Renesas 71V65603S100PFG8
- Part No.:
- 71V65603S100PFG8
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 100-LQFP
- Datasheet:
-
71V65603S100PFG8.pdf
- Description:
- IC SRAM 9MBIT PAR 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65603S100PFG8 from Renesas Electronics is a 256K × 36-bit (9-Mbit), 3.3V synchronous ZBT™ SRAM with zero bus turnaround, 150 MHz operation (3.8 ns clock-to-data access), pipelined outputs, and 4-word burst capability. It supports interleaved or linear burst sequences via LBO control and operates across industrial temperature range (–40°C to +85°C). Used in high-speed networking packet buffers and telecom line-card memory subsystems.
For engineers reviewing the 71V65603S100PFG8 datasheet, 71V65603S100PFG8 pinout, 71V65603S100PFG8 application, or 71V65603S100PFG8 equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, and support for individual byte write (BW1–BW4) and burst counter functionality in fully pipelined systems.
Technical Context
The 71V65603S100PFG8 implements a synchronous dual-register architecture: address/control signals are latched on the rising edge of CLK with ADV/LD low, and data transfers occur two cycles later. Its ZBT™ feature eliminates dead cycles between read/write transitions by internally synchronizing output buffer enable-removing external OE timing constraints.
Burst operation is controlled by ADV/LD (load new address or increment internal counter) and LBO (linear vs. interleaved sequence), while three chip enables (CE1, CE2, CE2) support depth expansion. The device uses a high-performance CMOS process and features asynchronous ZZ sleep mode and OE, with all other inputs synchronous to CLK.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,437,184 bits); supports full 36-bit word or individual byte writes via BW1–BW4 |
| Max Clock Frequency | 150 MHz; enables 6.67 ns cycle time for sustained high-throughput memory access in pipelined systems |
| Clock-to-Data Access | 3.8 ns typical; defines minimum latency from CLK edge to valid Q output in read cycles |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies allow I/O voltage optimization and noise isolation |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in base station and industrial control environments |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus traffic and improves bandwidth efficiency in sequential access patterns |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow profiles and automated optical inspection |
Pinout & Package
71V65603S100PFG8 is packaged in a 100-pin plastic thin quad flatpack (TQFP), JEDEC MO-140AC compliant, with 0.5 mm pitch and exposed thermal pad (PFG suffix). Pin functions are fully defined per Renesas IDT71V65603 datasheet Rev. 6.42.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled |
| CLK | System Clock Input | Rising-edge-triggered master timing reference; all synchronous operations referenced to this edge |
| R/W | Read/Write Control | Synchronous signal determining load-cycle direction; data transfer occurs two cycles later |
| ADV/LD | Burst Address Control | LOW loads external address; HIGH advances internal burst counter-enables seamless burst sequencing |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| CE1, CE2, CE2 | Chip Enables | Three enables (CE1/CE2 active-low, CE2 active-high) for flexible depth expansion and deselect sequencing |
| OE | Output Enable | Asynchronous; tri-states I/Os when HIGH-no timing coordination needed with CLK or R/W |
| ZZ | Sleep Mode Input | Asynchronous; gates internal CLK and reduces power to minimum retention level without losing data |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous data path; registered input and output paths ensure timing predictability |
| VDD, VDDQ, VSS | Power/Ground | Dual 3.3 V supplies (core and I/O) with dedicated ground planes-critical for signal integrity at 150 MHz |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Zero Bus Turnaround | Eliminates dead cycles between consecutive reads/writes-enables continuous 150 MHz bus utilization without turnaround overhead |
| Pipelined Output Registers | Output data is registered on CLK edge, decoupling output timing from internal memory array latency and simplifying system timing closure |
| Internally Synchronized OE | Removes need for external OE timing control-outputs remain valid or tri-state deterministically without clock-domain crossing logic |
| 4-Word Burst with LBO Select | LBO pin selects linear or interleaved burst order, enabling optimal cache-line alignment for DSP and packet-processing engines |
| Individual Byte Write (BW1–BW4) | Enables partial-word updates without read-modify-write cycles-reduces bus traffic and power in mixed-data-width applications |
| Three Chip Enables (CE1/CE2/CE2) | Supports seamless depth expansion across multiple devices using standard logic-level decoding-no additional glue logic required |
Applications
| High-Speed Networking Packet Buffer | Telecom Line Card Memory Subsystem |
|---|---|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: Acts as primary packet buffer memory with deterministic 3.8 ns read access and zero-turnaround write-read transitions. Use Value: Enables full 150 MHz bus utilization during back-to-back packet processing-reducing average packet delay by up to 30% versus conventional SRAMs. | Use Scenario: Supporting real-time voice/data channel buffering in carrier-grade DSLAMs and OLTs operating at –40°C to +85°C. IC Role / Device Role / Timing Role: Provides industrial-temperature-stable, burst-capable memory for ATM cell and GPON frame assembly/disassembly engines. Use Value: 4-word burst mode cuts address bus cycles by 75% per memory transaction-improving channel density and reducing FPGA logic utilization. |
| Industrial PLC Data Logging Buffer | Medical Imaging Frame Store |
Use Scenario: Capturing high-resolution sensor telemetry (e.g., vibration, temperature) at 10 kHz sampling rates in factory automation controllers. IC Role / Device Role / Timing Role: Serves as high-reliability, low-latency circular buffer with byte-write granularity for efficient metadata tagging. Use Value: Individual BW1–BW4 control allows timestamp+data co-location without full-word overwrites-extending flash endurance by >2× in logging applications. | Use Scenario: Temporary storage of uncompressed 12-bit medical ultrasound or MRI frames (≥2048 × 1536 pixels) prior to compression and transmission. IC Role / Device Role / Timing Role: Functions as low-jitter, pipelined frame buffer synchronized to imaging sensor clock and display refresh engine. Use Value: Pipelined outputs guarantee jitter-free pixel data delivery to DACs-eliminating visible artifacts in diagnostic-grade displays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | 133 MHz max frequency; 256K × 36 organization; 3.3 V core/I/O; no ZBT™ architecture-uses conventional burst with OE control | Lacks zero bus turnaround; requires external OE timing management and incurs 1-cycle dead time between read/write transitions | Select when ZBT™ timing is not required and legacy timing margins permit 133 MHz operation with added OE logic. |
| AS7C33128PFS-15BIN | 150 MHz max frequency; 256K × 36 organization; 3.3 V core/I/O; supports ZBT™ but lacks individual byte write (BWx) pins | No BW1–BW4 support-requires full-word writes or external byte masking logic for partial updates | Choose when burst performance and clock-to-data timing match 71V65603S100PFG8 but byte-granular writes are unnecessary. |
Compared with CY7C1362BV33-133AXC and AS7C33128PFS-15BIN, the 71V65603S100PFG8 uniquely delivers ZBT™ timing *plus* individual byte write control in a single industrial-grade TQFP package-enabling both maximum bus efficiency and fine-grained data update capability without design compromises.
Availability
71V65603S100PFG8 is available at Aetrix Electronics and suitable for high-speed networking packet buffers, telecom line-card memory subsystems, and industrial PLC data logging requiring stable component supply and long-term industrial temperature support.
Supply support for 71V65603S100PFG8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader delivering microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65603S100PFG8 belongs to Renesas' high-speed ZBT™ SRAM product line, engineered specifically for deterministic, low-latency memory subsystems in telecom infrastructure, network processors, and real-time control systems.
FAQ
What is the maximum operating frequency of the 71V65603S100PFG8?
The 71V65603S100PFG8 supports a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock period. This rating is guaranteed across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions, as specified in the Renesas IDT71V65603 datasheet Rev. 6.42. At this speed, the device achieves a 3.8 ns clock-to-data access time for read operations.
Does the 71V65603S100PFG8 support burst read and write operations?
Yes, the 71V65603S100PFG8 supports 4-word burst operations for both reads and writes. Burst sequencing is controlled by the ADV/LD pin (to load address or advance counter) and the LBO pin (to select linear or interleaved order). Burst cycles execute with zero bus turnaround-no dead cycles occur between successive bursts or between read/write transitions-making it ideal for high-throughput streaming applications.
What package type is used for the 71V65603S100PFG8?
The 71V65603S100PFG8 uses a 100-pin plastic thin quad flatpack (TQFP) package, JEDEC MO-140AC compliant, with dimensions of 14 mm × 20 mm and 0.5 mm lead pitch. The "PFG" suffix explicitly denotes this TQFP variant, and the device includes an exposed thermal pad for enhanced heat dissipation in high-frequency operation.
How does the ZBTTM feature improve system performance in the 71V65603S100PFG8?
The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S100PFG8 eliminates dead cycles between consecutive read and write operations. Unlike conventional SRAMs that require bus idle time to change direction, the 71V65603S100PFG8 allows immediate transition-e.g., a write cycle can be followed directly by a read cycle on the next clock edge. This increases effective memory bandwidth by up to 25% in mixed-access workloads common in packet processing and real-time control.
Can the 71V65603S100PFG8 operate in low-power mode, and how is it controlled?
Yes, the 71V65603S100PFG8 supports low-power sleep mode via the asynchronous ZZ input. When ZZ is driven HIGH, the internal clock is gated and the device enters its lowest power-consumption state while maintaining full data retention. Power resumes automatically upon ZZ returning LOW, with no reset or initialization sequence required-enabling rapid wake-up in energy-sensitive applications like remote base stations or portable medical devices.
71V65603S100PFG8 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 100-LQFP
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 100 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 5 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-TQFP (14x20)
71V65603S100PFG8 FAQ
1.How can I place an order for 71V65603S100PFG8 through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S100PFG8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S100PFG8 reliable?
The price and inventory of 71V65603S100PFG8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S100PFG8 is usually 5 days.
3.What payment methods are accepted for 71V65603S100PFG8?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S100PFG8 transactions.
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4.How is shipping managed for 71V65603S100PFG8?
71V65603S100PFG8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65603S100PFG8 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S100PFG8?
For technical support, including 71V65603S100PFG8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S100PFG8 requirements.
6.How does Aetrix verify that 71V65603S100PFG8 is sourced from the original manufacturer or authorized distributors?
All 71V65603S100PFG8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S100PFG8 meets industry standards.
7.What is the process for return or replacement of 71V65603S100PFG8?
All 71V65603S100PFG8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S100PFG8, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S100PFG8 part is unused and in its original packaging.
Return procedure for 71V65603S100PFG8:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S100PFG8 Tags

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M24C02-WMN6TP
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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AT24CS02-SSHM-T
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93LC46BT-I/OT
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AT24C04C-SSHM-T
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