Renesas 71V65603S100BQG
- Part No.:
- 71V65603S100BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65603S100BQG.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,656
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Product details
Overview
71V65603S100BQG from Renesas Electronics is a 256K × 36-bit (9.44 Mbit), 3.3V synchronous ZBT™ SRAM with zero bus turnaround, 150 MHz operation (3.8 ns clock-to-data access), pipelined outputs, and 4-word burst capability. It serves as high-speed on-chip or system-level cache memory in network packet buffers, telecom switching fabrics, and FPGA co-processor data buffers.
For engineers reviewing the 71V65603S100BQG datasheet, 71V65603S100BQG pinout, 71V65603S100BQG application, or 71V65603S100BQG equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, industrial temperature support (–40°C to +85°C), and burst-mode control via ADV/LD and LBO pins.
Technical Context
The 71V65603S100BQG implements a fully synchronous, clock-edge-triggered architecture with dual-register pipeline stages for address/control and data I/O paths. All inputs except OE and ZZ are sampled on the rising edge of CLK, with two-cycle latency between address/control load and data transfer.
It integrates an on-chip burst counter, linear/interleaved burst sequencing controlled by static LBO, individual byte write enables (BW1–BW4), and three chip enables (CE1, CE2, CE2) supporting depth expansion. The device supports power-down mode via asynchronous ZZ input and internally synchronized output buffer enable eliminates external OE timing constraints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.44 Mbit); supports 36-bit wide data path for high-throughput buffering |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for real-time packet processing in telecom infrastructure |
| Clock-to-Data Access | 3.8 ns typical; guarantees deterministic read latency critical for pipelined systems |
| ZBT™ Feature | No dead cycles between read/write transitions; eliminates bus turnaround overhead in burst-intensive applications |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); ensures signal integrity with separate I/O rail |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in base station and industrial control environments |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow and automated optical inspection |
Pinout & Package
71V65603S100BQG is packaged in a 100-pin plastic thin quad flatpack (TQFP), JEDEC MO-140AC, 14 mm × 20 mm body, 0.5 mm pitch.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this signal |
| R/W | Read/Write Control | Synchronous command signal; determines data direction for current load cycle (two-cycle latency) |
| ADV/LD | Burst Counter Control | Loads new external address (LOW) or increments internal burst counter (HIGH); defines burst initiation and sequencing |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence; no runtime change allowed |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes; allows partial-word writes without read-modify-write |
| CE1, CE2, CE2 | Chip Enables | Three synchronous enables (CE1/CE2 active low, CE2 active high); support multi-chip depth expansion with two-cycle deselect |
| OE | Output Enable | Asynchronous control; tri-states outputs immediately when HIGH; may be tied LOW for simplified interface |
| ZZ | Sleep Mode Input | Asynchronous power-down; gates internal clock and reduces standby current while retaining data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered inputs and outputs for clean timing closure |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive reads/writes, enabling continuous 150 MHz throughput in burst sequences |
| Pipelined Output Registers | Two-stage output register (input → internal array → output register) ensures deterministic 3.8 ns tCD and simplifies PCB layout timing |
| 4-Word Burst Capability | Single address initiates four sequential data transfers (linear or interleaved), reducing address bus traffic by 75% per burst |
| Individual Byte Write Control | Four independent BWx pins allow selective 9-bit byte updates without disturbing other bytes in the 36-bit word |
| Three-Chip-Enable Architecture | CE1 (active low), CE2 (active low), CE2 (active high) enable flexible bank selection and seamless depth expansion |
Applications
| Network Packet Buffer | Telecom Switch Fabric |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line cards with strict latency budgets. IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM acting as first-level packet buffer between MAC and switch fabric ASICs. Use Value: ZBT™ eliminates bus turnaround gaps, sustaining 150 MHz sustained read/write bursts required for 10 Gbps+ line rates. | Use Scenario: Providing temporary storage for cell/packet headers and payload during crosspoint arbitration in carrier-grade switches. IC Role / Device Role / Timing Role: Dual-port-capable synchronous SRAM used in ping-pong configuration for non-blocking header lookup and buffering. Use Value: Pipelined outputs and 3.8 ns tCD ensure deterministic timing alignment with switch fabric clock domains. |
| FPGA Co-Processor Cache | Industrial Motion Controller |
Use Scenario: Offloading data-intensive FFT or filtering operations from FPGA logic using tightly coupled memory. IC Role / Device Role / Timing Role: External cache memory interfaced directly to FPGA's high-speed parallel I/O banks via dedicated 36-bit bus. Use Value: 4-word burst mode reduces address strobes by 75%, freeing FPGA logic resources for computation rather than address generation. | Use Scenario: Real-time interpolation and trajectory buffering in CNC and robotics controllers requiring deterministic response under thermal stress. IC Role / Device Role / Timing Role: Industrial-grade SRAM storing motion profiles and encoder feedback history with guaranteed retention at –40°C to +85°C. Use Value: ZZ sleep mode cuts standby power by >90% during axis dwell periods while preserving position data integrity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 36-bit, 133 MHz max, 4.5 ns tCD, same TQFP-100 package but Cypress/Infineon architecture | Lower max frequency and longer access time; suitable where 150 MHz is not required | Select when system clock ≤133 MHz and legacy Cypress design reuse is prioritized |
| AS7C3256B-15JC | 256K × 36-bit, 150 MHz, 4.0 ns tCD, 100-pin TQFP, but lacks ZBT™ and burst counter | No zero-bus-turnaround or burst mode; requires external burst logic and additional control signals | Choose only if ZBT™ and ADV/LD-controlled burst are not needed and simpler control is preferred |
Compared with CY7C1362BV33-133AXC and AS7C3256B-15JC, the 71V65603S100BQG uniquely delivers true ZBT™ operation and integrated burst sequencing-enabling higher effective bandwidth and reduced controller complexity in telecom and networking designs.
Availability
71V65603S100BQG is available at Aetrix Electronics and suitable for network packet buffers, telecom switch fabrics, and FPGA co-processor caches requiring stable component supply across extended industrial temperature ranges.
Supply support for 71V65603S100BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65603S100BQG belongs to Renesas' high-speed ZBT™ SRAM product line, engineered specifically for zero-latency bus turnaround in packet-switching, baseband processing, and real-time control systems.
FAQ
What is the memory organization and total capacity of the 71V65603S100BQG?
The 71V65603S100BQG is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.44 Mbit). This configuration provides a 36-bit-wide data bus ideal for applications requiring high-throughput parallel data transfer, such as network packet buffering and FPGA co-processing. Its architecture supports direct connection to 36-bit processor or ASIC data paths without width conversion logic.
Does the 71V65603S100BQG support burst read and write operations, and how is burst mode controlled?
Yes, the 71V65603S100BQG supports 4-word burst operations in both read and write modes. Burst sequencing is controlled by the ADV/LD pin (to load address or advance counter) and the LBO pin (to select linear or interleaved order). A single address load initiates four consecutive data transfers, reducing address bus activity and improving effective bandwidth-critical for high-speed packet processing applications.
What is the significance of the ZBTTM feature in the 71V65603S100BQG, and how does it improve system performance?
ZBTTM (Zero Bus Turnaround) eliminates idle cycles between successive read and write operations, allowing immediate back-to-back transfers without bus contention or turnaround overhead. In the 71V65603S100BQG, this enables sustained 150 MHz throughput in mixed-access patterns-directly increasing effective bandwidth in telecom switch fabrics and network processors where bus efficiency dictates overall system latency.
Can the 71V65603S100BQG operate in industrial temperature conditions, and what are its supply voltage requirements?
Yes, the 71V65603S100BQG is qualified for industrial temperature operation from –40°C to +85°C. It requires two regulated supplies: VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O circuits. Separate VDD and VDDQ rails maintain signal integrity and reduce noise coupling, making it suitable for harsh-environment applications like base station equipment and factory automation controllers.
How does the 71V65603S100BQG handle power management, and what is the role of the ZZ pin?
The 71V65603S100BQG implements low-power operation via the asynchronous ZZ (sleep mode) pin. When ZZ is driven HIGH, the internal clock is gated and the device enters a low-power state while retaining memory contents. This reduces standby current significantly-enabling energy-efficient operation during idle periods in motion controllers or wireless infrastructure units without data loss or initialization delay.
71V65603S100BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65603S100BQG FAQ
1.How can I place an order for 71V65603S100BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S100BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S100BQG reliable?
The price and inventory of 71V65603S100BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100BQG is usually 5 days.
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Once your 71V65603S100BQG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S100BQG?
For technical support, including 71V65603S100BQG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100BQG requirements.
6.How does Aetrix verify that 71V65603S100BQG is sourced from the original manufacturer or authorized distributors?
All 71V65603S100BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100BQG meets industry standards.
7.What is the process for return or replacement of 71V65603S100BQG?
All 71V65603S100BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S100BQG part is unused and in its original packaging.
Return procedure for 71V65603S100BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S100BQG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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