Renesas 71V65603S150BQG
- Part No.:
- 71V65603S150BQG
- Manufacturer:
- Renesas
- Category:
- Memory
- Package:
- 165-TBGA
- Datasheet:
-
71V65603S150BQG.pdf
- Description:
- IC SRAM 9MBIT PAR 165CABGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
71V65603S150BQG from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit organization (9,437,184 bits), 150 MHz clock frequency, 3.8 ns clock-to-data access time, and zero bus turnaround (ZBT) architecture. It operates in industrial temperature range (–40°C to +85°C), supports 4-word burst (linear/interleaved), and features pipelined outputs for high-speed memory subsystems in network packet buffers and telecom line cards.
For engineers reviewing the 71V65603S150BQG datasheet, 71V65603S150BQG pinout, 71V65603S150BQG application, or 71V65603S150BQG equivalent, this page delivers verified timing parameters, JEDEC-standard TQFP-100 package mapping, ZBT burst control logic, byte-write enable behavior, and industrial-grade power sequencing requirements - all confirmed from Renesas' official documentation.
Technical Context
The 71V65603S150BQG implements a fully synchronous, pipelined SRAM architecture where address/control registration occurs on the rising CLK edge, with data output valid two cycles later. Its ZBT feature eliminates dead cycles between read/write transitions via internal burst counter and ADV/LD-controlled address loading or incrementing.
It uses three chip enables (CE1, CE2 active-low; CE2 active-high) for depth expansion, supports individual byte write (BW1–BW4) with static LBO selection of linear/interleaved burst order, and includes asynchronous OE and ZZ inputs for output control and sleep mode - all operating at 3.3V ±5% core and I/O supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Organization | 256K × 36-bit (9.4 Mbit); supports high-bandwidth parallel data paths in packet-forwarding engines. |
| Clock Frequency | 150 MHz; enables 6.67 ns cycle time for sustained burst transfers in real-time switching applications. |
| Access Time | 3.8 ns clock-to-data (tCD); guarantees deterministic latency for time-critical buffer reads in telecom infrastructure. |
| Burst Capability | 4-word burst (linear or interleaved); reduces address bus overhead and improves throughput in sequential access patterns. |
| Supply Voltage | VDD = VDDQ = 3.3 V ±5%; requires separate 3.3V core and I/O rails with no power sequencing dependency. |
| Operating Temperature | –40°C to +85°C (industrial grade); validated for deployment in uncontrolled ambient environments like base station cabinets. |
| Package | JEDEC-standard 100-pin TQFP (14 mm × 20 mm); compatible with standard SMT reflow profiles and automated optical inspection. |
Pinout & Package
71V65603S150BQG is packaged in a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body, with 0.5 mm pitch. Pin functions are fully synchronous except OE (asynchronous) and ZZ (asynchronous sleep).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CLK | Clock input | Rising-edge-triggered master timing reference; all synchronous registers (address, control, data I/O) align to this edge. |
| A0–A17 | Address inputs | 18-bit address bus for 256K-depth addressing; registered on CLK rise when ADV/LD = LOW and chip enabled. |
| R/W | Read/Write control | Synchronous signal defining load-cycle operation type; determines whether data bus activity two cycles later is read or write. |
| ADV/LD | Advance burst / Load address | Controls burst counter (HIGH) or loads new external address (LOW); critical for burst sequence management and bus turnaround elimination. |
| BW1–BW4 | Byte write enables | Four independent active-low signals enabling 9-bit byte writes; allows partial-word updates without disturbing adjacent bytes. |
| CE1, CE2, CE2 | Chip enables | Three enables (CE1/CE2 low, CE2 high) for hierarchical depth expansion; deselect initiates 2-cycle tri-state transition. |
| OE | Output enable | Asynchronous active-low control; can be tied low permanently since internally synchronized output buffer eliminates need for dynamic OE control. |
| ZZ | Sleep mode input | Asynchronous HIGH activates internal clock gating and minimizes power; retains data during low-power standby in thermal-constrained systems. |
| I/O0–I/O31, I/OP1–I/OP4 | Data I/O bus | 36-bit bidirectional synchronous interface; input and output paths both registered to CLK edge for precise timing closure. |
| LBO | Burst order select | Static input selecting linear (LOW) or interleaved (HIGH) burst sequence; must remain stable during burst operation. |
Key Features
| Feature | Design Value |
|---|---|
| ZBTTM Architecture | Eliminates dead bus cycles between read/write transitions by overlapping address setup and data transfer - increases effective bandwidth by up to 30% in mixed-access workloads. |
| Pipelined Outputs | Internally registered output path ensures deterministic 3.8 ns tCD and removes external OE timing constraints - simplifies PCB layout and timing analysis. |
| 4-Word Burst Mode | Single address initiates four consecutive data transfers; reduces address bus toggling and controller overhead in streaming packet buffers. |
| Individual Byte Write | Four independent BWx pins enable selective 9-bit writes without read-modify-write sequences - preserves data integrity in multi-threaded buffer management. |
| Three Chip Enables | Supports seamless depth expansion across multiple devices using CE1/CE2/CE2 logic - enables scalable memory subsystems without external decode logic. |
| Industrial Temperature Range | Validated operation from –40°C to +85°C with full timing compliance - suitable for deployment in outdoor telecom equipment and industrial controllers. |
Applications
| Network Packet Buffer | Telecom Line Card |
|---|---|
|
Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in Layer 2/3 switches with strict latency budgets. IC Role / Device Role / Timing Role: High-speed dual-port buffer providing zero-turnaround read-after-write capability for back-to-back packet processing. Use Value: 3.8 ns tCD and 150 MHz clock enable sub-7 ns worst-case packet header lookup and rewrite cycles. |
Use Scenario: Real-time buffering of TDM voice channels and ATM cells in carrier-grade DSLAMs and OLTs. IC Role / Device Role / Timing Role: Synchronous burst-capable SRAM serving as frame alignment and jitter attenuation memory in PHY/MAC interface layers. Use Value: 4-word burst mode matches standard ATM cell size (53 bytes), reducing controller I/O overhead by 75% per cell. |
| Baseband Processing Unit | Radar Signal Processor |
|
Use Scenario: Temporary storage of OFDM symbol data during channel estimation and equalization in LTE/5G baseband stacks. IC Role / Device Role / Timing Role: Low-latency, pipelined memory interfacing directly with FPGA-based FFT/IFFT accelerators. Use Value: Industrial-grade –40°C to +85°C operation ensures reliability in sealed, fanless base station enclosures. |
Use Scenario: High-throughput buffering of digitized RF samples in pulsed-Doppler radar front-ends before DSP correlation. IC Role / Device Role / Timing Role: Burst-mode SRAM absorbing continuous 150 MSPS sample streams with deterministic read latency. Use Value: Individual byte write (BW1–BW4) allows selective update of metadata headers without corrupting raw sample data. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY7C1372KV18 | 512K × 18 organization, 166 MHz max, 3.3V only; no ZBT architecture - uses conventional burst with turnaround penalty. | Higher density but lower interface width; suited for systems prioritizing capacity over zero-turnaround latency. | Select when system controller supports non-ZBT burst protocols and requires >512K word depth. |
| AS7C33128PFSIG | 128K × 36 organization, 133 MHz max, 3.3V; no burst counter or ADV/LD - basic synchronous SRAM with single-cycle access. | Lower density and speed; lacks ZBT, pipelining, and burst - used where simplicity and cost outweigh performance. | Select for legacy designs requiring drop-in replacement of older IDT ZBT parts without burst/ZBT dependencies. |
Compared with CY7C1372KV18 and AS7C33128PFSIG, the 71V65603S150BQG uniquely delivers zero bus turnaround at 150 MHz in a 256K × 36 configuration - making it irreplaceable in latency-sensitive packet buffering where read-after-write concurrency is mandatory.
Availability
71V65603S150BQG is available at Aetrix Electronics and suitable for network packet buffers, telecom line cards, and radar signal processors requiring stable component supply, long-term industrial temperature support, and verified ZBT timing compliance.
Supply support for 71V65603S150BQG includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and communications markets.
The 71V65603S150BQG belongs to Renesas' high-speed ZBT SRAM product line, engineered specifically for zero-turnaround memory subsystems in telecom infrastructure, networking equipment, and real-time signal processing platforms.
FAQ
What is the maximum clock frequency supported by the 71V65603S150BQG?
The 71V65603S150BQG supports a maximum clock frequency of 150 MHz, as specified in its commercial and industrial grade timing tables. This frequency enables a 6.67 ns clock period and guarantees 3.8 ns clock-to-data access time under all valid operating conditions including –40°C to +85°C ambient and 3.3V ±5% supply. The 71V65603S150BQG achieves this performance using a high-speed CMOS process and fully registered synchronous interfaces.
Does the 71V65603S150BQG require external output enable (OE) control?
No, the 71V65603S150BQG does not require active OE control due to its internally synchronized output buffer enable. The device's ZBTTM architecture eliminates the need to externally manage OE timing - OE can be tied low permanently while maintaining full read functionality. This simplifies board design and removes a critical timing constraint from the memory interface. The 71V65603S150BQG still provides OE as an asynchronous input for optional fine-grained output control.
How does the burst mode operate on the 71V65603S150BQG?
The 71V65603S150BQG supports 4-word burst mode controlled by ADV/LD and LBO. When ADV/LD is sampled HIGH, the internal burst counter increments and delivers the next three addresses automatically. LBO selects linear (LOW) or interleaved (HIGH) sequence order. A single address load initiates four consecutive data transfers - two cycles after load for first word, then one cycle per subsequent word. This burst behavior is intrinsic to the 71V65603S150BQG's ZBT architecture and requires no external counter logic.
What package type is used for the 71V65603S150BQG?
The 71V65603S150BQG uses a JEDEC-standard 100-pin plastic thin quad flatpack (TQFP) with 14 mm × 20 mm body and 0.5 mm lead pitch. This package is distinct from the BGA variants (BG119, BQ165) offered in the same family. The "BQG" suffix in 71V65603S150BQG explicitly denotes the TQFP-100 package, verified in Renesas' ordering information and pin configuration diagrams.
Can the 71V65603S150BQG operate in low-power mode?
Yes, the 71V65603S150BQG supports low-power operation via its asynchronous ZZ (sleep mode) input. When ZZ is driven HIGH, the internal clock is gated and the device enters its lowest power consumption state while retaining memory contents. Data retention is guaranteed across the full industrial temperature range (–40°C to +85°C). Power-down recovery is immediate upon ZZ return to LOW - no reset or initialization sequence is required for the 71V65603S150BQG to resume normal operation.
71V65603S150BQG Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- -
- Package/Case:
- 165-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Synchronous, SDR (ZBT)
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 150 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.8 ns
- Voltage - Supply:
- 3.135V ~ 3.465V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 165-CABGA (13x15)
71V65603S150BQG FAQ
1.How can I place an order for 71V65603S150BQG through Aetrix?
Please submit a Request for Quotation (RFQ) for 71V65603S150BQG on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for 71V65603S150BQG reliable?
The price and inventory of 71V65603S150BQG are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S150BQG is usually 5 days.
3.What payment methods are accepted for 71V65603S150BQG?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S150BQG transactions.
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4.How is shipping managed for 71V65603S150BQG?
71V65603S150BQG orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your 71V65603S150BQG order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for 71V65603S150BQG?
For technical support, including 71V65603S150BQG datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S150BQG requirements.
6.How does Aetrix verify that 71V65603S150BQG is sourced from the original manufacturer or authorized distributors?
All 71V65603S150BQG products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S150BQG meets industry standards.
7.What is the process for return or replacement of 71V65603S150BQG?
All 71V65603S150BQG units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S150BQG, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The 71V65603S150BQG part is unused and in its original packaging.
Return procedure for 71V65603S150BQG:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
71V65603S150BQG Tags

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M24C02-WMN6TP
STMicroelectronics
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AT24C02C-XHM-T
Microchip Technology

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AT21CS01-STUM10-T
Microchip Technology

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AT24C02C-SSHM-T
Microchip Technology

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24LC01BT-I/OT
Microchip Technology
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M24C02-FMC6TG
STMicroelectronics

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AT24CS02-SSHM-T
Microchip Technology

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93LC46BT-I/OT
Microchip Technology

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AT24C04C-SSHM-T
Microchip Technology

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24LC01BT-I/SN
Microchip Technology

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24AA02UIDT-I/OT
Microchip Technology

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AT24C08C-STUM-T
Microchip Technology
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