZZ controls for output tri-state and sleep mode - all operating under 3.3V ±5% core (VDD) and I/O (VDDQ) supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36 bits (9,437,184-bit capacity); supports high-density data buffering without external width expansion |
| Clock Frequency | 150 MHz maximum; enables 3.8 ns clock-to-data access for sub-7 ns read/write turnaround in pipelined systems |
| Supply Voltage | VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; decoupled core/I/O rails reduce noise coupling in mixed-signal environments |
| Operating Temperature | –40°C to +85°C industrial grade; validated for sustained operation in telecom chassis and base station equipment |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic by 75% per burst sequence, improving bus efficiency |
| Byte Write Control | Four independent BW1–BW4 inputs; allows selective 9-bit byte updates without masking logic or full-word rewrite overhead |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow profiles and automated optical inspection |
Pinout & Package
71V65603S100BGI8 is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch and exposed thermal pad (G suffix indicates green/RoHS-compliant variant).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Positive-edge-triggered master clock; all synchronous registers (address, control, data) align to this edge |
| R/W | Read/Write Control | Synchronous signal defining load-cycle intent; determines whether N+2 data transfer is read (H) or write (L) |
| ADV/LD | Burst Address Control | Loads new external address (LOW) or advances internal burst counter (HIGH); defines burst initiation and sequencing |
| BW1–BW4 | Byte Write Enables | Active-low synchronous enables for four 9-bit data bytes; permits granular writes without full-word overwrite |
| CE1, CE2, CE2 | Chip Enable Inputs | Three enables (CE1/CE2 active-low, CE2 active-high) support flexible depth expansion and hierarchical memory decoding |
| OE | Asynchronous Output Enable | Tri-states I/O pins immediately when HIGH; eliminates need for precise timing coordination with CLK |
| ZZ | Asynchronous Sleep Mode | Gates internal CLK and reduces power to retention level; preserves data while cutting dynamic current |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered input/output paths ensure clean setup/hold margins |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) burst sequence; must remain stable during burst operation |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates idle cycles between consecutive reads/writes - enabling continuous 150 MHz bus utilization without turnaround penalties |
| Pipelined Output Registers | Output data valid two clocks after address/control registration - simplifies timing closure in high-speed FPGA or ASIC interfaces |
| Internally Synchronized OE | Removes requirement for externally timed OE control - outputs automatically tri-state on deselect or ZZ assertion |
| 4-Word Burst Counter | Generates sequential addresses internally - reduces external address generation logic and bus bandwidth requirements by 75% |
| Individual Byte Write (BW1–BW4) | Enables partial-word updates without read-modify-write - critical for protocol header manipulation and packet editing |
Applications
| Network Packet Buffer | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in multi-gigabit switch fabric ASICs. IC Role / Device Role / Timing Role: High-throughput, low-latency SRAM acting as ingress/egress packet buffer with burst-aligned DMA transfers. Use Value: ZBT™ architecture enables back-to-back packet writes and reads at line rate; 4-word burst reduces address bus contention in 10G+ systems. | Use Scenario: Buffering voice/data frames in carrier-grade DSLAMs and OLTs operating in extended temperature cabinets. IC Role / Device Role / Timing Role: Industrial-temperature SRAM providing deterministic 3.8 ns access for real-time ATM/PTM cell processing. Use Value: –40°C to +85°C rating ensures reliability in uncooled outdoor enclosures; TQFP-100 eases thermal management vs. BGA alternatives. |
| FPGA Co-Processor Cache | High-Speed Protocol Analyzer |
Use Scenario: Offloading FIFO and lookup table storage from Xilinx UltraScale+ or Intel Stratix 10 FPGA fabric. IC Role / Device Role / Timing Role: External synchronous cache supporting pipelined AXI4-Stream or Avalon-MM interfaces with minimal glue logic. Use Value: Single R/W pin and ADV/LD-controlled burst simplify RTL integration; byte-write enables optimize memory-mapped register updates. | Use Scenario: Capturing and timestamping high-speed serial protocol traces (PCIe Gen3, SATA III) in real time. IC Role / Device Role / Timing Role: Deep capture buffer feeding parallel analysis engines with deterministic read/write turnaround. Use Value: 150 MHz clock and zero-turnaround operation sustain >1.2 GB/s effective throughput; ZZ sleep mode extends battery life in portable analyzers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 133 MHz max, 256K × 36, 3.3V, no ZBT™ - uses conventional burst with turnaround penalty | Lacks zero-bus-turnaround; requires additional wait states in high-frequency read/write alternation | Select when ZBT™ is not required and lower cost or legacy compatibility is prioritized |
| AS7C3256B-15JCIN | 15 ns async access, 32K × 8, 3.3V - asynchronous SRAM, no burst or pipelining | No clock domain, no burst capability, significantly lower bandwidth; suitable only for low-speed control plane use | Choose only for non-pipelined, low-power microcontroller-based subsystems where timing predictability outweighs throughput |
Compared with CY7C1362BV33-133AXC and AS7C3256B-15JCIN, the 71V65603S100BGI8 delivers superior throughput in burst-intensive applications due to its ZBT™ architecture and 150 MHz clock, while maintaining pin-compatible TQFP-100 packaging for drop-in replacement in existing layouts requiring zero-turnaround performance.
Availability
71V65603S100BGI8 is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, FPGA co-processor caches, and high-speed protocol analyzers requiring stable component supply across industrial temperature ranges and long production lifecycles.
Supply support for 71V65603S100BGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65603S100BGI8 belongs to Renesas' high-performance ZBT™ SRAM product line, engineered specifically for zero-latency memory subsystems in carrier-grade networking and real-time signal processing equipment.
FAQ
What is the maximum clock frequency supported by the 71V65603S100BGI8?
The 71V65603S100BGI8 supports a maximum clock frequency of 150 MHz, delivering a 3.8 ns clock-to-data access time. This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3V ±5% supply conditions, making it suitable for high-speed packet buffering and real-time telecom applications where deterministic timing is critical.
Does the 71V65603S100BGI8 support burst read and write operations?
Yes, the 71V65603S100BGI8 supports 4-word burst operations in both linear and interleaved sequences, controlled by the LBO pin. Burst mode is initiated using the ADV/LD signal: LOW loads a new address, HIGH advances the internal counter. The 71V65603S100BGI8 executes burst reads/writes with no dead cycles between successive transfers, leveraging its ZBT™ architecture for continuous bus utilization.
What is the function of the ADV/LD pin on the 71V65603S100BGI8?
The ADV/LD pin on the 71V65603S100BGI8 serves a dual role: when sampled LOW at the rising CLK edge, it loads a new external address into the internal address register; when sampled HIGH, it advances the internal burst counter. This synchronous control enables seamless transition between single-address and burst-mode operations without external address generation logic - a key enabler for efficient FPGA or ASIC memory controllers interfacing with the 71V65603S100BGI8.
How does the ZBT™ feature improve system performance in the 71V65603S100BGI8?
The ZBT™ (Zero Bus Turnaround) feature in the 71V65603S100BGI8 eliminates idle cycles normally required when switching between read and write operations. By allowing immediate back-to-back read/write transfers on the same bus, it sustains 100% bus utilization at 150 MHz - directly increasing effective memory bandwidth in applications like network packet buffers and protocol analyzers where mixed-access patterns dominate.
What package type and footprint does the 71V65603S100BGI8 use?
The 71V65603S100BGI8 uses a JEDEC-standard 100-pin thin quad flatpack (TQFP) package, 14 mm × 20 mm body size with 0.5 mm lead pitch. The 'BGI8' suffix confirms RoHS-compliant green packaging and industrial temperature grading. This footprint is widely supported in PCB design libraries and compatible with standard reflow soldering processes, easing integration into telecom and industrial hardware platforms.
71V65603S100BGI8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 119-BGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 119-PBGA (14x22)
71V65603S100BGI8 FAQ
1.How can I place an order for 71V65603S100BGI8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S100BGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S100BGI8 reliable?
The price and inventory of 71V65603S100BGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100BGI8 is usually 5 days.
3.What payment methods are accepted for 71V65603S100BGI8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S100BGI8 transactions.
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4.How is shipping managed for 71V65603S100BGI8?
71V65603S100BGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65603S100BGI8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S100BGI8?
For technical support, including 71V65603S100BGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100BGI8 requirements.
6.How does Aetrix verify that 71V65603S100BGI8 is sourced from the original manufacturer or authorized distributors?
All 71V65603S100BGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100BGI8 meets industry standards.
7.What is the process for return or replacement of 71V65603S100BGI8?
All 71V65603S100BGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100BGI8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S100BGI8 part is unused and in its original packaging.
Return procedure for 71V65603S100BGI8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S100BGI8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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