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Renesas 71V65603S100BQGI8

Part No.:
71V65603S100BQGI8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65603S100BQGI8.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,729

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Product details

Overview

71V65603S100BQGI8 from Renesas Electronics is a 256K × 36-bit (9 Mbit), 3.3V synchronous ZBT™ SRAM with zero bus turnaround, 150 MHz operation (3.8 ns clock-to-data access), pipelined outputs, and 4-word burst capability. It features three chip enables, individual byte write controls (BW1–BW4), and operates across industrial temperature (–40°C to +85°C). Used in high-speed networking packet buffers and telecom line-card data path memory.

For engineers reviewing the 71V65603S100BQGI8 datasheet, 71V65603S100BQGI8 pinout, 71V65603S100BQGI8 application, or 71V65603S100BQGI8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst mode configuration via LBO/ADV/LD, and industrial-grade thermal performance.

Technical Context

The 71V65603S100BQGI8 implements a fully synchronous, clock-edge-triggered architecture where address, control, and data are registered on the rising CLK edge. Its ZBT™ feature eliminates dead cycles between read/write transitions by enabling immediate bus direction reversal after each access.

It integrates an on-chip burst counter, linear/interleaved burst sequencing controlled by static LBO, and internally synchronized output buffer enable-removing external OE timing constraints. The device supports depth expansion via CE1/CE2/CE2 and uses ADV/LD to load new addresses or increment the burst counter.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9,437,184 bits); supports high-bandwidth parallel data paths in packet processing systems
Max Clock Frequency150 MHz; enables 6.67 ns cycle time for real-time buffering in 10G+ Ethernet and CPRI interfaces
Clock-to-Data Access3.8 ns (typical); guarantees deterministic latency for pipelined memory reads in FPGA co-processor designs
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); requires separate low-noise regulation for signal integrity
Operating Temperature–40°C to +85°C (industrial grade); validated for deployment in uncontrolled ambient telecom infrastructure
Burst Capability4-word burst (linear or interleaved); reduces address bus overhead and improves throughput in sequential access patterns
Zero Bus TurnaroundZBT™ architecture; allows back-to-back read/write without bus idle cycles-critical for DDR-like memory controllers

Pinout & Package

Packaged in JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pinout validated per IDT71V65603 PKG100 drawing (Rev. 6.42).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK when ADV/LD = LOW and chip enabled
CLKSystem Clock InputRising-edge-triggered master clock; all synchronous registers (address, control, I/O) align to this edge
R/WRead/Write ControlSynchronous signal defining access type; determines whether next-cycle data transfer is read or write
ADV/LDBurst Counter ControlLOW loads external address; HIGH advances internal burst counter-enables seamless burst sequencing
LBOBurst Order SelectStatic input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence
BW1–BW4Byte Write EnablesFour independent active-low signals controlling 9-bit byte writes; supports partial-word updates without read-modify-write
CE1, CE2, CE2Chip EnablesThree synchronous enables (CE1/CE2 active LOW, CE2 active HIGH); allow flexible depth expansion and deselect control
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous data path; registered inputs/outputs eliminate external latch requirements
ZZAsynchronous Sleep ModeHIGH gates internal clock and reduces power; retains data while minimizing standby current in idle periods

Key Features

FeatureDesign Value
ZBTTM ArchitectureEliminates bus turnaround dead cycles-enables continuous read/write alternation at full clock rate without wait states
Pipelined OutputsInternally registered output drivers synchronized to CLK; remove need for external output latches and simplify timing closure
Single R/W PinReduces control bus complexity versus separate RD/WR signals-simplifies interface logic in ASIC/FPGA memory controllers
Individual Byte WriteFour dedicated BWx pins enable selective 9-bit writes-avoids destructive full-word updates in cache or descriptor tables
On-Chip Burst CounterHardware-based 4-word counter eliminates external burst address generation logic-reduces FPGA resource usage and routing congestion

Applications

High-Speed Packet BufferingTelecom Line Card Memory

Use Scenario: Storing ingress/egress packets in 10G Ethernet switch fabric ASICs with strict latency budgets.

IC Role / Device Role / Timing Role: Primary data buffer SRAM interfacing directly to SerDes MAC logic and traffic manager.

Use Value: 3.8 ns clock-to-data access and ZBT™ enable sub-10 ns round-trip latency for store-and-forward operations.

Use Scenario: Holding frame headers and payload fragments in CPRI-compliant wireless baseband units.

IC Role / Device Role / Timing Role: Dual-port accessible memory bank supporting simultaneous read (DSP fetch) and write (PHY ingest) via burst mode.

Use Value: 4-word burst + linear addressing reduces address bus toggling by 75%, lowering EMI and power in dense RF modules.

Industrial PLC Data LoggingFPGA-Based Protocol Accelerator

Use Scenario: Cyclic logging of sensor timestamps and analog values in ruggedized automation controllers.

IC Role / Device Role / Timing Role: Nonvolatile-backed SRAM buffer holding last 10k samples before flash commit.

Use Value: Industrial temperature rating (–40°C to +85°C) and ZZ sleep mode ensure reliable retention during brownouts or thermal stress.

Use Scenario: Offloading TCP/IP checksum, encryption, or packet classification in reconfigurable network appliances.

IC Role / Device Role / Timing Role: High-throughput lookup table and temporary result storage tightly coupled to FPGA soft-core processor.

Use Value: Pipelined outputs and synchronous 150 MHz operation match FPGA register-to-register timing, eliminating setup/hold violations.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133AXC133 MHz max frequency; 256K × 36 organization; same TQFP-100 package; Cypress (now Infineon) device with similar ZBT™ behavior but no LBO pin-fixed linear burst onlyLacks interleaved burst mode; requires redesign of burst address sequencing logic in controller firmwareSelect when burst order flexibility is not required and legacy Cypress toolchain support is preferred
AS7C33128P-15TIN15 ns access time (≈67 MHz); 256K × 36; 3.3V; TSOP-II package-not pin-compatible; no ZBT™ or burst counterNo zero bus turnaround or hardware burst-requires external address generation and introduces bus idle cyclesChoose only for cost-sensitive, non-real-time applications where 150 MHz performance and ZBT™ are unnecessary

Compared with CY7C1362BV33-133AXC and AS7C33128P-15TIN, the 71V65603S100BQGI8 delivers higher bandwidth (150 MHz vs. 133/67 MHz), deterministic ZBT™ timing, and configurable burst ordering-making it optimal for latency-critical telecom and networking systems requiring minimal controller overhead.

Availability

71V65603S100BQGI8 is available at Aetrix Electronics and suitable for high-speed packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply and long-term industrial temperature support.

Supply support for 71V65603S100BQGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65603S100BQGI8 belongs to Renesas' high-performance ZBT™ SRAM product line, engineered specifically for low-latency, high-throughput data buffering in networking equipment, base stations, and real-time control systems.

FAQ

What is the maximum operating frequency of the 71V65603S100BQGI8?

The 71V65603S100BQGI8 supports a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock period. This is validated under industrial temperature conditions (–40°C to +85°C) and 3.3 V ±5% supply. The 3.8 ns clock-to-data access time ensures deterministic read latency critical for real-time packet processing applications using the 71V65603S100BQGI8.

Does the 71V65603S100BQGI8 support both linear and interleaved burst modes?

Yes, the 71V65603S100BQGI8 supports both linear and interleaved 4-word burst sequences via the LBO (Linear Burst Order) pin. When LBO = LOW, linear addressing is used; when LBO = HIGH, interleaved addressing is selected. This dual-mode capability is confirmed in the functional timing diagrams and burst sequence tables of the official Renesas datasheet for the 71V65603S100BQGI8.

What package type is used for the 71V65603S100BQGI8?

The 71V65603S100BQGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP) with 14 mm × 20 mm body size and 0.5 mm lead pitch. This package is explicitly designated as PKG100 in Renesas documentation and matches the pinout shown in Figure 5 (Pin Configuration – 256K x 36, PKG100) of the 71V65603S100BQGI8 datasheet.

How does the ZBTTM feature improve system performance in the 71V65603S100BQGI8?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S100BQGI8 eliminates idle cycles when switching between read and write operations. Unlike conventional SRAMs requiring bus stabilization time, the 71V65603S100BQGI8 allows immediate direction reversal-enabling back-to-back accesses at full clock rate. This directly increases effective memory bandwidth in burst-intensive applications like network packet buffering using the 71V65603S100BQGI8.

What are the voltage requirements for VDD and VDDQ on the 71V65603S100BQGI8?

The 71V65603S100BQGI8 requires VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. These supplies must be independently decoupled per the layout guidelines in the Renesas datasheet. Deviation beyond ±5% violates the recommended operating conditions and may cause timing violations or data corruption in the 71V65603S100BQGI8.

71V65603S100BQGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
100 MHz
Write Cycle Time - Word, Page:
-
Access Time:
5 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65603S100BQGI8 FAQ

1.How can I place an order for 71V65603S100BQGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65603S100BQGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of 71V65603S100BQGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100BQGI8 is usually 5 days.

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4.How is shipping managed for 71V65603S100BQGI8?

71V65603S100BQGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65603S100BQGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65603S100BQGI8?

For technical support, including 71V65603S100BQGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100BQGI8 requirements.

6.How does Aetrix verify that 71V65603S100BQGI8 is sourced from the original manufacturer or authorized distributors?

All 71V65603S100BQGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100BQGI8 meets industry standards.

7.What is the process for return or replacement of 71V65603S100BQGI8?

All 71V65603S100BQGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100BQGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65603S100BQGI8 part is unused and in its original packaging.

Return procedure for 71V65603S100BQGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V65603S100BQGI8 Tags

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