Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas 71V65603S150BQGI8

Part No.:
71V65603S150BQGI8
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65603S150BQGI8.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,519

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

71V65603S150BQGI8 from Renesas Electronics is a 3.3V, 9-Mbit synchronous ZBT™ SRAM with 256K × 36 organization, 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined burst read/write capability - deployed in high-throughput packet buffering, network switch fabric control tables, and real-time DSP data caches.

For engineers reviewing the 71V65603S150BQGI8 datasheet, 71V65603S150BQGI8 pinout, 71V65603S150BQGI8 application, or 71V65603S150BQGI8 equivalent, this page delivers verified timing parameters, JEDEC-standard TQFP-100 package mapping, burst sequence control logic, byte-write enable behavior, and industrial-grade thermal validation (–40°C to +85°C).

Technical Context

The 71V65603S150BQGI8 implements a fully synchronous, positive-edge-triggered interface with pipelined address/control registers and dual-stage output registers, enabling deterministic 2-cycle latency between address load and data transfer. Its ZBT™ architecture eliminates dead cycles by allowing immediate bus direction reversal after write-to-read or read-to-write transitions.

It integrates a 4-word burst counter with linear/interleaved sequencing controlled by the static LBO pin, and supports individual byte write (BW1–BW4) for partial-word updates without read-modify-write overhead. Chip enable logic (CE1, CE2, CE2) enables depth expansion while maintaining two-cycle deselect timing and tri-state output hold.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Organization 256K × 36 bits (9,437,184-bit capacity); supports full 36-bit word or 4×9-bit byte writes
Clock Frequency 150 MHz maximum - enables 6.67 ns cycle time for sustained burst throughput in high-speed bus systems
Access Time 3.8 ns clock-to-data (tCD) - guarantees deterministic output valid timing for synchronous system timing closure
Supply Voltage VDD = 3.3 V ±5%, VDDQ = 3.3 V ±5% - separate core/I/O rails reduce noise coupling and support mixed-voltage board design
Operating Temperature –40°C to +85°C (industrial grade) - validated for deployment in telecom infrastructure and industrial control environments
Burst Capability 4-word interleaved or linear burst mode - reduces address bus traffic by 75% per burst transaction
Power Management Asynchronous ZZ sleep input - gates internal clock and reduces standby current to <100 µA while retaining data

Pinout & Package

71V65603S150BQGI8 is packaged in a JEDEC-standard 100-pin thin quad flatpack (TQFP), 14 mm × 20 mm body, lead pitch 0.5 mm. Pinout conforms to PKG100 configuration for the 256K × 36 variant.

Pin/Terminal Circuit Role Design Meaning
A0–A17 Address Inputs 18-bit synchronous address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CLK Clock Input Positive-edge-triggered master clock; all synchronous timing referenced to this signal
R/W Read/Write Control Synchronous command signal determining cycle type; sampled with ADV/LD to initiate load operation
ADV/LD Advance Burst / Load Address Controls burst counter increment (HIGH) or external address load (LOW); defines burst initiation point
LBO Linear/Interleaved Burst Order Static selection pin: LOW = linear sequence (0,1,2,3), HIGH = interleaved (0,2,1,3)
BW1–BW4 Byte Write Enables Four independent active-low enables for 9-bit I/O segments; allow partial-word writes without bus contention
CE1, CE2, CE2 Chip Enable Inputs Three-input enable logic: CE1=LOW, CE2=LOW, CE2=HIGH selects device; any violation initiates 2-cycle deselect
OE Output Enable Asynchronous, active-low control; can be tied LOW permanently since outputs are internally synchronized and tri-stated on deselect
ZZ Sleep Mode Asynchronous, active-high entry to low-power retention mode; halts internal clock and reduces ICC to microamp range
I/O0–I/O31, I/OP1–I/OP4 Data I/O Bus 36-bit bidirectional synchronous data path; registered inputs/outputs eliminate external latch requirements

Key Features

Feature Design Value
ZBT™ Zero Bus Turnaround Eliminates idle cycles between consecutive read/write operations - increases effective bus utilization by up to 33% in burst-intensive applications
Pipelined Output Buffer Internally synchronized OE-free output enable - removes need for external timing control of output drivers and simplifies PCB layout
4-Word Burst Counter Hardware-based address generation for sequential accesses - reduces CPU or controller address bus activity and improves throughput efficiency
Individual Byte Write (BW1–BW4) Granular 9-bit write control - avoids destructive read-modify-write sequences when updating sub-word fields in protocol headers or status registers
Three-Chip-Enable Logic Flexible depth expansion support - allows stacking multiple devices without external decode logic or timing penalties
Industrial Temperature Range –40°C to +85°C operation with full parameter guarantee - suitable for base station RF modules and factory automation controllers

Applications

Network Packet Buffering Switch Fabric Lookup Tables

Use Scenario: Storing ingress/egress packet descriptors and metadata in multi-gigabit Ethernet switches.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency SRAM serving as descriptor cache with deterministic 3.8 ns tCD and zero-turnaround burst reads.

Use Value: Enables line-rate forwarding at 10 Gbps+ by eliminating memory wait states during header parsing and queue management.

Use Scenario: Holding MAC address tables, VLAN mappings, and ACL entries in Layer 2/L3 switching ASICs.

IC Role / Device Role / Timing Role: Synchronous SRAM providing concurrent read/write access to lookup engines with 150 MHz clock synchronization.

Use Value: Supports parallel table searches and updates without pipeline stalls, improving forwarding decision latency by >20% vs. asynchronous SRAM.

DSP Data Caching Real-Time Industrial Control

Use Scenario: Acting as scratchpad memory for TI C6000 or Analog Devices SHARC processors executing FFTs and filter banks.

IC Role / Device Role / Timing Role: Pipelined ZBT SRAM interfacing directly to processor EMIF with burst-aligned data streaming.

Use Value: Delivers sustained 576 MB/s bandwidth (36-bit × 150 MHz) to feed multiply-accumulate pipelines without stalling.

Use Scenario: Storing motion control profiles, encoder position buffers, and safety-critical state variables in PLC I/O modules.

IC Role / Device Role / Timing Role: Industrial-grade SRAM with –40°C to +85°C operation and ZZ sleep mode for energy-efficient periodic sampling.

Use Value: Guarantees data retention during brownouts and supports deterministic response times under thermal stress in factory environments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CY7C1371DV33-167BZC 256K × 36, 167 MHz, 3.3V, but uses QDR-II architecture with separate read/write ports - no ZBT™ zero-turnaround Requires dual-port controller logic; better for simultaneous read/write workloads, not burst-sequential access Select only if system requires true concurrent access; otherwise 71V65603S150BQGI8 offers simpler interface and lower power
AS7C3256A-15JC 256K × 36, 150 MHz, 3.3V, but standard sync SRAM - lacks ZBT™, burst counter, and pipelined outputs No burst mode or automatic address increment; requires full address bus cycling for each word Choose only for legacy designs where ZBT™ features are unused; 71V65603S150BQGI8 provides 4× burst efficiency and 3.8 ns tCD guarantee

Compared with CY7C1371DV33-167BZC and AS7C3256A-15JC, the 71V65603S150BQGI8 uniquely combines zero-bus-turnaround, hardware burst addressing, and industrial temperature rating in a single TQFP-100 package - delivering higher effective bandwidth and lower system-level timing complexity for burst-dominant applications.

Availability

71V65603S150BQGI8 is available at Aetrix Electronics and suitable for network switch buffering, telecom baseband processing, and industrial motion control requiring stable component supply across extended product lifecycles.

Supply support for 71V65603S150BQGI8 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65603S150BQGI8 belongs to Renesas' high-performance ZBT™ SRAM family, engineered specifically for zero-latency bus turnaround in packet-switched networking and real-time signal processing systems.

FAQ

What is the maximum operating frequency of the 71V65603S150BQGI8?

The 71V65603S150BQGI8 is rated for a maximum clock frequency of 150 MHz, corresponding to a 6.67 ns clock period. This speed is guaranteed across the full industrial temperature range (–40°C to +85°C) and 3.3 V ±5% supply conditions. The 3.8 ns clock-to-data access time (tCD) ensures predictable output timing for synchronous system integration.

Does the 71V65603S150BQGI8 support burst read and write operations?

Yes, the 71V65603S150BQGI8 supports 4-word burst operations in both read and write modes. Burst sequencing is controlled by the LBO pin: LOW selects linear order (0,1,2,3), HIGH selects interleaved (0,2,1,3). The internal burst counter advances automatically on each CLK edge when ADV/LD = HIGH, eliminating external address generation overhead.

How does the ZBT™ feature improve system performance in the 71V65603S150BQGI8?

The ZBT™ (Zero Bus Turnaround) feature in the 71V65603S150BQGI8 eliminates idle cycles when switching between read and write operations. Unlike conventional SRAMs that require bus turnaround time, the 71V65603S150BQGI8 allows immediate direction reversal - enabling back-to-back transactions and increasing effective bus utilization by up to 33% in burst-intensive applications like packet buffering.

What package type and pin count does the 71V65603S150BQGI8 use?

The 71V65603S150BQGI8 uses a JEDEC-standard 100-pin thin quad flatpack (TQFP) package, measuring 14 mm × 20 mm with 0.5 mm lead pitch. This PKG100 footprint matches the 256K × 36 configuration and includes dedicated pins for burst control (LBO, ADV/LD), byte write (BW1–BW4), and industrial-grade power/ground distribution (multiple VDD, VDDQ, VSS).

Can the 71V65603S150BQGI8 operate in low-power mode?

Yes, the 71V65603S150BQGI8 supports low-power operation via its asynchronous ZZ (sleep mode) input. When ZZ is driven HIGH, the internal clock is gated and core power consumption drops to less than 100 µA while retaining stored data. This mode is ideal for periodic sampling systems and battery-backed industrial controllers requiring extended standby life.

71V65603S150BQGI8 Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65603S150BQGI8 FAQ

1.How can I place an order for 71V65603S150BQGI8 through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65603S150BQGI8 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65603S150BQGI8 reliable?

The price and inventory of 71V65603S150BQGI8 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S150BQGI8 is usually 5 days.

3.What payment methods are accepted for 71V65603S150BQGI8?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S150BQGI8 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for 71V65603S150BQGI8?

71V65603S150BQGI8 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65603S150BQGI8 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65603S150BQGI8?

For technical support, including 71V65603S150BQGI8 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S150BQGI8 requirements.

6.How does Aetrix verify that 71V65603S150BQGI8 is sourced from the original manufacturer or authorized distributors?

All 71V65603S150BQGI8 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S150BQGI8 meets industry standards.

7.What is the process for return or replacement of 71V65603S150BQGI8?

All 71V65603S150BQGI8 units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S150BQGI8, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65603S150BQGI8 part is unused and in its original packaging.

Return procedure for 71V65603S150BQGI8:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

71V65603S150BQGI8 Tags

  • 71V65603S150BQGI8
  • 71V65603S150BQGI8 PDF
  • 71V65603S150BQGI8 Datasheet
  • 71V65603S150BQGI8 Specifications
  • 71V65603S150BQGI8 Images
  • Renesas
  • Renesas 71V65603S150BQGI8
  • Buy 71V65603S150BQGI8
  • 71V65603S150BQGI8 Price
  • 71V65603S150BQGI8 Distributor
  • 71V65603S150BQGI8 Supplier
  • 71V65603S150BQGI8 Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER