Renesas 71V65603S133BQGI
- Part No.:
- 71V65603S133BQGI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65603S133BQGI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65603S133BQGI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, 133 MHz clock speed (7.5 ns cycle time), zero bus turnaround architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature range (–40°C to +85°C). Used in high-speed packet buffering for network switches and telecom line cards where deterministic latency and bus efficiency are critical.
For engineers reviewing the 71V65603S133BQGI datasheet, 71V65603S133BQGI pinout, 71V65603S133BQGI application, or 71V65603S133BQGI equivalent, this device delivers verified ZBT™ timing behavior, synchronous byte-write control (BW1–BW4), three chip enables for depth expansion, and JEDEC-standard 100-pin TQFP packaging - all validated for real-time memory subsystems requiring sub-8ns access and no dead cycles between read/write transitions.
Technical Context
The 71V65603S133BQGI implements a fully pipelined synchronous interface with address/control registration on the rising CLK edge and data output registration two cycles later. Its ZBT™ architecture eliminates bus turnaround latency by allowing immediate read-after-write or write-after-read transitions without idle cycles.
It integrates an on-chip burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved 4-word burst sequences. Output enable (OE) is asynchronous, while all other inputs - including R/W, CEN, CE1/CE2/CE2, BW1–BW4, and ZZ - are synchronized to CLK, enabling precise timing control in high-frequency systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,437,184 bits); supports full 36-bit word or individual 9-bit byte writes via BW1–BW4. |
| Max Clock Frequency | 133 MHz (7.5 ns cycle time); enables sustained 532 MB/s burst throughput in linear mode. |
| Access Time | 3.8 ns clock-to-data (tCD) at 150 MHz; actual tCD at 133 MHz is ≤4.5 ns - guarantees deterministic read latency for pipeline-aligned designs. |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); separate supplies allow I/O voltage domain isolation in mixed-signal systems. |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for continuous operation in base station and industrial controller environments. |
| Power Management | Asynchronous ZZ input enables sleep mode with guaranteed data retention; reduces active power during idle bursts or system standby. |
| Burst Capability | 4-word burst (interleaved or linear); LBO pin selects sequence order - eliminates external address generation logic in FIFO-like applications. |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, 0.5 mm pitch. Pinout validated per Renesas datasheet revision 6.42 (PKG100 configuration for 256K × 36).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit synchronous address bus; latched on rising CLK when ADV/LD = LOW and chip enabled - defines 256K-word address space. |
| CLK | System Clock Input | Rising-edge-triggered master clock; all synchronous registers (address, control, data I/O) align to this edge - establishes timing reference for entire memory subsystem. |
| R/W | Read/Write Control | Synchronous signal determining cycle type; sampled with ADV/LD and chip enables to initiate load read/write - enables single-control-line bus arbitration. |
| ADV/LD | Burst Counter Control | Loads new external address (LOW) or advances internal burst counter (HIGH); enables seamless burst chaining without CPU intervention. |
| LBO | Burst Order Select | Static input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) burst sequence - matches standard cache line ordering or DSP addressing patterns. |
| BW1–BW4 | Byte Write Enables | Four independent active-low enables for 9-bit bytes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4); allows partial-word updates without read-modify-write overhead. |
| CE1, CE2, CE2 | Chip Enable Inputs | Three synchronous enables (CE1/CE2 active LOW, CE2 active HIGH); support depth expansion with no external logic - simplifies multi-SRAM bank design. |
| OE | Output Enable | Asynchronous; tri-states I/Os immediately when HIGH - permits dynamic bus sharing without clock-domain synchronization. |
| ZZ | Sleep Mode Input | Asynchronous; gates internal CLK and reduces power to minimum retention level - essential for low-power standby in always-on networking equipment. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O Bus | 36-bit bidirectional synchronous bus; registered inputs/outputs eliminate hold-time violations in high-speed PCB layouts. |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Zero Bus Turnaround | Eliminates dead cycles between consecutive read/write operations - increases effective bus utilization by up to 30% in burst-intensive traffic shaping. |
| Internally Synchronized OE | Removes need for external OE timing control - simplifies PCB layout and eliminates race conditions in multi-clock-domain systems. |
| 4-Word Burst Counter | Reduces address bus toggling and controller overhead; LBO-selectable sequence matches industry-standard cache line or DMA transfer patterns. |
| Individual Byte Write (BW1–BW4) | Enables atomic 9-bit updates without full-word read-modify-write - critical for status register updates in real-time control firmware. |
| Three Chip Enables | Supports seamless depth expansion (e.g., 2× 256K×36 → 512K×36) using only native pins - avoids glue logic and saves board space. |
| Industrial Temperature Range | Validated operation from –40°C to +85°C - qualified for deployment in uncontrolled environments like outdoor telecom cabinets and factory automation PLCs. |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in Layer 2/L3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed, low-latency buffer memory interfacing directly to MAC controllers and switch fabric ASICs. Use Value: ZBT™ architecture ensures zero-cycle turnaround between frame header reads and payload writes - enabling wire-speed forwarding at 10 Gbps+. |
Use Scenario: Temporary storage of voice packets and signaling data in VoIP gateways and SDH/SONET add-drop multiplexers. IC Role / Device Role / Timing Role: Synchronous SRAM acting as jitter buffer and call-state memory with deterministic 4.5 ns read access. Use Value: 133 MHz clock and pipelined outputs meet tight jitter tolerance requirements (<100 ns variation) for real-time voice processing. |
| Industrial PLC Data Logging | Radar Signal Processing Buffer |
|
Use Scenario: Capturing sensor timestamps and control loop variables in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Industrial-grade memory storing cyclic process data with guaranteed retention during brownouts via ZZ sleep mode. Use Value: –40°C to +85°C rating and 3.3V dual-supply (VDD/VDDQ) ensure reliable operation alongside isolated I/O modules and noise-prone motor drives. |
Use Scenario: Holding intermediate FFT results and beamforming coefficients in phased-array radar front-ends. IC Role / Device Role / Timing Role: Burst-capable SRAM feeding parallel DSP cores with 4-word interleaved data streams aligned to radar pulse repetition intervals. Use Value: Interleaved burst mode (LBO = HIGH) matches natural FFT output ordering - reducing DMA setup overhead by 75% versus linear addressing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133AXC | Same 256K×36 organization and 133 MHz speed, but uses QDR-II architecture with separate read/write ports - higher peak bandwidth but requires dual-port controller logic. | Preferred in applications needing concurrent read/write (e.g., dual-CPU cache coherency), not ZBT™-style sequential burst optimization. | Select when system architecture mandates true simultaneous access; avoid if existing design relies on ZBT™'s single-bus turnaround behavior. |
| AS7C3256B-133JCIN | 256K×36, 133 MHz, but lacks ZBT™ and burst counter - requires external address sequencing logic and incurs 1-cycle dead time between read/write. | Suitable for cost-sensitive, non-real-time buffering where deterministic zero-turnaround is not required. | Choose for legacy designs migrating from async SRAM; not recommended for new ZBT™-optimized systems due to timing penalty and added logic complexity. |
Compared with CY7C1362BV33-133AXC and AS7C3256B-133JCIN, the 71V65603S133BQGI uniquely delivers verified zero-bus-turnaround timing with integrated burst control - eliminating external sequencers and guaranteeing sub-5ns read latency in pipeline-constrained telecom and industrial control systems.
Availability
71V65603S133BQGI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and industrial PLC data logging requiring stable component supply across extended product lifecycles.
Supply support for 71V65603S133BQGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.
The 71V65603S133BQGI belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-speed networking and real-time control systems demanding deterministic latency, burst efficiency, and industrial reliability.
FAQ
What is the maximum operating frequency and corresponding cycle time for the 71V65603S133BQGI?
The 71V65603S133BQGI is rated for a maximum clock frequency of 133 MHz, corresponding to a 7.5 ns clock cycle time. This specification is guaranteed across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. The device achieves this performance using a high-speed CMOS process and fully registered synchronous interfaces for address, control, and data paths - ensuring timing closure in demanding backplane and switch fabric applications.
How does the ZBT™ feature of the 71V65603S133BQGI eliminate dead cycles between read and write operations?
The ZBT™ (Zero Bus Turnaround) feature in the 71V65603S133BQGI removes idle cycles by allowing immediate transition from a write to a read (or vice versa) within the same bus protocol. Unlike conventional SRAMs that require bus release/reacquisition, the 71V65603S133BQGI uses internal pipelining and synchronized control to assert the next operation's address and R/W state on the subsequent clock edge - verified in Renesas datasheet timing diagrams and functional truth tables for mixed-load/burst sequences.
What are the valid burst modes supported by the 71V65603S133BQGI, and how is burst order selected?
The 71V65603S133BQGI supports 4-word bursts in both linear and interleaved sequences. Burst order is selected via the static LBO (Linear Burst Order) pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH enables interleaved order (A0, A2, A1, A3). This selection is fixed per transaction and must remain stable during burst execution - matching standard cache line or DSP coefficient access patterns without external address generation logic.
Can the 71V65603S133BQGI operate with different supply voltages for core and I/O domains?
Yes, the 71V65603S133BQGI uses separate supply pins: VDD (3.3 V ±5%) powers the core logic and address/control registers, while VDDQ (3.3 V ±5%) powers the 36-bit I/O buffers. This dual-supply architecture allows independent noise filtering and decoupling - critical for maintaining signal integrity in mixed-signal systems where the core may share ground with noisy digital logic while I/O connects to clean SERDES or PHY interfaces.
What is the function of the three chip enable pins (CE1, CE2, CE2) on the 71V65603S133BQGI, and how do they differ?
The 71V65603S133BQGI features three chip enables: CE1 and CE2 are active-low, while CE2 is active-high. All three must be asserted simultaneously (CE1 = LOW, CE2 = LOW, CE2 = HIGH) to select the device. This asymmetric configuration enables flexible depth expansion - for example, using CE2 as a bank-select signal while CE1/CE2 serve as row enables - without requiring external AND/OR logic, reducing BOM count and routing complexity in multi-SRAM systems.
71V65603S133BQGI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65603S133BQGI FAQ
1.How can I place an order for 71V65603S133BQGI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S133BQGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S133BQGI reliable?
The price and inventory of 71V65603S133BQGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S133BQGI is usually 5 days.
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For technical support, including 71V65603S133BQGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S133BQGI requirements.
6.How does Aetrix verify that 71V65603S133BQGI is sourced from the original manufacturer or authorized distributors?
All 71V65603S133BQGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S133BQGI meets industry standards.
7.What is the process for return or replacement of 71V65603S133BQGI?
All 71V65603S133BQGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S133BQGI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S133BQGI part is unused and in its original packaging.
Return procedure for 71V65603S133BQGI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S133BQGI Tags

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M24C02-WMN6TP
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