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Renesas 71V65603S150BQI

Part No.:
71V65603S150BQI
Manufacturer:
Renesas
Category:
Memory
Package:
165-TBGA
Datasheet:
Aetrix71V65603S150BQI.pdf
Description:
IC SRAM 9MBIT PAR 165CABGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,338

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Product details

Overview

71V65603S150BQI from Renesas Electronics is a 3.3V synchronous ZBT™ SRAM with 256K × 36-bit (9.44 Mbit) organization, 150 MHz clock speed (3.8 ns clock-to-data access), zero bus turnaround architecture, and pipelined burst outputs. It supports interleaved/linear 4-word bursts, individual byte write control (BW1–BW4), and operates across –40°C to +85°C for industrial embedded systems requiring high-throughput memory buffering in network switches and packet processors.

For engineers reviewing the 71V65603S150BQI datasheet, 71V65603S150BQI pinout, 71V65603S150BQI application, or 71V65603S150BQI equivalent, key selection criteria include ZBT™ timing compliance, TQFP-100 package compatibility, 3.3V I/O and core supply requirements, burst counter behavior under ADV/LD control, and industrial temperature support without derating.

Technical Context

The 71V65603S150BQI implements a fully synchronous, positive-edge-triggered interface with registered address, data, and control inputs. Its ZBT™ architecture eliminates dead cycles between read/write transitions via internally synchronized output buffer enable and pipelined output registers that deliver data two clocks after address/control latching.

Burst operation is managed by an on-chip counter controlled by ADV/LD and LBO pins; linear or interleaved sequences are selected statically via LBO, while ADV/LD determines whether external address load or internal counter increment occurs on each rising clock edge. Chip select uses three enables (CE1, CE2, CE2) with dual-polarity logic for flexible depth expansion.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Organization256K × 36-bit (9.44 Mbit); supports high-bandwidth data paths in 36-bit wide systems
Max Clock Frequency150 MHz; enables 3.8 ns clock-to-data access for real-time packet buffering
Supply VoltagesVDD = 3.3 V ±5% (core), VDDQ = 3.3 V ±5% (I/O); decoupling required per JEDEC TQFP layout guidelines
Operating Temperature–40°C to +85°C; qualified for industrial-grade deployment without thermal throttling
ZBT™ FeatureNo dead cycles between read/write transitions; eliminates bus turnaround latency in burst-intensive applications
Burst Capability4-word linear or interleaved burst; reduces address setup overhead in sequential memory access patterns
Power-Down ModeAsynchronous ZZ input gates internal clock and reduces power consumption while retaining data

Pinout & Package

Packaged in JEDEC-standard 100-pin plastic thin quad flatpack (TQFP), 14 mm × 20 mm body size, lead pitch 0.5 mm. Pin 1 marked via corner notch or dot; pins 14, 16, and 66 are VDD-tolerant (≥ VIH acceptable).

Pin/TerminalCircuit RoleDesign Meaning
A0–A17Address InputsSynchronous 18-bit address bus; latched on rising CLK edge when ADV/LD = LOW and chip enabled
CLKSystem Clock InputPositive-edge-triggered master timing reference; all synchronous operations referenced to this edge
R/WRead/Write ControlSynchronous signal defining cycle type; determines data direction two clocks later
ADV/LDBurst Counter ControlLoads new external address (LOW) or increments internal burst counter (HIGH); defines burst sequence start point
LBOBurst Order SelectStatic input selecting linear (LOW) or interleaved (HIGH) 4-word burst addressing pattern
BW1–BW4Byte Write EnablesActive-low synchronous controls for 9-bit bytes; allows partial-word writes without read-modify-write
CE1, CE2, CE2Chip Enable InputsThree enables with mixed polarity (CE2 active-high); enable/disable device for depth expansion or bank selection
I/O0–I/O31, I/OP1–I/OP4Data I/O Bus36-bit bidirectional synchronous data path; registered input/output with pipelined timing
ZZAsynchronous Sleep ModeGates internal clock and reduces dynamic power; retains memory contents during low-power standby

Key Features

FeatureDesign Value
ZBTTM ArchitectureEliminates bus turnaround dead cycles between reads and writes, enabling continuous 150 MHz throughput in burst-mode traffic
Pipelined Output RegistersDelivers data two clocks after address/control latch, enabling full-speed operation without wait states in pipelined systems
Individual Byte Write ControlFour independent BWx signals allow selective 9-bit writes-critical for protocol header updates without corrupting adjacent fields
On-Chip Burst CounterReduces external address generation burden; supports deterministic linear/interleaved sequences for cache-line-aligned access
Three-Chip-Enable LogicEnables seamless depth expansion across multiple devices using CE1/CE2 (active-low) and CE2 (active-high)

Applications

Network Packet BufferingTelecom Line Card Memory

Use Scenario: High-speed packet buffering in Layer 2/3 switches where back-to-back read/write bursts occur during flow control and queue management.

IC Role / Device Role / Timing Role: Primary ZBT™ SRAM providing zero-turnaround 36-bit-wide data path between ingress/egress engines and scheduler logic.

Use Value: 150 MHz sustained bandwidth and pipelined outputs eliminate pipeline stalls, increasing switch fabric utilization by >12% vs. standard SSRAMs.

Use Scenario: Frame assembly/disassembly in telecom line cards handling TDM-over-packet or CPRI interfaces with strict jitter and latency budgets.

IC Role / Device Role / Timing Role: Synchronous burst memory staging payload data between framer ASICs and SerDes PHYs with deterministic 4-word burst alignment.

Use Value: Linear burst mode matches SONET/SDH frame boundaries; industrial temp rating ensures reliability in uncooled chassis environments.

Industrial PLC Data LoggingMedical Imaging FIFO

Use Scenario: Real-time acquisition and timestamped storage of sensor data streams in programmable logic controllers deployed in factory automation.

IC Role / Device Role / Timing Role: High-reliability SRAM acting as dual-port-accessible buffer between ADC controller and ARM-based host processor.

Use Value: –40°C to +85°C operation and ZZ sleep mode extend system uptime in thermally variable enclosures while reducing power draw during idle intervals.

Use Scenario: Pixel data buffering in portable ultrasound or digital X-ray systems requiring lossless real-time image streaming at >100 MB/s.

IC Role / Device Role / Timing Role: Pipelined ZBT™ SRAM serving as high-speed FIFO between image sensor interface and JPEG compression engine.

Use Value: 3.8 ns clock-to-data access and burst capability sustain pixel clock rates up to 150 MHz without frame drop or buffer overflow.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CY7C1362BV33-167AXC167 MHz max clock; 256K × 36 organization; same TQFP-100 package but different pinout (no CE2 active-high)Higher speed but lacks ZBTTM architecture - requires external OE control and incurs bus turnaround penaltySelect only if absolute maximum frequency outweighs ZBT™ latency benefits and board layout permits pinout redesign
AS7C3256A-15JC15 ns async access; 32K × 8 organization; no burst counter, no ZBT™, no pipelined outputsLegacy asynchronous SRAM - suitable only for non-burst, low-frequency control-plane memory with relaxed timingNot recommended for 71V65603S150BQI replacement; use only in brownfield designs lacking ZBT™ requirements

Compared with CY7C1362BV33-167AXC and AS7C3256A-15JC, the 71V65603S150BQI uniquely delivers zero bus turnaround, pipelined burst outputs, and industrial temperature support in a single 100-pin TQFP package - making it irreplaceable for high-throughput, low-latency data buffering where deterministic timing is mandatory.

Availability

71V65603S150BQI is available at Aetrix Electronics and suitable for network packet buffering, telecom line card memory, industrial PLC data logging, and medical imaging FIFO applications requiring stable component supply, long-term lifecycle assurance, and industrial-grade temperature performance.

Supply support for 71V65603S150BQI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and memory solutions for automotive, industrial, and infrastructure markets.

The 71V65603S150BQI belongs to Renesas' ZBT™ synchronous SRAM product line, engineered specifically for high-speed, low-latency data buffering in networking, telecommunications, and real-time embedded systems demanding deterministic burst access and zero bus turnaround.

FAQ

What is the memory organization and total capacity of the 71V65603S150BQI?

The 71V65603S150BQI is organized as 256K × 36 bits, delivering a total capacity of 9,437,184 bits (9.44 Mbit). This configuration supports 36-bit-wide data buses commonly used in high-performance packet processing and telecom applications. The part is pin-compatible with the 512K × 18 variant (71V65803) in shared package footprints, enabling flexible density scaling.

Does the 71V65603S150BQI support both linear and interleaved burst modes?

Yes, the 71V65603S150BQI supports both linear and interleaved 4-word burst sequences. The LBO (Linear Burst Order) pin selects the mode: LBO = LOW enables linear addressing (A0, A1, A2, A3), while LBO = HIGH enables interleaved order (A0, A1, A2+1, A3+1). This flexibility allows alignment with cache-line structures or legacy memory controller expectations without firmware changes.

How does the ZBTTM feature eliminate dead cycles in the 71V65603S150BQI?

The ZBTTM (Zero Bus Turnaround) feature in the 71V65603S150BQI removes dead cycles by synchronizing output buffer enable internally - eliminating the need for external OE control. Combined with pipelined registers and burst counter logic, it allows immediate transition from write to read (or vice versa) within the same clock domain, sustaining 150 MHz throughput without bus idle periods required by conventional SSRAMs.

What are the voltage and temperature specifications for the 71V65603S150BQI?

The 71V65603S150BQI operates with VDD = 3.3 V ±5% (core) and VDDQ = 3.3 V ±5% (I/O), and is rated for industrial temperature range of –40°C to +85°C. These specs ensure reliable operation in thermally demanding environments such as uncooled telecom chassis or factory-floor PLCs, with no derating required across the full range.

Can the 71V65603S150BQI be used in depth-expanded memory configurations?

Yes, the 71V65603S150BQI supports depth expansion using three chip enable inputs: CE1 and CE2 (active-low) and CE2 (active-high). This mixed-polarity enable scheme allows cascading multiple devices without additional logic, simplifying design of wider or deeper memory subsystems while maintaining full ZBT™ timing integrity across all devices.

71V65603S150BQI Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Series:
-
Package/Case:
165-TBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Synchronous, SDR (ZBT)
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
150 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.8 ns
Voltage - Supply:
3.135V ~ 3.465V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
165-CABGA (13x15)

71V65603S150BQI FAQ

1.How can I place an order for 71V65603S150BQI through Aetrix?

Please submit a Request for Quotation (RFQ) for 71V65603S150BQI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for 71V65603S150BQI reliable?

The price and inventory of 71V65603S150BQI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for 71V65603S150BQI is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for 71V65603S150BQI transactions.

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71V65603S150BQI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your 71V65603S150BQI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for 71V65603S150BQI?

For technical support, including 71V65603S150BQI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your 71V65603S150BQI requirements.

6.How does Aetrix verify that 71V65603S150BQI is sourced from the original manufacturer or authorized distributors?

All 71V65603S150BQI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that 71V65603S150BQI meets industry standards.

7.What is the process for return or replacement of 71V65603S150BQI?

All 71V65603S150BQI units undergo pre-shipment inspection (PSI). If there is an issue with 71V65603S150BQI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The 71V65603S150BQI part is unused and in its original packaging.

Return procedure for 71V65603S150BQI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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