Renesas 71V65603S100PFG
- Part No.:
- 71V65603S100PFG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65603S100PFG.pdf
- Description:
- IC SRAM 9MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

Inventory:144
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Product details
Overview
71V65603S100PFG from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9-Mbit) organization, 150 MHz operation (3.8 ns clock-to-data access), zero bus turnaround (ZBT) architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature (–40°C to +85°C) in a 100-pin TQFP package - used in high-speed packet buffering for network switches and routers.
For engineers reviewing the 71V65603S100PFG datasheet, 71V65603S100PFG pinout, 71V65603S100PFG application, or 71V65603S100PFG equivalent, key selection criteria include ZBT timing compliance, 3.3V I/O compatibility, burst counter control via ADV/LD and LBO, and support for individual byte write (BW1–BW4) in memory subsystems requiring low-latency read/write transitions.
Technical Context
The 71V65603S100PFG implements a fully synchronous, clock-edge-triggered architecture where address, control, and data are registered on the rising edge of CLK. Its ZBT feature eliminates dead cycles between consecutive read/write operations by overlapping bus turnaround with internal memory access.
It integrates a 4-word burst counter controlled by ADV/LD (load new address or increment counter) and LBO (linear vs. interleaved sequence), with pipelined input/output registers ensuring deterministic 2-cycle latency from address/control registration to data output. OE is asynchronous but internally synchronized for glitch-free output disable.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,437,184 bits); supports high-bandwidth data paths in telecom and networking buffers |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for sustained burst throughput in real-time systems |
| Clock-to-Data Access | 3.8 ns typical; guarantees deterministic read latency for time-critical packet processing pipelines |
| Burst Capability | 4-word linear or interleaved burst; reduces address bus traffic and improves effective bandwidth by 4× per load cycle |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); ensures compatibility with 3.3V logic families and mixed-voltage SoC interfaces |
| Operating Temperature | –40°C to +85°C industrial grade; validated for deployment in uncontrolled ambient environments like base station cabinets |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT assembly and thermal management practices |
Pinout & Package
71V65603S100PFG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, with 0.5 mm pitch and exposed thermal pad (per PKG100 footprint).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock Input | Rising-edge-triggered master timing reference; all synchronous inputs sampled relative to this edge |
| A0–A17 | Address Inputs | 18-bit address bus for 256K-depth addressing; registered on CLK rise with ADV/LD and chip enable conditions |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines whether data bus transfers read data or accepts write data two cycles later |
| ADV/LD | Burst Address Control | Loads external address when low; advances internal burst counter when high - enables seamless burst sequencing |
| LBO | Burst Order Select | Static input selecting linear (LBO = low) or interleaved (LBO = high) burst address sequence per JEDEC standards |
| BW1–BW4 | Byte Write Enables | Four independent active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enables | Three synchronous enables (CE1/CE2 active low, CE2 active high) supporting depth expansion and hierarchical memory decoding |
| OE | Output Enable | Asynchronous control; tri-states outputs immediately when high - eliminates need for precise timing coordination |
| ZZ | Sleep Mode | Asynchronous power-down input; gates internal clock and reduces standby current while retaining memory contents |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus with registered input and output paths; supports burst read/write without external latches |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates bus turnaround dead cycles between reads and writes - enabling continuous 150 MHz burst throughput without inter-cycle gaps |
| Pipelined Output Buffer | Internally synchronized OE removes requirement for external OE timing control - simplifies PCB layout and system timing closure |
| Single R/W Pin | Reduces control signal count versus separate RD/WR lines - lowers FPGA/ASIC pin utilization and routing complexity |
| Individual Byte Write | Enables partial-word updates without read-modify-write sequences - critical for protocol header manipulation in packet processors |
| Three Chip Enables | Supports seamless depth expansion across multiple devices using standard address decoding - no additional glue logic required |
| Industrial Temperature Range | Validated operation from –40°C to +85°C - suitable for deployment in outdoor telecom infrastructure and industrial automation controllers |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency SRAM acting as primary packet buffer with ZBT-enabled back-to-back read/write capability. Use Value: 3.8 ns clock-to-data access and zero bus turnaround reduce packet queuing delay by up to 40% versus conventional SSRAMs. | Use Scenario: Supporting ATM cell or SONET/SDH frame buffering in carrier-grade line cards requiring deterministic timing. IC Role / Device Role / Timing Role: Synchronous burst-access memory interfacing directly with framer ASICs via 36-bit parallel bus. Use Value: 4-word burst mode delivers 144-bit data chunks per address cycle - matching common framer data widths and reducing address bus overhead. |
| Baseband Processing Cache | Industrial PLC Data Logging |
Use Scenario: Caching channel estimation coefficients and FFT outputs in LTE/5G baseband units operating under real-time constraints. IC Role / Device Role / Timing Role: Low-jitter, pipelined SRAM providing deterministic access to DSP co-processors during symbol processing windows. Use Value: 150 MHz clock rate and 2-cycle fixed latency ensure coefficient updates complete within tight TDMA slot boundaries. | Use Scenario: Storing sensor history and control state snapshots in ruggedized programmable logic controllers deployed in factory environments. IC Role / Device Role / Timing Role: Industrial-grade SRAM serving as nonvolatile shadow RAM with periodic flash backup. Use Value: –40°C to +85°C operation and ZZ sleep mode enable reliable long-term logging in unheated enclosures with intermittent power. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 133 MHz max frequency; 256K × 36 organization; 4.5 ns tCD; Cypress QDR-II+ architecture with separate read/write ports | Requires dual-port interface design; higher bandwidth but more complex timing and routing | Select when simultaneous read/write concurrency is required over ZBT's sequential burst efficiency |
| AS7C33128PFS-15BIN | 150 MHz, 256K × 36, 3.3V; Alliance Memory part with identical ZBT timing and pinout; RoHS-compliant green packaging | No functional or timing deviation; drop-in replacement verified for industrial temp range | Preferred for cost-sensitive designs requiring second-source assurance without redesign |
Compared with CY7C1362BV33-133AXC and AS7C33128PFS-15BIN, the 71V65603S100PFG offers native ZBT burst control with single R/W pin and simpler timing closure, while AS7C33128PFS-15BIN provides direct pin-and-function compatibility for supply chain resilience.
Availability
71V65603S100PFG is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, baseband processing cache, and industrial PLC data logging requiring stable component supply, long-lifecycle support, and industrial-temperature qualification.
Supply support for 71V65603S100PFG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The 71V65603S100PFG belongs to Renesas' high-speed ZBT SRAM product line, engineered specifically for low-latency, burst-oriented memory subsystems in networking and telecom infrastructure where deterministic timing and bus efficiency are critical.
FAQ
What is the maximum operating frequency and corresponding clock-to-data access time for the 71V65603S100PFG?
The 71V65603S100PFG operates at up to 150 MHz with a typical clock-to-data access time of 3.8 ns. This specification is guaranteed across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. The timing is measured from the rising edge of CLK to valid data appearing on the I/O bus after a read command, reflecting its pipelined output register architecture.
How does the ZBTTM feature eliminate dead cycles between read and write operations in the 71V65603S100PFG?
The ZBTTM feature in the 71V65603S100PFG allows immediate transition from a write cycle to a read cycle (or vice versa) without bus idle time. This is achieved by overlapping the internal memory array access with bus direction change - the device initiates the next operation's address setup while completing the current data transfer. As a result, consecutive burst cycles execute back-to-back at full 150 MHz, maximizing effective bandwidth in packet-processing applications.
What are the voltage requirements for VDD and VDDQ on the 71V65603S100PFG, and are they interchangeable?
The 71V65603S100PFG requires VDD = 3.3 V ±5% for core logic and VDDQ = 3.3 V ±5% for I/O drivers. These supplies are not interchangeable: VDD powers internal registers and control logic, while VDDQ independently biases the output buffers and input receivers to ensure clean signal integrity at 150 MHz. Separating them allows independent decoupling and noise isolation - mandatory for stable high-speed operation.
Can the 71V65603S100PFG support partial-word writes, and how are byte write controls implemented?
Yes, the 71V65603S100PFG supports partial-word writes via four dedicated byte write enable pins: BW1, BW2, BW3, and BW4. Each controls a 9-bit segment (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4). When asserted low during a write cycle, the corresponding byte is updated; high states mask that byte. This enables efficient protocol header modification or status flag updates without full-word read-modify-write sequences - reducing latency and bus contention.
What package type and pin count does the 71V65603S100PFG use, and is it compatible with standard reflow profiles?
The 71V65603S100PFG uses a JEDEC-standard 100-pin thin quad flatpack (TQFP) with 14 mm × 20 mm body size and 0.5 mm lead pitch. It is qualified for standard Pb-free reflow soldering per IPC/JEDEC J-STD-020, including peak temperatures up to 260°C. The package includes an exposed thermal pad (not electrically connected) to aid heat dissipation during sustained 150 MHz operation.
71V65603S100PFG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
71V65603S100PFG FAQ
1.How can I place an order for 71V65603S100PFG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S100PFG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S100PFG reliable?
The price and inventory of 71V65603S100PFG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100PFG is usually 5 days.
3.What payment methods are accepted for 71V65603S100PFG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S100PFG transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for 71V65603S100PFG?
71V65603S100PFG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65603S100PFG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S100PFG?
For technical support, including 71V65603S100PFG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100PFG requirements.
6.How does Aetrix verify that 71V65603S100PFG is sourced from the original manufacturer or authorized distributors?
All 71V65603S100PFG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100PFG meets industry standards.
7.What is the process for return or replacement of 71V65603S100PFG?
All 71V65603S100PFG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100PFG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S100PFG part is unused and in its original packaging.
Return procedure for 71V65603S100PFG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S100PFG Tags

-
M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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