Renesas 71V65603S100BQG8
- Part No.:
- 71V65603S100BQG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65603S100BQG8.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65603S100BQG8 from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, 150 MHz operation (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature (–40°C to +85°C). Used in high-speed networking packet buffers and FPGA co-processor memory interfaces.
For engineers reviewing the 71V65603S100BQG8 datasheet, 71V65603S100BQG8 pinout, 71V65603S100BQG8 application, or 71V65603S100BQG8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O supply (VDDQ) decoupling requirements, and burst counter control via ADV/LD and LBO pins.
Technical Context
The 71V65603S100BQG8 implements a fully synchronous, clock-edge-triggered architecture with input/output registers on all address, control, and data lines. Its ZBT™ feature eliminates dead cycles between read/write transitions by enabling immediate bus direction reversal after completion of the current cycle.
It integrates a 4-word burst counter with selectable linear or interleaved sequence (LBO pin), individual byte write enables (BW1–BW4), and three chip enables (CE1, CE2, CE2) for depth expansion. Clock Enable (CEN) suspends internal operation without affecting output state, while ZZ enables low-power sleep mode with guaranteed data retention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,437,184 bits); supports 36-bit wide data path for high-throughput buffering |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for real-time packet processing in telecom line cards |
| Clock-to-Data Access | 3.8 ns (typical); defines minimum latency from CLK edge to valid Q output in read cycles |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); requires separate decoupling for noise isolation |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in uncontrolled ambient environments |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic by 75% per burst initiation |
| Power-Down Mode | ZZ input asserts internal clock gating; reduces active power to standby level while retaining memory contents |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pin 1 marked via corner notch; top-side marking includes "71V65603S100BQG8".
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Rising-edge synchronous trigger for all registered inputs/outputs; all timing referenced to this edge |
| A0–A17 | Address Inputs | 18-bit address bus for 256K depth; latched on rising CLK when ADV/LD = LOW and chip enabled |
| R/W | Read/Write Control | Synchronous signal defining cycle type; sampled with ADV/LD to initiate load or burst operation |
| ADV/LD | Burst Counter Control | LOW loads external address; HIGH advances internal burst counter - critical for burst sequencing |
| LBO | Burst Order Select | Static input: LOW = linear burst (0,1,2,3), HIGH = interleaved (0,2,1,3); must remain stable during operation |
| BW1–BW4 | Byte Write Enables | Active-low synchronous enables for four 9-bit bytes; allows partial-word writes without read-modify-write |
| CE1, CE2, CE2 | Chip Enables | Three independent enables (CE1/CE2 active-low, CE2 active-high); enable depth expansion with no external logic |
| OE | Output Enable | Asynchronous; drives I/Os to Hi-Z when HIGH - simplifies bus sharing without timing constraints |
| ZZ | Sleep Mode Input | Asynchronous; gates internal clock and reduces power; retains data with VDD applied |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered inputs/outputs eliminate external latch requirements |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates idle cycles between consecutive read/write operations - increases effective bus utilization by up to 30% in burst-heavy workloads |
| Internally Synchronized OE | Removes need for external OE timing control; outputs remain valid across clock edges without glitch risk |
| Single R/W Pin | Reduces control bus complexity vs. separate RD/WR signals; simplifies FPGA interface logic and PCB routing |
| Pipelined Output Registers | Ensures deterministic 2-cycle read latency (CLK → Q) and eliminates hold-time violations on high-speed buses |
| Individual Byte Write | Enables precise 9-bit updates without corrupting adjacent bytes - essential for protocol header manipulation |
| Three Chip Enables | Supports seamless 2× or 4× depth expansion using identical parts - avoids mixed-SRAM design validation overhead |
Applications
| High-Speed Packet Buffering | FPGA Co-Processor Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches before classification or forwarding decisions. IC Role / Device Role / Timing Role: Primary buffer memory interfacing directly to MAC controller and switch fabric; handles back-to-back 64–1518 byte frames at line rate. Use Value: ZBT™ architecture sustains 150 MHz throughput with no bus turnaround penalty, enabling full-duplex 10 Gbps+ switching performance. |
Use Scenario: Offloading compute-intensive tasks (e.g., CRC, encryption, pattern matching) from host CPU to FPGA-accelerated subsystems. IC Role / Device Role / Timing Role: Low-latency scratchpad memory for FPGA logic blocks; synchronized to FPGA clock domain via CLK and CEN. Use Value: Pipelined outputs and 3.8 ns tCD guarantee predictable 2-cycle read latency - critical for tight FPGA timing closure. |
| Telecom Line Card Buffering | Industrial Real-Time Controller Cache |
|
Use Scenario: Temporary storage of TDM voice channels, ATM cells, or SONET/SDH payloads in base station or OLT equipment. IC Role / Device Role / Timing Role: Dual-port-like behavior via burst reads/writes; supports simultaneous upstream/downstream data flow on shared bus. Use Value: 4-word burst capability reduces address strobes by 75%, lowering bus arbitration overhead and jitter in deterministic systems. |
Use Scenario: Caching sensor fusion data (IMU, GPS, CAN) in autonomous mobile robots or CNC motion controllers requiring sub-millisecond response. IC Role / Device Role / Timing Role: Deterministic-access memory for real-time OS task stacks and interrupt service routines; powered by industrial-grade VDD/VDDQ rails. Use Value: –40°C to +85°C operation and ZZ sleep mode ensure reliable data retention during thermal cycling and brown-out events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 256K × 36, 133 MHz max, 4.5 ns tCD; uses different burst control (MODE pin instead of LBO) | Lacks ZBT™ architecture - introduces 1-cycle dead time between read/write transitions | Choose when lower frequency margin is acceptable and Cypress-compatible footprint is required |
| AS7C33128PFS-15BIN | 256K × 36, 150 MHz, 3.8 ns tCD; supports same ZBT™ and burst modes but uses BGA-119 package only | No TQFP option available - requires PCB redesign if migrating from 71V65603S100BQG8 | Choose for higher density layouts where BGA routing and thermal performance outweigh TQFP assembly simplicity |
Compared with CY7C1362BV33-133AXC and AS7C33128PFS-15BIN, the 71V65603S100BQG8 uniquely combines ZBT™ timing, TQFP-100 packaging, and industrial temperature support - making it optimal for cost-sensitive, thermally demanding, and layout-constrained embedded designs requiring zero-turnaround performance.
Availability
71V65603S100BQG8 is available at Aetrix Electronics and suitable for high-speed packet buffering, FPGA co-processor memory, and telecom line card applications requiring stable component supply, long-term industrial-grade availability, and RoHS-compliant green packaging.
Supply support for 71V65603S100BQG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65603S100BQG8 belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-bandwidth, low-latency buffering in networking, telecommunications, and real-time embedded systems where deterministic bus turnaround is critical.
FAQ
What is the maximum operating frequency and corresponding access time for the 71V65603S100BQG8?
The 71V65603S100BQG8 operates at up to 150 MHz with a typical clock-to-data access time (tCD) of 3.8 ns. This specification is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. The 3.8 ns value defines the delay from CLK rising edge to valid data appearing on Q outputs during read cycles - a key parameter for timing-critical FPGA or ASIC interfaces.
How does the ZBTTM feature improve system-level performance compared to standard synchronous SRAMs?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S100BQG8 eliminates mandatory idle cycles between consecutive read and write operations. Unlike conventional SRAMs that require bus stabilization time, the 71V65603S100BQG8 allows immediate direction reversal - enabling back-to-back reads and writes with no dead cycles. This increases effective bus bandwidth by up to 30% in burst-intensive applications like packet buffering.
What are the voltage requirements for VDD and VDDQ, and can they be supplied from the same regulator?
The 71V65603S100BQG8 requires VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. While both rails share the same nominal voltage, Renesas specifies separate decoupling and recommends independent regulation or tightly coupled low-noise LDOs. Sharing a single regulator risks I/O noise coupling into core logic, potentially violating setup/hold margins at 150 MHz operation.
Can the 71V65603S100BQG8 be used in linear burst mode, and how is it configured?
Yes, the 71V65603S100BQG8 supports linear burst mode when the LBO pin is held LOW (VSS). In this configuration, a 4-word burst accesses sequential addresses: A0, A0+1, A0+2, A0+3. The burst sequence is initiated by sampling ADV/LD = LOW to load the starting address, then ADV/LD = HIGH for subsequent increments. Linear mode is ideal for streaming applications like video frame buffering where memory access follows natural address order.
What is the function of the three chip enable pins (CE1, CE2, CE2), and how do they differ?
The 71V65603S100BQG8 features three chip enables: CE1 and CE2 are active-low, while CE2 is active-high. All three must be asserted simultaneously (CE1 = L, CE2 = L, CE2 = H) to select the device. This asymmetric polarity allows flexible depth expansion - for example, using CE2 as a bank-select signal while CE1/CE2 serve as group enables - without external inverters or logic gates.
71V65603S100BQG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65603S100BQG8 FAQ
1.How can I place an order for 71V65603S100BQG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S100BQG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S100BQG8 reliable?
The price and inventory of 71V65603S100BQG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100BQG8 is usually 5 days.
3.What payment methods are accepted for 71V65603S100BQG8?
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4.How is shipping managed for 71V65603S100BQG8?
71V65603S100BQG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65603S100BQG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S100BQG8?
For technical support, including 71V65603S100BQG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100BQG8 requirements.
6.How does Aetrix verify that 71V65603S100BQG8 is sourced from the original manufacturer or authorized distributors?
All 71V65603S100BQG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100BQG8 meets industry standards.
7.What is the process for return or replacement of 71V65603S100BQG8?
All 71V65603S100BQG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100BQG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S100BQG8 part is unused and in its original packaging.
Return procedure for 71V65603S100BQG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S100BQG8 Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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AT24C08C-STUM-T
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