Renesas 71V65603S100BQI
- Part No.:
- 71V65603S100BQI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65603S100BQI.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65603S100BQI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 150 MHz clock speed, 3.8 ns clock-to-data access time, and zero bus turnaround (ZBT) architecture. It supports pipelined burst reads/writes in linear or interleaved mode and operates across industrial temperature range (–40°C to +85°C), targeting high-speed packet buffering in network switches and telecom line cards.
For engineers reviewing the 71V65603S100BQI datasheet, 71V65603S100BQI pinout, 71V65603S100BQI application, or 71V65603S100BQI equivalent, key selection criteria include ZBT timing compliance, TQFP-100 package compatibility, 3.3V I/O supply (VDDQ) support, individual byte write control (BW1–BW4), and burst counter synchronization via ADV/LD and LBO inputs.
Technical Context
The 71V65603S100BQI implements a fully synchronous, pipelined interface where address/control registration occurs on the rising CLK edge, with data output valid two cycles later. Its ZBT architecture eliminates dead cycles between read/write transitions by internally managing bus direction without external OE control.
It integrates a 4-word burst counter synchronized to ADV/LD, with burst order selected statically by LBO (linear or interleaved). The device uses three chip enables (CE1, CE2, CE2) for depth expansion and supports asynchronous sleep mode via ZZ input and asynchronous output enable (OE).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports high-bandwidth data paths in 36-bit wide systems |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for sustained burst throughput in real-time systems |
| Clock-to-Data Access | 3.8 ns typical; guarantees deterministic latency for time-critical memory accesses |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); decoupled power domains reduce noise coupling |
| Operating Temperature | –40°C to +85°C; qualified for industrial-grade embedded networking and base station equipment |
| Burst Capability | 4-word linear or interleaved burst; reduces address overhead and improves effective bandwidth by 4× per load |
| Input Capacitance | ≤5 pF (BGA), ≤7 pF (TQFP); low loading preserves signal integrity at 150 MHz |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pinout validated per Renesas document 5304 drw 02 (PKG100, 256K × 36 configuration).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous timing referenced to this edge |
| R/W | Read/Write Control | Synchronous command signal determining data direction for current load cycle |
| ADV/LD | Burst Counter Control | Loads new external address (LOW) or advances internal burst counter (HIGH) |
| LBO | Burst Order Select | Static input selecting linear (LOW) or interleaved (HIGH) 4-word burst sequence |
| BW1–BW4 | Byte Write Enables | Four independent active-low signals enabling writes to 9-bit bytes I/O[0:7]/I/OP1 through I/O[24:31]/I/OP4 |
| CE1, CE2, CE2 | Chip Enables | Three synchronous enables (CE1/CE2 active-low, CE2 active-high) for multi-chip depth expansion |
| ZZ | Asynchronous Sleep Mode | Gates internal CLK and reduces power consumption while retaining data; no timing constraints |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path with registered input/output stages |
| OE | Asynchronous Output Enable | Drives outputs to high-impedance when HIGH; may be tied LOW for simplified read-only operation |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between consecutive reads and writes, enabling continuous 150 MHz throughput |
| Internally Synchronized OE | Removes need for external OE timing control-outputs automatically tri-state after deselect or write completion |
| 4-Word Burst Counter | Reduces address bus activity by 75% during sequential accesses; configurable linear/interleaved via LBO pin |
| Individual Byte Write | Enables precise 9-bit granularity writes without disturbing adjacent bytes, critical for protocol header updates |
| Three Chip Enables | Supports seamless depth expansion across multiple devices using mixed polarity (CE1/CE2 low, CE2 high) |
| Asynchronous Sleep Mode (ZZ) | Reduces dynamic power to minimum while preserving data retention-no clock or timing dependencies |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing ingress/egress Ethernet or SONET frames in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as first-level packet buffer with deterministic 3.8 ns read access and zero-turnaround burst writes. Use Value: Enables full-line-rate forwarding at 10 Gbps+ by eliminating bus idle cycles during back-to-back frame processing. | Use Scenario: Supporting real-time signal processing in carrier-grade DSLAMs and optical transport units requiring reliable memory under thermal stress. IC Role / Device Role / Timing Role: Industrial-temperature-rated ZBT SRAM providing burst-access scratchpad for DSP co-processors and traffic shapers. Use Value: Guarantees data integrity and timing compliance from –40°C to +85°C without derating, reducing thermal margin design overhead. |
| High-Performance Computing Cache | Industrial Control Data Logging |
Use Scenario: Serving as low-latency tag/data cache for FPGA-based accelerators handling real-time video analytics pipelines. IC Role / Device Role / Timing Role: Pipelined synchronous SRAM interfacing directly to FPGA fabric with 150 MHz clock domain alignment. Use Value: Delivers 4-word burst reads aligned to pixel-block boundaries, cutting memory controller logic complexity and improving frame throughput. | Use Scenario: Capturing sensor telemetry and event logs in ruggedized PLCs and SCADA edge controllers deployed in factory environments. IC Role / Device Role / Timing Role: Nonvolatile-retentive buffer (with external backup) supporting deterministic write logging via individual byte write (BW1–BW4) and sleep-mode power savings. Use Value: Enables selective 9-bit updates to timestamped records without rewriting full 36-bit words, extending flash endurance and reducing write latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 133 MHz max frequency, 256K × 36 organization, QDR-II interface, differential clocks | Designed for QDR-II protocol with separate read/write ports; not ZBT-compatible | Select only if system requires true dual-port QDR-II timing and can accommodate differential CLK/CLK# |
| AS7C3256B-15JC | 15 ns async access, 32K × 8 organization, 5V/3.3V tolerant, no burst or ZBT features | Asynchronous interface; lacks pipelining, burst counter, and zero-turnaround capability | Use only in legacy designs where synchronous timing and burst efficiency are not required |
Compared with CY7C1362BV33-133AXC and AS7C3256B-15JC, the 71V65603S100BQI uniquely delivers ZBT timing with 150 MHz operation and integrated burst control-enabling higher sustained bandwidth in pipelined architectures without protocol translation or external logic.
Availability
71V65603S100BQI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and high-performance computing cache applications requiring stable component supply, long-term industrial temperature support, and verified ZBT timing compliance.
Supply support for 71V65603S100BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65603S100BQI belongs to Renesas' ZBT™ synchronous SRAM product line, engineered specifically for high-throughput, low-latency data buffering in telecom, networking, and real-time embedded systems demanding deterministic bus turnaround behavior.
FAQ
What is the maximum operating frequency of the 71V65603S100BQI?
The 71V65603S100BQI supports a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock period. This rating is guaranteed over the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions, enabling sustained burst throughput in time-critical applications like packet switching and real-time signal processing. The 71V65603S100BQI achieves this performance with a 3.8 ns clock-to-data access time.
Does the 71V65603S100BQI support both linear and interleaved burst modes?
Yes, the 71V65603S100BQI supports both linear and interleaved 4-word burst sequences, selected by the static LBO (Linear Burst Order) pin: LBO = LOW configures linear order (A0, A0+1, A0+2, A0+3), while LBO = HIGH selects interleaved order (A0, A0+2, A0+1, A0+3). This flexibility allows optimization for sequential streaming or cache-line-aligned access patterns. The 71V65603S100BQI implements the burst counter synchronously with ADV/LD and CLK, ensuring deterministic timing.
How does the ZBTTM feature eliminate dead cycles in the 71V65603S100BQI?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S100BQI removes bus idle cycles between consecutive read and write operations by internally managing direction control-eliminating the need for external OE timing or bus turnaround delays. When transitioning from write to read (or vice versa), the 71V65603S100BQI asserts valid data or accepts input on the next clock edge without requiring a gap, enabling continuous 150 MHz throughput in pipelined systems.
What package type is used for the 71V65603S100BQI?
The 71V65603S100BQI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size with 0.5 mm lead pitch. This package is explicitly confirmed in Renesas documentation (5304 drw 02) for the 256K × 36 configuration. The "BQI" suffix in the part number denotes the TQFP-100 industrial-temperature variant, distinguishing it from BGA or fBGA versions.
Can the 71V65603S100BQI operate with independent core and I/O supplies?
Yes, the 71V65603S100BQI uses separate power domains: VDD (3.3 V ±5%) powers the core logic, while VDDQ (3.3 V ±5%) independently supplies the I/O buffers. This separation minimizes noise coupling between digital switching and data bus activity, improving signal integrity at 150 MHz. Both supplies must be within specification simultaneously for guaranteed operation, and the 71V65603S100BQI does not require specific power sequencing.
71V65603S100BQI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65603S100BQI FAQ
1.How can I place an order for 71V65603S100BQI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S100BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S100BQI reliable?
The price and inventory of 71V65603S100BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100BQI is usually 5 days.
3.What payment methods are accepted for 71V65603S100BQI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S100BQI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65603S100BQI?
71V65603S100BQI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65603S100BQI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S100BQI?
For technical support, including 71V65603S100BQI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100BQI requirements.
6.How does Aetrix verify that 71V65603S100BQI is sourced from the original manufacturer or authorized distributors?
All 71V65603S100BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100BQI meets industry standards.
7.What is the process for return or replacement of 71V65603S100BQI?
All 71V65603S100BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100BQI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S100BQI part is unused and in its original packaging.
Return procedure for 71V65603S100BQI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S100BQI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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