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Renesas 71V65603S133PFGI

Part No.:
71V65603S133PFGI
Manufacturer:
Renesas
Category:
Memory
Package:
100-LQFP
Datasheet:
Aetrix71V65603S133PFGI.pdf
Description:
IC SRAM 9MBIT PARALLEL 100TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,700

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Product details

Overview

71V65603S133PFGI from Renesas Electronics is a 3.3V, 9-Mbit synchronous ZBT™ SRAM with 256K × 36 organization, 133 MHz operation (7.5 ns clock-to-data access), zero bus turnaround (ZBT) architecture, and pipelined outputs. It supports interleaved/linear 4-word burst reads/writes and operates across industrial temperature (–40°C to +85°C) in a 100-pin TQFP package - used in high-speed network packet buffers and FPGA co-processor memory subsystems.

For engineers reviewing the 71V65603S133PFGI datasheet, 71V65603S133PFGI pinout, 71V65603S133PFGI application, or 71V65603S133PFGI equivalent, key selection criteria include ZBT timing compliance, 3.3V I/O compatibility, byte-write granularity (BW1–BW4), burst counter control (ADV/LD, LBO), and industrial-grade thermal stability without external OE management.

Technical Context

The 71V65603S133PFGI implements a fully synchronous, clock-edge-triggered interface where address/control registration occurs on CLK rising edge, with data output valid two cycles later. Its ZBT architecture eliminates dead cycles between read/write transitions by decoupling bus direction control from internal timing.

It integrates a synchronous burst counter, linear/interleaved burst sequencing via static LBO input, and individual byte write enables (BW1–BW4) for 9-bit subword writes. Chip enable logic uses three inputs (CE1, CE2, CE2) with active-low/high mixed polarity for flexible depth expansion and two-cycle tri-state output disable.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36 bits (9,437,184-bit capacity); supports high-bandwidth 36-bit data path in networking and DSP applications.
Max Clock Frequency133 MHz (tCYC = 7.5 ns); enables sustained 532 MB/s burst throughput with pipelined read/write cycles.
Access Time7.5 ns clock-to-data (tCD); guarantees deterministic latency for real-time buffer interfaces without wait states.
ZBT FeatureZero Bus Turnaround: eliminates idle cycles between consecutive read/write operations, improving bus utilization in burst-intensive systems.
Supply VoltageVDD = 3.3 V ±5%, VDDQ = 3.3 V ±5%; dual-rail I/O/core supply ensures signal integrity and noise isolation in mixed-signal designs.
Operating Temperature–40°C to +85°C (industrial grade); validated for deployment in telecom infrastructure and industrial controllers without derating.
Burst Capability4-word linear or interleaved burst (controlled by LBO); reduces address overhead and simplifies controller logic in streaming applications.

Pinout & Package

Packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pinout conforms to PKG100 configuration for 256K × 36 mode.

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address Inputs18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled.
CLKSystem Clock InputRising-edge-triggered master timing reference; all synchronous registers (address, control, data) align to this edge.
R/WRead/Write ControlSynchronous command signal defining cycle type; determines whether subsequent data transfer is read or write.
ADV/LDBurst Counter ControlLoads new external address (LOW) or increments internal burst counter (HIGH); enables burst chaining without reissuing full address.
LBOBurst Order SelectStatic input selecting linear (LBO = LOW) or interleaved (LBO = HIGH) 4-word burst sequence per memory access.
BW1–BW4Byte Write EnablesFour independent 9-bit byte write controls; allows partial-word writes without masking logic in controller firmware.
CE1, CE2, CE2Chip Enable InputsThree-input enable scheme (CE1/CE2 active-low, CE2 active-high) supporting multi-chip depth expansion with no external gating.
OEOutput EnableAsynchronous, active-low output driver control; can be tied LOW permanently since ZBT eliminates need for precise OE timing.
ZZDeep Sleep ModeAsynchronous power-down input; gates internal CLK and reduces ICC to <10 µA while retaining data in standby.
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous data path; registered inputs/outputs eliminate external latch requirements and simplify timing closure.

Key Features

FeatureDesign Value
ZBTTM ArchitectureEliminates bus turnaround dead cycles between read/write transitions, enabling continuous 100% bus utilization in burst-mode traffic.
Pipelined OutputsInternally synchronized output register removes need for external OE timing control and simplifies PCB layout with fixed 2-cycle output latency.
4-Word Burst CounterOn-chip counter generates sequential addresses for four consecutive words using single ADV/LD assertion - cuts address bus activity by 75% per burst.
Individual Byte WriteFour dedicated BWx pins enable selective 9-bit subword writes, reducing bus contention and eliminating software byte-mask overhead in embedded systems.
Three-Chip-Enable LogicCE1 (active-low), CE2 (active-low), CE2 (active-high) allow seamless depth expansion across multiple devices without external decode logic.

Applications

Network Packet BufferFPGA Co-Processor Memory

Use Scenario: Storing incoming/outgoing Ethernet frames in Layer 2/3 switches with line-rate forwarding.

IC Role / Device Role / Timing Role: High-throughput, low-latency buffer memory interfacing directly to MAC controller or switch fabric ASIC.

Use Value: ZBT architecture enables back-to-back read/write bursts during frame header inspection and payload rewrite, sustaining 532 MB/s throughput at 133 MHz.

Use Scenario: Offloading compute-intensive tasks (e.g., FFT, filtering) from host CPU to FPGA-accelerated datapath.

IC Role / Device Role / Timing Role: Dual-port-capable SRAM acting as scratchpad memory for FPGA logic blocks requiring deterministic 7.5 ns access.

Use Value: Pipelined outputs and synchronous burst capability reduce FPGA control logic complexity and meet tight timing budgets in 10+ Gbps signal processing pipelines.

Industrial PLC Data LogTelecom Baseband Processing

Use Scenario: Capturing sensor telemetry and control state history in programmable logic controllers operating in harsh environments.

IC Role / Device Role / Timing Role: Nonvolatile-buffered memory subsystem storing time-stamped process variables with industrial temperature resilience.

Use Value: –40°C to +85°C rating and ZZ sleep mode support extended battery-backed logging during brownouts or maintenance windows.

Use Scenario: Real-time channel equalization and modulation/demodulation in 4G/5G baseband units.

IC Role / Device Role / Timing Role: Low-jitter, deterministic-access memory feeding parallel DSP engines in multi-carrier OFDM processing chains.

Use Value: 133 MHz clock rate and 4-word burst mode match symbol-rate timing constraints, minimizing pipeline stalls in LTE-A carrier aggregation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-133AXCSame 256K × 36 organization, 133 MHz, but uses QDR-II architecture with separate read/write ports and differential clocks.Requires dual-clock routing and lacks ZBT burst chaining; better suited for true simultaneous read/write workloads.Select only if application demands concurrent access - not drop-in compatible due to different timing model and pinout.
AS7C3256A-133JCIN256K × 32 organization, 133 MHz, standard sync SRAM (no ZBT or burst counter); supports BYTE# instead of BWx.No zero-turnaround or burst addressing; requires full address reissue per word and external OE control.Choose for cost-sensitive designs where ZBT and burst features are unnecessary and 4-bit width reduction is acceptable.

Compared with CY7C1362BV33-133AXC and AS7C3256A-133JCIN, the 71V65603S133PFGI uniquely delivers zero-bus-turnaround timing and integrated burst sequencing - critical for maximizing bandwidth efficiency in burst-dominant packet buffering and streaming applications without added controller overhead.

Availability

71V65603S133PFGI is available at Aetrix Electronics and suitable for network packet buffers, FPGA co-processor memory, and industrial PLC data log applications requiring stable component supply, long-term lifecycle support, and industrial-temperature reliability.

Supply support for 71V65603S133PFGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power management, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65603S133PFGI belongs to Renesas' ZBT™ SRAM product line, engineered specifically for high-speed, low-latency buffer applications in networking equipment, base stations, and real-time embedded systems demanding deterministic timing and zero bus turnaround.

FAQ

What is the memory organization and total capacity of the 71V65603S133PFGI?

The 71V65603S133PFGI is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9 Megabits). This configuration provides a 36-bit wide data bus optimized for high-throughput applications such as network packet buffering and FPGA-based accelerators where wide-word parallel access improves system bandwidth efficiency.

Does the 71V65603S133PFGI support burst read and write operations, and how is burst order controlled?

Yes, the 71V65603S133PFGI supports 4-word burst reads and writes using its on-chip burst counter. Burst order is selected via the LBO (Linear/Interleaved Burst Order) pin: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH selects interleaved order (A0, A2, A1, A3). The ADV/LD pin controls counter advancement or new address loading, enabling efficient burst chaining without external address generation.

How does the ZBTTM feature improve system performance in the 71V65603S133PFGI?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S133PFGI eliminates idle cycles between consecutive read and write operations by decoupling bus direction control from internal timing. This allows immediate transition from write to read (or vice versa) without waiting for bus stabilization, increasing effective memory bandwidth by up to 30% in burst-intensive applications like packet switching and real-time signal processing.

What are the voltage and temperature specifications for reliable operation of the 71V65603S133PFGI?

The 71V65603S133PFGI operates with VDD and VDDQ at 3.3 V ±5% and is rated for industrial temperature range (–40°C to +85°C). Its absolute maximum ratings include terminal voltages from –0.5 V to VDDQ +0.5 V and power dissipation up to 2.0 W. These specs ensure robust operation in telecom infrastructure, industrial automation, and outdoor base station environments without thermal derating.

Can the 71V65603S133PFGI be placed into low-power sleep mode, and how is it activated?

Yes, the 71V65603S133PFGI supports deep sleep mode via the asynchronous ZZ input. When ZZ is driven HIGH, the internal clock is gated and core power consumption drops to less than 10 µA while retaining memory contents. This mode is ideal for power-constrained applications such as battery-backed data loggers or energy-efficient network edge devices requiring rapid wake-up (<100 ns) without data loss.

71V65603S133PFGI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
100-LQFP
Packaging:
Tube
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4.2 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14x14)

71V65603S133PFGI FAQ

1.How can I place an order for 71V65603S133PFGI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65603S133PFGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65603S133PFGI reliable?

The price and inventory of 71V65603S133PFGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S133PFGI is usually 5 days.

3.What payment methods are accepted for 71V65603S133PFGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S133PFGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65603S133PFGI?

71V65603S133PFGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65603S133PFGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65603S133PFGI?

For technical support, including 71V65603S133PFGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S133PFGI requirements.

6.How does Aetrix verify that 71V65603S133PFGI is sourced from the original manufacturer or authorized distributors?

All 71V65603S133PFGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S133PFGI meets industry standards.

7.What is the process for return or replacement of 71V65603S133PFGI?

All 71V65603S133PFGI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S133PFGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65603S133PFGI part is unused and in its original packaging.

Return procedure for 71V65603S133PFGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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