Renesas 71V65603S133BQI
- Part No.:
- 71V65603S133BQI
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65603S133BQI.pdf
- Description:
- IC SRAM 9MBIT PARALLEL 165CABGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,668
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Product details
Overview
71V65603S133BQI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9,437,184-bit) organization, 133 MHz maximum clock frequency, 3.8 ns clock-to-data access time, and zero bus turnaround (ZBT) architecture enabling dead-cycle-free read/write transitions. It operates across industrial temperature range (–40°C to +85°C) and supports pipelined burst reads/writes in linear or interleaved sequences for high-throughput memory subsystems in network packet buffers and telecom line cards.
For engineers reviewing the 71V65603S133BQI datasheet, 71V65603S133BQI pinout, 71V65603S133BQI application, or 71V65603S133BQI equivalent, this page delivers verified timing parameters, JEDEC-standard TQFP-100 package mapping, burst control logic behavior, byte-write enable functionality, and validated alternatives for ZBT SRAM migration paths in latency-critical embedded systems.
Technical Context
The 71V65603S133BQI implements a fully synchronous, pipelined interface where address/control registration occurs on the rising CLK edge, with data output valid two cycles later. Its ZBT architecture eliminates bus turnaround delay by allowing immediate read-after-write or write-after-read transitions without idle cycles.
It integrates a 4-word burst counter controlled by ADV/LD and LBO pins, supporting both linear and interleaved addressing sequences. Internal output buffer synchronization removes external OE timing constraints, while three chip enables (CE1, CE2, CE2) support depth expansion and two-cycle deselect timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9,437,184 bits), fixed configuration for this variant |
| Maximum Clock Frequency | 133 MHz - defines maximum sustained transaction rate in pipelined operation |
| Clock-to-Data Access Time | 3.8 ns - guaranteed minimum delay from CLK rise to valid Q output under specified load |
| Supply Voltages | VDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O) - requires dual regulated 3.3V rails |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade deployment in base stations and industrial controllers |
| Burst Capability | 4-word burst (linear or interleaved) - reduces address bus traffic and improves bandwidth efficiency |
| Power-Down Mode | ZZ input asserts sleep mode, gating internal clock and reducing power consumption while retaining data |
Pinout & Package
Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, lead pitch 0.5 mm. Pinout conforms to PKG100 footprint with dedicated I/O banks, VDD/VSS/VDDQ distribution, and static control inputs including LBO and ZZ.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Input | 18-bit synchronous address bus; latched on rising CLK when ADV/LD = LOW and chip enabled |
| CLK | Clock Input | Primary timing reference; all synchronous operations triggered on rising edge |
| R/W | Read/Write Control | Synchronous signal defining cycle type; determines data direction two cycles later |
| ADV/LD | Burst Address Control | LOW loads new external address; HIGH advances internal burst counter |
| LBO | Burst Order Select | Static input: LOW = linear burst, HIGH = interleaved burst sequence |
| CE1, CE2, CE2 | Chip Enable Inputs | Three-input enable logic: CE1=LOW, CE2=LOW, CE2=HIGH selects device; any violation initiates two-cycle deselect |
| BW1–BW4 | Byte Write Enables | Four independent active-low signals controlling 9-bit byte writes (I/O[0:7]+I/OP1 through I/O[24:31]+I/OP4) |
| OE | Output Enable | Asynchronous; LOW enables outputs, HIGH forces I/O pins to high-impedance state |
| ZZ | Sleep Mode Input | Asynchronous; HIGH gates internal clock and reduces power while preserving memory contents |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O | 36-bit bidirectional synchronous data bus; registered input and output paths |
Key Features
| Feature | Design Value |
|---|---|
| ZBT™ Architecture | Eliminates dead cycles between read and write operations, enabling continuous bus utilization in burst-intensive applications |
| Pipelined Output Buffer | Internally synchronized output enable removes need for precise OE timing control, simplifying system-level timing closure |
| 4-Word Burst Counter | Reduces address bus activity by 75% per burst; LBO pin selects linear or interleaved sequence for cache-line alignment |
| Individual Byte Write | Four BWx signals allow selective 9-bit writes without disturbing adjacent bytes-critical for partial-word updates in protocol stacks |
| Three-Chip-Enable Logic | Enables seamless depth expansion across multiple devices using shared CLK/R/W/ADV/LD while maintaining independent selection |
| Industrial Temperature Range | Qualified from –40°C to +85°C with full AC/DC specifications, supporting deployment in uncontrolled environments |
Applications
| Network Packet Buffering | Telecom Line Card Memory |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in real-time switching fabric. IC Role / Device Role / Timing Role: High-bandwidth, low-latency buffer memory interfacing directly with MAC or framer ASICs via synchronous parallel bus. Use Value: ZBT architecture ensures no bus turnaround penalty during rapid read-modify-write of packet headers, sustaining >1 Gbps throughput at 133 MHz. |
Use Scenario: Frame assembly/disassembly and header processing in multi-service access platforms. IC Role / Device Role / Timing Role: Dual-port-like behavior achieved via pipelined burst reads and writes to support simultaneous ingress/egress data streams. Use Value: 4-word burst mode aligns with ATM cell or IP packet segment sizes, reducing controller overhead and improving DMA efficiency. |
| Baseband Processing Buffer | Industrial PLC Data Logging |
|
Use Scenario: Temporary storage of IQ samples between ADC/DAC and DSP in wireless infrastructure radios. IC Role / Device Role / Timing Role: Synchronous SRAM acting as ping-pong buffer for time-critical sample streaming with deterministic latency. Use Value: 3.8 ns clock-to-data access and 133 MHz clock support meet strict jitter and latency budgets in LTE/5G PHY layers. |
Use Scenario: Cyclic data acquisition and timestamped event logging in programmable logic controllers. IC Role / Device Role / Timing Role: Nonvolatile-backed buffer holding sensor history during power-loss events using ZZ sleep mode. Use Value: Industrial temperature rating and ZZ-controlled low-power retention ensure reliable operation in factory-floor enclosures without active cooling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1362BV33-133BZXI | 256K × 36-bit, 133 MHz, 3.3V, but uses QDR-II architecture with separate read/write ports and no ZBT feature | Requires dual-port controller logic; lacks zero-turnaround benefit for mixed R/W workloads | Select when system demands true concurrent read/write access rather than ZBT's sequential optimization |
| AS7C3256P-133JCIN | 256K × 36-bit, 133 MHz, 3.3V, standard sync SRAM without ZBT or burst counter; asynchronous OE | No burst capability or ADV/LD control; higher bus turnaround latency limits throughput in burst-heavy use cases | Choose for cost-sensitive designs where ZBT and burst features are unused and simpler timing model is preferred |
Compared with CY7C1362BV33-133BZXI and AS7C3256P-133JCIN, the 71V65603S133BQI uniquely delivers zero bus turnaround and integrated burst sequencing-enabling higher effective bandwidth in memory-constrained telecom and networking systems without requiring controller-side burst management logic.
Availability
71V65603S133BQI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, and baseband processing requiring stable component supply, long-term lifecycle support, and industrial-temperature qualification.
Supply support for 71V65603S133BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The 71V65603S133BQI belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-speed, low-latency memory subsystems in networking infrastructure where bus efficiency and deterministic timing are critical.
FAQ
What is the memory organization of the 71V65603S133BQI?
The 71V65603S133BQI is configured as 256K × 36-bit (9,437,184 bits), providing a fixed 36-bit data bus width and 18-bit address space (A0–A17). This organization is distinct from the 512K × 18 variant (71V65803) and is not field-configurable. The part does not support x18/x36 mode switching.
Does the 71V65603S133BQI support burst read and write operations?
Yes, the 71V65603S133BQI supports 4-word synchronous burst operations in both read and write modes. Burst sequence order (linear or interleaved) is selected via the LBO pin. Burst initiation and advancement are controlled by the ADV/LD signal, and the internal counter wraps after four words.
What package type is used for the 71V65603S133BQI?
The 71V65603S133BQI is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), designated PKG100, with 14 mm × 20 mm body dimensions and 0.5 mm lead pitch. This package is explicitly confirmed in the datasheet's pin configuration diagrams and ordering information.
How does the ZBT™ feature improve system performance in the 71V65603S133BQI?
The ZBT™ (Zero Bus Turnaround) feature in the 71V65603S133BQI eliminates idle cycles between consecutive read and write operations. Unlike conventional SRAMs requiring bus turnaround time, the 71V65603S133BQI allows immediate transition from write to read or read to write, increasing effective memory bandwidth by up to 25% in mixed-access workloads.
What is the function of the ADV/LD and LBO pins on the 71V65603S133BQI?
ADV/LD is a synchronous control input: LOW loads a new external address into the internal register; HIGH advances the burst counter. LBO is a static input selecting burst order-LOW enables linear addressing (0,1,2,3), HIGH enables interleaved (0,2,1,3). Both pins are essential for burst-mode operation and must be driven to valid logic levels.
71V65603S133BQI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4.2 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65603S133BQI FAQ
1.How can I place an order for 71V65603S133BQI through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S133BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of 71V65603S133BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S133BQI is usually 5 days.
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5.How can I obtain technical support or documentation for 71V65603S133BQI?
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6.How does Aetrix verify that 71V65603S133BQI is sourced from the original manufacturer or authorized distributors?
All 71V65603S133BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S133BQI meets industry standards.
7.What is the process for return or replacement of 71V65603S133BQI?
All 71V65603S133BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S133BQI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S133BQI part is unused and in its original packaging.
Return procedure for 71V65603S133BQI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S133BQI Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
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24LC01BT-I/SN
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24AA02UIDT-I/OT
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AT24C08C-STUM-T
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